TWI843797B - 環氧樹脂溶液 - Google Patents

環氧樹脂溶液 Download PDF

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Publication number
TWI843797B
TWI843797B TW109102064A TW109102064A TWI843797B TW I843797 B TWI843797 B TW I843797B TW 109102064 A TW109102064 A TW 109102064A TW 109102064 A TW109102064 A TW 109102064A TW I843797 B TWI843797 B TW I843797B
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TW
Taiwan
Prior art keywords
component
acid
epoxy resin
tricarboxylic acid
compound
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TW109102064A
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English (en)
Chinese (zh)
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TW202035503A (zh
Inventor
谷中愛歩
福林夢人
村上隆俊
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日商尤尼吉可股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/022—Polycondensates containing more than one epoxy group per molecule characterised by the preparation process or apparatus used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4238—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Indole Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
TW109102064A 2019-01-31 2020-01-21 環氧樹脂溶液 TWI843797B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-016291 2019-01-31
JP2019016291 2019-01-31
JP2019-108755 2019-06-11
JP2019108755 2019-06-11

Publications (2)

Publication Number Publication Date
TW202035503A TW202035503A (zh) 2020-10-01
TWI843797B true TWI843797B (zh) 2024-06-01

Family

ID=71842034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102064A TWI843797B (zh) 2019-01-31 2020-01-21 環氧樹脂溶液

Country Status (7)

Country Link
US (1) US11753500B2 (enExample)
EP (1) EP3919541B1 (enExample)
JP (1) JP7497852B2 (enExample)
KR (1) KR20210121012A (enExample)
CN (1) CN113396173B (enExample)
TW (1) TWI843797B (enExample)
WO (1) WO2020158493A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7308168B2 (ja) * 2019-04-16 2023-07-13 信越化学工業株式会社 有機膜形成用材料、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び有機膜形成用化合物
KR102698135B1 (ko) * 2019-12-10 2024-08-22 유니티카 가부시끼가이샤 이미드기 함유 화합물, 이미드기 함유 경화제, 및 에폭시 수지 경화물 및 그것을 이용한 전기절연성 재료
TWI809528B (zh) 2021-10-14 2023-07-21 財團法人工業技術研究院 組成物、封裝結構、與拆解封裝結構的方法
CN118159521A (zh) * 2021-10-25 2024-06-07 尤尼吉可株式会社 酰胺化合物及含有该酰胺化合物的固化性树脂组合物
KR20250138504A (ko) * 2024-03-13 2025-09-22 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229584A (ja) * 1985-07-31 1987-02-07 Sumitomo Chem Co Ltd 熱硬化可能なイミド化合物
JP2012006992A (ja) * 2010-06-22 2012-01-12 Jnc Corp インクジェット用インクおよびその用途
JP2013237844A (ja) * 2013-06-12 2013-11-28 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076869A (en) * 1970-10-23 1978-02-28 Ciba-Geigy Corporation Hardenable epoxy resin compositions and process for making the same
US4244857A (en) * 1979-08-30 1981-01-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Curing agent for polyepoxides and epoxy resins and composites cured therewith
JPS6077652A (ja) 1983-10-03 1985-05-02 Mitsubishi Electric Corp 回転電機の絶縁方法
JPS6112721A (ja) * 1984-06-29 1986-01-21 Mitsubishi Electric Corp 熱硬化性樹脂組成物
EP0214750B1 (en) 1985-07-31 1993-09-22 Sumitomo Chemical Company, Limited Use of imides hardeners for epoxy resins and epoxy resin compositions containing these imides.
JP2883670B2 (ja) * 1990-03-23 1999-04-19 三井化学株式会社 イミド環を有する新規ビスフェノール類およびその製造方法
US5709947A (en) * 1990-10-03 1998-01-20 Commonwealth Scientific And Industrial Research Organisation Epoxy resins based on diaminobisimide compounds
JPH04182466A (ja) * 1990-11-19 1992-06-30 Mitsubishi Gas Chem Co Inc ビストリメリティックイミド類の製造方法
JP3687178B2 (ja) 1996-04-01 2005-08-24 日立化成工業株式会社 芳香族ポリエステルイミド、その製造方法及びそれを含むワニス
JP4096210B2 (ja) * 1997-10-29 2008-06-04 日立化成工業株式会社 シロキサン含有ポリエステルイミド及びその製造方法並びにそれを含むワニス
JP4333858B2 (ja) 2000-06-19 2009-09-16 日本化薬株式会社 ポリカルボン酸樹脂及びそれを用いた光硬化型樹脂組成物並びにその硬化物
US7592067B2 (en) * 2003-09-22 2009-09-22 Hexion Specialty Chemicals, Inc. Epoxy resin compositions, processes utilizing same and articles made therefrom
JP5014587B2 (ja) * 2005-04-28 2012-08-29 株式会社カネカ 活性エステル化合物およびその利用
JP5672073B2 (ja) 2010-03-08 2015-02-18 三菱化学株式会社 エポキシ樹脂用硬化剤、硬化性樹脂組成物、およびその硬化物
JP5569216B2 (ja) * 2010-07-27 2014-08-13 Ｊｎｃ株式会社 熱硬化性組成物およびその用途
JP2012111930A (ja) 2010-11-01 2012-06-14 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、該熱硬化性樹脂組成物を用いたプリプレグ、積層板、及びプリント配線板
US11421107B2 (en) 2017-01-27 2022-08-23 Sekisui Chemical Co., Ltd. Curable resin composition, cured product, adhesive, bonding film, coverlay film, flexible copper-clad laminate and circuit board
WO2019188436A1 (ja) 2018-03-28 2019-10-03 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着フィルム、回路基板、層間絶縁材料、及び、プリント配線板
JP7305315B2 (ja) 2018-07-03 2023-07-10 積水化学工業株式会社 硬化性樹脂組成物、接着剤、接着フィルム、カバーレイフィルム、及び、フレキシブル銅張積層板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6229584A (ja) * 1985-07-31 1987-02-07 Sumitomo Chem Co Ltd 熱硬化可能なイミド化合物
JP2012006992A (ja) * 2010-06-22 2012-01-12 Jnc Corp インクジェット用インクおよびその用途
JP2013237844A (ja) * 2013-06-12 2013-11-28 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板

Also Published As

Publication number Publication date
KR20210121012A (ko) 2021-10-07
JP2020204014A (ja) 2020-12-24
EP3919541A4 (en) 2022-02-16
JP7497852B2 (ja) 2024-06-11
US20220106435A1 (en) 2022-04-07
CN113396173B (zh) 2023-09-12
US11753500B2 (en) 2023-09-12
EP3919541B1 (en) 2023-06-21
EP3919541A1 (en) 2021-12-08
CN113396173A (zh) 2021-09-14
WO2020158493A1 (ja) 2020-08-06
TW202035503A (zh) 2020-10-01

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