TWI844724B - 聚烯烴系黏接劑組成物 - Google Patents

聚烯烴系黏接劑組成物 Download PDF

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Publication number
TWI844724B
TWI844724B TW109130138A TW109130138A TWI844724B TW I844724 B TWI844724 B TW I844724B TW 109130138 A TW109130138 A TW 109130138A TW 109130138 A TW109130138 A TW 109130138A TW I844724 B TWI844724 B TW I844724B
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TW
Taiwan
Prior art keywords
acid
adhesive composition
mass
epoxy resin
group
Prior art date
Application number
TW109130138A
Other languages
English (en)
Chinese (zh)
Other versions
TW202116959A (zh
Inventor
薗田遼
川楠哲生
小栁英之
入澤隼人
岡野祥平
Original Assignee
日商東洋紡Ｍｃ股份有限公司
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Application filed by 日商東洋紡Ｍｃ股份有限公司 filed Critical 日商東洋紡Ｍｃ股份有限公司
Publication of TW202116959A publication Critical patent/TW202116959A/zh
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Publication of TWI844724B publication Critical patent/TWI844724B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW109130138A 2019-09-06 2020-09-03 聚烯烴系黏接劑組成物 TWI844724B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2019-162725 2019-09-06
JP2019162725 2019-09-06
JP2019171596 2019-09-20
JP2019171597 2019-09-20
JP2019-171597 2019-09-20
JP2019-171596 2019-09-20

Publications (2)

Publication Number Publication Date
TW202116959A TW202116959A (zh) 2021-05-01
TWI844724B true TWI844724B (zh) 2024-06-11

Family

ID=74853225

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109130138A TWI844724B (zh) 2019-09-06 2020-09-03 聚烯烴系黏接劑組成物

Country Status (5)

Country Link
JP (1) JP7707914B2 (https=)
KR (1) KR20220057549A (https=)
CN (1) CN114207068B (https=)
TW (1) TWI844724B (https=)
WO (1) WO2021045125A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022210672A1 (https=) * 2021-03-30 2022-10-06
JPWO2022210673A1 (https=) * 2021-03-30 2022-10-06
TW202248387A (zh) * 2021-03-30 2022-12-16 日商琳得科股份有限公司 硬化性接著劑組成物、以及硬化物
WO2025105259A1 (ja) * 2023-11-16 2025-05-22 東洋紡エムシー株式会社 ポリオレフィン系接着剤組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015190411A1 (ja) * 2014-06-11 2015-12-17 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2016185956A1 (ja) * 2015-05-15 2016-11-24 東洋紡株式会社 低誘電接着剤層を含有する積層体
US20170297302A1 (en) * 2014-09-24 2017-10-19 Toagosei Co., Ltd. Adhesive composition and laminate with adhesive layer using same
WO2018221037A1 (ja) * 2017-05-29 2018-12-06 東洋紡株式会社 ポリオレフィン系接着剤組成物

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3776381B2 (ja) * 2001-06-19 2006-05-17 日本ポリオレフィン株式会社 接着性樹脂組成物及びそれを用いた多層積層構造体
JP4675425B2 (ja) * 2007-03-30 2011-04-20 株式会社クラレ 接着性樹脂組成物およびそれを用いた積層体
JP5741937B2 (ja) * 2011-06-20 2015-07-01 Dic株式会社 カルボン酸変性ポリオレフィン樹脂組成物、接着剤及び成形材料
JP5943461B2 (ja) * 2012-02-21 2016-07-05 株式会社Adeka ポリイミド用絶縁接着剤
JP6077338B2 (ja) * 2012-07-04 2017-02-08 三洋化成工業株式会社 ホットメルト接着剤
WO2015046378A1 (ja) 2013-09-27 2015-04-02 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性複合部材
JP6645431B2 (ja) * 2014-08-27 2020-02-14 東洋紡株式会社 低誘電接着剤組成物
JP6724916B2 (ja) * 2015-07-03 2020-07-15 東洋紡株式会社 ポリオレフィン系自動車構造パネル用接着剤組成物
JP6074698B1 (ja) * 2015-07-31 2017-02-08 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP6829200B2 (ja) * 2015-08-25 2021-02-10 三井金属鉱業株式会社 樹脂層付金属箔、金属張積層板、及びプリント配線板の製造方法
JP6143147B1 (ja) * 2015-08-28 2017-06-07 Dic株式会社 ラミネート用接着剤、多層フィルム、及びこれを用いた二次電池
CN109476124B (zh) * 2016-08-09 2021-06-22 东洋纺株式会社 含有低介电粘合剂层的层叠体
CN109563385B (zh) * 2016-08-10 2021-06-11 东洋纺株式会社 聚烯烃系粘合剂组合物
WO2018030050A1 (ja) * 2016-08-10 2018-02-15 東洋紡株式会社 ポリオレフィン系接着剤組成物
JP2018027673A (ja) * 2016-08-19 2018-02-22 日本合成化学工業株式会社 樹脂組成物およびそれを用いた多層構造体並びにその製造方法
JP6907927B2 (ja) * 2017-01-11 2021-07-21 東洋インキＳｃホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
JP2018126947A (ja) * 2017-02-09 2018-08-16 ユニチカ株式会社 積層体
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
KR20190127501A (ko) 2018-05-04 2019-11-13 남대현 손전등의 기능을 내포한 충전형 탈부착식 스탠드
TWI835903B (zh) * 2018-10-29 2024-03-21 日商東亞合成股份有限公司 黏著劑組成物及使用了該黏著劑組成物之熱熔接性構件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015190411A1 (ja) * 2014-06-11 2015-12-17 東洋紡株式会社 ポリオレフィン系接着剤組成物
US20170297302A1 (en) * 2014-09-24 2017-10-19 Toagosei Co., Ltd. Adhesive composition and laminate with adhesive layer using same
WO2016185956A1 (ja) * 2015-05-15 2016-11-24 東洋紡株式会社 低誘電接着剤層を含有する積層体
WO2018221037A1 (ja) * 2017-05-29 2018-12-06 東洋紡株式会社 ポリオレフィン系接着剤組成物

Also Published As

Publication number Publication date
WO2021045125A1 (ja) 2021-03-11
CN114207068B (zh) 2024-04-02
CN114207068A (zh) 2022-03-18
KR20220057549A (ko) 2022-05-09
JPWO2021045125A1 (https=) 2021-03-11
JP7707914B2 (ja) 2025-07-15
TW202116959A (zh) 2021-05-01

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