KR20220057549A - 폴리올레핀계 접착제 조성물 - Google Patents

폴리올레핀계 접착제 조성물 Download PDF

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Publication number
KR20220057549A
KR20220057549A KR1020227008542A KR20227008542A KR20220057549A KR 20220057549 A KR20220057549 A KR 20220057549A KR 1020227008542 A KR1020227008542 A KR 1020227008542A KR 20227008542 A KR20227008542 A KR 20227008542A KR 20220057549 A KR20220057549 A KR 20220057549A
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KR
South Korea
Prior art keywords
group
acid
adhesive composition
epoxy resin
preferable
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Pending
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KR1020227008542A
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English (en)
Korean (ko)
Inventor
료 소노다
데츠오 가와쿠스
히데유키 고야나기
하야토 이리사와
쇼헤이 오카노
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도요보 가부시키가이샤
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Publication of KR20220057549A publication Critical patent/KR20220057549A/ko
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00Layered products comprising a layer of paper or cardboard
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020227008542A 2019-09-06 2020-09-02 폴리올레핀계 접착제 조성물 Pending KR20220057549A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019162725 2019-09-06
JPJP-P-2019-162725 2019-09-06
JPJP-P-2019-171596 2019-09-20
JP2019171596 2019-09-20
JP2019171597 2019-09-20
JPJP-P-2019-171597 2019-09-20
PCT/JP2020/033325 WO2021045125A1 (ja) 2019-09-06 2020-09-02 ポリオレフィン系接着剤組成物

Publications (1)

Publication Number Publication Date
KR20220057549A true KR20220057549A (ko) 2022-05-09

Family

ID=74853225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227008542A Pending KR20220057549A (ko) 2019-09-06 2020-09-02 폴리올레핀계 접착제 조성물

Country Status (5)

Country Link
JP (1) JP7707914B2 (https=)
KR (1) KR20220057549A (https=)
CN (1) CN114207068B (https=)
TW (1) TWI844724B (https=)
WO (1) WO2021045125A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022210672A1 (https=) * 2021-03-30 2022-10-06
JPWO2022210673A1 (https=) * 2021-03-30 2022-10-06
TW202248387A (zh) * 2021-03-30 2022-12-16 日商琳得科股份有限公司 硬化性接著劑組成物、以及硬化物
WO2025105259A1 (ja) * 2023-11-16 2025-05-22 東洋紡エムシー株式会社 ポリオレフィン系接着剤組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015046378A1 (ja) 2013-09-27 2015-04-02 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性複合部材
WO2016047289A1 (ja) 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
KR20190127501A (ko) 2018-05-04 2019-11-13 남대현 손전등의 기능을 내포한 충전형 탈부착식 스탠드

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JP4675425B2 (ja) * 2007-03-30 2011-04-20 株式会社クラレ 接着性樹脂組成物およびそれを用いた積層体
JP5741937B2 (ja) * 2011-06-20 2015-07-01 Dic株式会社 カルボン酸変性ポリオレフィン樹脂組成物、接着剤及び成形材料
JP5943461B2 (ja) * 2012-02-21 2016-07-05 株式会社Adeka ポリイミド用絶縁接着剤
JP6077338B2 (ja) * 2012-07-04 2017-02-08 三洋化成工業株式会社 ホットメルト接着剤
CN106459703B (zh) * 2014-06-11 2018-09-25 东洋纺株式会社 聚烯烃类粘合剂组合物
JP6645431B2 (ja) * 2014-08-27 2020-02-14 東洋紡株式会社 低誘電接着剤組成物
CN107109182B (zh) * 2015-05-15 2019-06-07 东洋纺株式会社 含有低介电粘合剂层的层叠体
JP6724916B2 (ja) * 2015-07-03 2020-07-15 東洋紡株式会社 ポリオレフィン系自動車構造パネル用接着剤組成物
JP6074698B1 (ja) * 2015-07-31 2017-02-08 東洋インキScホールディングス株式会社 熱硬化性接着シート、およびその利用
JP6829200B2 (ja) * 2015-08-25 2021-02-10 三井金属鉱業株式会社 樹脂層付金属箔、金属張積層板、及びプリント配線板の製造方法
JP6143147B1 (ja) * 2015-08-28 2017-06-07 Dic株式会社 ラミネート用接着剤、多層フィルム、及びこれを用いた二次電池
CN109476124B (zh) * 2016-08-09 2021-06-22 东洋纺株式会社 含有低介电粘合剂层的层叠体
CN109563385B (zh) * 2016-08-10 2021-06-11 东洋纺株式会社 聚烯烃系粘合剂组合物
WO2018030050A1 (ja) * 2016-08-10 2018-02-15 東洋紡株式会社 ポリオレフィン系接着剤組成物
JP2018027673A (ja) * 2016-08-19 2018-02-22 日本合成化学工業株式会社 樹脂組成物およびそれを用いた多層構造体並びにその製造方法
JP6907927B2 (ja) * 2017-01-11 2021-07-21 東洋インキScホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
JP2018126947A (ja) * 2017-02-09 2018-08-16 ユニチカ株式会社 積層体
WO2018221037A1 (ja) * 2017-05-29 2018-12-06 東洋紡株式会社 ポリオレフィン系接着剤組成物
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
TWI835903B (zh) * 2018-10-29 2024-03-21 日商東亞合成股份有限公司 黏著劑組成物及使用了該黏著劑組成物之熱熔接性構件

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Publication number Priority date Publication date Assignee Title
WO2015046378A1 (ja) 2013-09-27 2015-04-02 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性複合部材
WO2016047289A1 (ja) 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
KR20190127501A (ko) 2018-05-04 2019-11-13 남대현 손전등의 기능을 내포한 충전형 탈부착식 스탠드

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WO2021045125A1 (ja) 2021-03-11
CN114207068B (zh) 2024-04-02
TWI844724B (zh) 2024-06-11
CN114207068A (zh) 2022-03-18
JPWO2021045125A1 (https=) 2021-03-11
JP7707914B2 (ja) 2025-07-15
TW202116959A (zh) 2021-05-01

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