TWI845542B - 異物檢查裝置、曝光裝置及物品製造方法 - Google Patents

異物檢查裝置、曝光裝置及物品製造方法 Download PDF

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Publication number
TWI845542B
TWI845542B TW108130577A TW108130577A TWI845542B TW I845542 B TWI845542 B TW I845542B TW 108130577 A TW108130577 A TW 108130577A TW 108130577 A TW108130577 A TW 108130577A TW I845542 B TWI845542 B TW I845542B
Authority
TW
Taiwan
Prior art keywords
light
unit
aforementioned
mask
foreign body
Prior art date
Application number
TW108130577A
Other languages
English (en)
Chinese (zh)
Other versions
TW202012917A (zh
Inventor
前田浩平
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW202012917A publication Critical patent/TW202012917A/zh
Application granted granted Critical
Publication of TWI845542B publication Critical patent/TWI845542B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW108130577A 2018-09-21 2019-08-27 異物檢查裝置、曝光裝置及物品製造方法 TWI845542B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018178081A JP7292842B2 (ja) 2018-09-21 2018-09-21 異物検査装置、露光装置、および物品製造方法
JP2018-178081 2018-09-21

Publications (2)

Publication Number Publication Date
TW202012917A TW202012917A (zh) 2020-04-01
TWI845542B true TWI845542B (zh) 2024-06-21

Family

ID=69905842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108130577A TWI845542B (zh) 2018-09-21 2019-08-27 異物檢查裝置、曝光裝置及物品製造方法

Country Status (4)

Country Link
JP (1) JP7292842B2 (enrdf_load_stackoverflow)
KR (1) KR102582877B1 (enrdf_load_stackoverflow)
CN (1) CN110941138B (enrdf_load_stackoverflow)
TW (1) TWI845542B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116209956A (zh) * 2020-07-30 2023-06-02 Asml控股股份有限公司 用于改善粒子检查系统的生产量的双扫描光学机械配置
JP2023071041A (ja) * 2021-11-10 2023-05-22 キヤノン株式会社 異物検査装置、露光装置、及び物品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
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TW571090B (en) * 2001-12-04 2004-01-11 Topcon Kabushiki Kaisha Surface inspection system
CN101275920A (zh) * 2007-03-30 2008-10-01 Hoya株式会社 图案缺陷检查方法、光掩模制造方法以及图案转印方法
CN102543789A (zh) * 2010-12-01 2012-07-04 株式会社日立高新技术 基板的品质评价方法及其装置
JP2016125968A (ja) * 2015-01-07 2016-07-11 旭硝子株式会社 検査装置および検査方法
JP2016133357A (ja) * 2015-01-16 2016-07-25 キヤノン株式会社 異物検査装置、露光装置及びデバイス製造方法

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JPH06235624A (ja) * 1992-12-15 1994-08-23 Hitachi Ltd 透明シートの検査方法とその装置
JPH06288902A (ja) * 1993-03-31 1994-10-18 Sony Corp 減衰全反射型薄膜評価装置
JPH0815169A (ja) * 1994-06-28 1996-01-19 Canon Inc 異物検査装置及びそれを用いた半導体デバイスの製造 方法
JP4217692B2 (ja) * 2005-04-20 2009-02-04 キヤノン株式会社 異物検査装置及び異物検査方法、露光装置、並びにデバイス製造方法
JP4996116B2 (ja) * 2006-03-20 2012-08-08 株式会社堀場製作所 欠陥検査装置
JP5078583B2 (ja) * 2007-12-10 2012-11-21 インターナショナル・ビジネス・マシーンズ・コーポレーション マクロ検査装置、マクロ検査方法
JP2011174817A (ja) * 2010-02-24 2011-09-08 Canon Inc 異物検査装置、露光装置及びデバイス製造方法
JP5506555B2 (ja) * 2010-06-11 2014-05-28 キヤノン株式会社 異物検査装置、それを用いた露光装置及びデバイスの製造方法
JP5520737B2 (ja) 2010-07-30 2014-06-11 株式会社日立ハイテクノロジーズ 欠陥検査装置および欠陥検査方法
JP5824780B2 (ja) * 2011-11-30 2015-12-02 株式会社ブイ・テクノロジー 透明膜検査装置及び検査方法
JP5820735B2 (ja) * 2012-01-27 2015-11-24 昭和電工株式会社 表面検査方法及び表面検査装置
JP5647716B2 (ja) * 2013-07-24 2015-01-07 株式会社リューズ 微小凹凸欠陥検査機用の簡易テレセントリックレンズ装置
JP2016057180A (ja) * 2014-09-10 2016-04-21 東レエンジニアリング株式会社 基板検査装置
JP7170491B2 (ja) * 2018-10-12 2022-11-14 キヤノン株式会社 異物検出装置、露光装置及び物品の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW571090B (en) * 2001-12-04 2004-01-11 Topcon Kabushiki Kaisha Surface inspection system
CN101275920A (zh) * 2007-03-30 2008-10-01 Hoya株式会社 图案缺陷检查方法、光掩模制造方法以及图案转印方法
CN102543789A (zh) * 2010-12-01 2012-07-04 株式会社日立高新技术 基板的品质评价方法及其装置
JP2016125968A (ja) * 2015-01-07 2016-07-11 旭硝子株式会社 検査装置および検査方法
JP2016133357A (ja) * 2015-01-16 2016-07-25 キヤノン株式会社 異物検査装置、露光装置及びデバイス製造方法

Also Published As

Publication number Publication date
CN110941138B (zh) 2023-12-08
JP2020051759A (ja) 2020-04-02
TW202012917A (zh) 2020-04-01
CN110941138A (zh) 2020-03-31
JP7292842B2 (ja) 2023-06-19
KR102582877B1 (ko) 2023-09-27
KR20200034601A (ko) 2020-03-31

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