JPWO2021045125A1 - - Google Patents

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Publication number
JPWO2021045125A1
JPWO2021045125A1 JP2021544010A JP2021544010A JPWO2021045125A1 JP WO2021045125 A1 JPWO2021045125 A1 JP WO2021045125A1 JP 2021544010 A JP2021544010 A JP 2021544010A JP 2021544010 A JP2021544010 A JP 2021544010A JP WO2021045125 A1 JPWO2021045125 A1 JP WO2021045125A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021544010A
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Japanese (ja)
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JP7707914B2 (ja
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Publication of JPWO2021045125A1 publication Critical patent/JPWO2021045125A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2021544010A 2019-09-06 2020-09-02 ポリオレフィン系接着剤組成物 Active JP7707914B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019162725 2019-09-06
JP2019162725 2019-09-06
JP2019171596 2019-09-20
JP2019171597 2019-09-20
JP2019171596 2019-09-20
JP2019171597 2019-09-20
PCT/JP2020/033325 WO2021045125A1 (ja) 2019-09-06 2020-09-02 ポリオレフィン系接着剤組成物

Publications (2)

Publication Number Publication Date
JPWO2021045125A1 true JPWO2021045125A1 (https=) 2021-03-11
JP7707914B2 JP7707914B2 (ja) 2025-07-15

Family

ID=74853225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021544010A Active JP7707914B2 (ja) 2019-09-06 2020-09-02 ポリオレフィン系接着剤組成物

Country Status (5)

Country Link
JP (1) JP7707914B2 (https=)
KR (1) KR20220057549A (https=)
CN (1) CN114207068B (https=)
TW (1) TWI844724B (https=)
WO (1) WO2021045125A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022210672A1 (https=) * 2021-03-30 2022-10-06
JPWO2022210673A1 (https=) * 2021-03-30 2022-10-06
TW202248387A (zh) * 2021-03-30 2022-12-16 日商琳得科股份有限公司 硬化性接著劑組成物、以及硬化物
WO2025105259A1 (ja) * 2023-11-16 2025-05-22 東洋紡エムシー株式会社 ポリオレフィン系接着剤組成物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003073506A (ja) * 2001-06-19 2003-03-12 Japan Polyolefins Co Ltd 接着性樹脂組成物及びそれを用いた多層積層構造体
JP2013170214A (ja) * 2012-02-21 2013-09-02 Adeka Corp エポキシ樹脂組成物及びポリイミド用絶縁接着剤
WO2015190411A1 (ja) * 2014-06-11 2015-12-17 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2016031342A1 (ja) * 2014-08-27 2016-03-03 東洋紡株式会社 低誘電接着剤組成物
WO2016047289A1 (ja) * 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
WO2016185956A1 (ja) * 2015-05-15 2016-11-24 東洋紡株式会社 低誘電接着剤層を含有する積層体
WO2017033784A1 (ja) * 2015-08-25 2017-03-02 三井金属鉱業株式会社 樹脂層付金属箔、金属張積層板、及びプリント配線板の製造方法
WO2018221037A1 (ja) * 2017-05-29 2018-12-06 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2020090818A1 (ja) * 2018-10-29 2020-05-07 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性部材

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4675425B2 (ja) * 2007-03-30 2011-04-20 株式会社クラレ 接着性樹脂組成物およびそれを用いた積層体
JP5741937B2 (ja) * 2011-06-20 2015-07-01 Dic株式会社 カルボン酸変性ポリオレフィン樹脂組成物、接着剤及び成形材料
JP6077338B2 (ja) * 2012-07-04 2017-02-08 三洋化成工業株式会社 ホットメルト接着剤
WO2015046378A1 (ja) 2013-09-27 2015-04-02 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性複合部材
JP6724916B2 (ja) * 2015-07-03 2020-07-15 東洋紡株式会社 ポリオレフィン系自動車構造パネル用接着剤組成物
JP6074698B1 (ja) * 2015-07-31 2017-02-08 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP6143147B1 (ja) * 2015-08-28 2017-06-07 Dic株式会社 ラミネート用接着剤、多層フィルム、及びこれを用いた二次電池
CN109476124B (zh) * 2016-08-09 2021-06-22 东洋纺株式会社 含有低介电粘合剂层的层叠体
CN109563385B (zh) * 2016-08-10 2021-06-11 东洋纺株式会社 聚烯烃系粘合剂组合物
WO2018030050A1 (ja) * 2016-08-10 2018-02-15 東洋紡株式会社 ポリオレフィン系接着剤組成物
JP2018027673A (ja) * 2016-08-19 2018-02-22 日本合成化学工業株式会社 樹脂組成物およびそれを用いた多層構造体並びにその製造方法
JP6907927B2 (ja) * 2017-01-11 2021-07-21 東洋インキＳｃホールディングス株式会社 接着剤組成物、積層体、蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイス
JP2018126947A (ja) * 2017-02-09 2018-08-16 ユニチカ株式会社 積層体
JP2019127501A (ja) * 2018-01-22 2019-08-01 藤森工業株式会社 熱硬化性接着剤組成物、接着フィルム、カバーレイフィルム及びフレキシブルプリント配線板
KR20190127501A (ko) 2018-05-04 2019-11-13 남대현 손전등의 기능을 내포한 충전형 탈부착식 스탠드

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003073506A (ja) * 2001-06-19 2003-03-12 Japan Polyolefins Co Ltd 接着性樹脂組成物及びそれを用いた多層積層構造体
JP2013170214A (ja) * 2012-02-21 2013-09-02 Adeka Corp エポキシ樹脂組成物及びポリイミド用絶縁接着剤
WO2015190411A1 (ja) * 2014-06-11 2015-12-17 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2016031342A1 (ja) * 2014-08-27 2016-03-03 東洋紡株式会社 低誘電接着剤組成物
WO2016047289A1 (ja) * 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体
WO2016185956A1 (ja) * 2015-05-15 2016-11-24 東洋紡株式会社 低誘電接着剤層を含有する積層体
WO2017033784A1 (ja) * 2015-08-25 2017-03-02 三井金属鉱業株式会社 樹脂層付金属箔、金属張積層板、及びプリント配線板の製造方法
WO2018221037A1 (ja) * 2017-05-29 2018-12-06 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2020090818A1 (ja) * 2018-10-29 2020-05-07 東亞合成株式会社 接着剤組成物及びそれを用いた熱融着性部材

Also Published As

Publication number Publication date
WO2021045125A1 (ja) 2021-03-11
CN114207068B (zh) 2024-04-02
TWI844724B (zh) 2024-06-11
CN114207068A (zh) 2022-03-18
KR20220057549A (ko) 2022-05-09
JP7707914B2 (ja) 2025-07-15
TW202116959A (zh) 2021-05-01

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