TWI841110B - 從高深寬比結構移除碎片 - Google Patents
從高深寬比結構移除碎片 Download PDFInfo
- Publication number
- TWI841110B TWI841110B TW111147463A TW111147463A TWI841110B TW I841110 B TWI841110 B TW I841110B TW 111147463 A TW111147463 A TW 111147463A TW 111147463 A TW111147463 A TW 111147463A TW I841110 B TWI841110 B TW I841110B
- Authority
- TW
- Taiwan
- Prior art keywords
- tip
- substrate
- debris
- energy
- collection
- Prior art date
Links
- 238000000034 method Methods 0.000 claims abstract description 138
- 239000000758 substrate Substances 0.000 claims description 199
- 239000002245 particle Substances 0.000 claims description 180
- 239000000463 material Substances 0.000 claims description 128
- 238000000576 coating method Methods 0.000 claims description 33
- 239000011248 coating agent Substances 0.000 claims description 31
- 239000012634 fragment Substances 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 23
- 239000012530 fluid Substances 0.000 claims description 18
- 238000001900 extreme ultraviolet lithography Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- 239000002121 nanofiber Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 7
- 238000004629 contact atomic force microscopy Methods 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 abstract description 55
- 230000008569 process Effects 0.000 abstract description 53
- 230000004044 response Effects 0.000 abstract description 26
- 230000000694 effects Effects 0.000 abstract description 17
- 239000000356 contaminant Substances 0.000 description 147
- 239000000523 sample Substances 0.000 description 114
- 238000005286 illumination Methods 0.000 description 100
- 238000004621 scanning probe microscopy Methods 0.000 description 88
- 239000002105 nanoparticle Substances 0.000 description 56
- 239000000835 fiber Substances 0.000 description 31
- 238000004140 cleaning Methods 0.000 description 26
- 230000005855 radiation Effects 0.000 description 24
- 230000003993 interaction Effects 0.000 description 19
- 239000000203 mixture Substances 0.000 description 19
- 238000012546 transfer Methods 0.000 description 19
- 238000001228 spectrum Methods 0.000 description 17
- 230000006399 behavior Effects 0.000 description 14
- 239000003153 chemical reaction reagent Substances 0.000 description 11
- 229910003460 diamond Inorganic materials 0.000 description 11
- 239000010432 diamond Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000002243 precursor Substances 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 238000011109 contamination Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 239000002086 nanomaterial Substances 0.000 description 9
- 108020004414 DNA Proteins 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000010894 electron beam technology Methods 0.000 description 8
- 108090000623 proteins and genes Proteins 0.000 description 8
- 102000004169 proteins and genes Human genes 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 238000005452 bending Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 description 7
- 230000008439 repair process Effects 0.000 description 7
- 239000007779 soft material Substances 0.000 description 7
- 238000013019 agitation Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 108010085238 Actins Proteins 0.000 description 5
- 102000007469 Actins Human genes 0.000 description 5
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000005672 electromagnetic field Effects 0.000 description 5
- 229920000831 ionic polymer Polymers 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 229920009441 perflouroethylene propylene Polymers 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 239000002041 carbon nanotube Substances 0.000 description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000007790 scraping Methods 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 238000013519 translation Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000004666 chemical force microscopy Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000002073 nanorod Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- YBJHBAHKTGYVGT-ZKWXMUAHSA-N (+)-Biotin Chemical compound N1C(=O)N[C@@H]2[C@H](CCCCC(=O)O)SC[C@@H]21 YBJHBAHKTGYVGT-ZKWXMUAHSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 102000053602 DNA Human genes 0.000 description 2
- WTDRDQBEARUVNC-UHFFFAOYSA-N L-Dopa Natural products OC(=O)C(N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-UHFFFAOYSA-N 0.000 description 2
- 108091028043 Nucleic acid sequence Proteins 0.000 description 2
- 101100460147 Sarcophaga bullata NEMS gene Proteins 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 150000001805 chlorine compounds Chemical class 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 150000002222 fluorine compounds Chemical class 0.000 description 2
- 238000013467 fragmentation Methods 0.000 description 2
- 238000006062 fragmentation reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000012886 linear function Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- QLOAVXSYZAJECW-UHFFFAOYSA-N methane;molecular fluorine Chemical compound C.FF QLOAVXSYZAJECW-UHFFFAOYSA-N 0.000 description 2
- 238000004651 near-field scanning optical microscopy Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012887 quadratic function Methods 0.000 description 2
- 238000004574 scanning tunneling microscopy Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- 230000005457 Black-body radiation Effects 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 241000345998 Calamus manan Species 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000195493 Cryptophyta Species 0.000 description 1
- WTDRDQBEARUVNC-LURJTMIESA-N L-DOPA Chemical compound OC(=O)[C@@H](N)CC1=CC=C(O)C(O)=C1 WTDRDQBEARUVNC-LURJTMIESA-N 0.000 description 1
- 241000242594 Platyhelminthes Species 0.000 description 1
- 206010041662 Splinter Diseases 0.000 description 1
- 108010090804 Streptavidin Proteins 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000005411 Van der Waals force Methods 0.000 description 1
- 108020005202 Viral DNA Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000010062 adhesion mechanism Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000003115 biocidal effect Effects 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 229960002685 biotin Drugs 0.000 description 1
- 235000020958 biotin Nutrition 0.000 description 1
- 239000011616 biotin Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000005591 charge neutralization Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 150000001923 cyclic compounds Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- MHUWZNTUIIFHAS-CLFAGFIQSA-N dioleoyl phosphatidic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(COP(O)(O)=O)OC(=O)CCCCCCC\C=C/CCCCCCCC MHUWZNTUIIFHAS-CLFAGFIQSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009510 drug design Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 210000003527 eukaryotic cell Anatomy 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000005184 irreversible process Methods 0.000 description 1
- 229960004502 levodopa Drugs 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005232 molecular self-assembly Methods 0.000 description 1
- 238000012900 molecular simulation Methods 0.000 description 1
- 239000002103 nanocoating Substances 0.000 description 1
- 239000002773 nucleotide Substances 0.000 description 1
- 125000003729 nucleotide group Chemical group 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 102000034272 protein filaments Human genes 0.000 description 1
- 108091005974 protein filaments Proteins 0.000 description 1
- 235000012950 rattan cane Nutrition 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000001338 self-assembly Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002109 single walled nanotube Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/652—Specific applications or type of materials impurities, foreign matter, trace amounts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
- G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/227—Measuring photoelectric effect, e.g. photoelectron emission microscopy [PEEM]
- G01N23/2273—Measuring photoelectron spectrum, e.g. electron spectroscopy for chemical analysis [ESCA] or X-ray photoelectron spectroscopy [XPS]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q20/00—Monitoring the movement or position of the probe
- G01Q20/02—Monitoring the movement or position of the probe by optical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
- G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
- G01Q60/38—Probes, their manufacture, or their related instrumentation, e.g. holders
- G01Q60/42—Functionalisation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
- G01Q70/08—Probe characteristics
- G01Q70/10—Shape or taper
- G01Q70/12—Nanotube tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
- G01Q80/00—Applications, other than SPM, of scanning-probe techniques
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Computer Networks & Wireless Communication (AREA)
- Optics & Photonics (AREA)
- Sampling And Sample Adjustment (AREA)
- Cleaning In General (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Filtering Materials (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/160,263 US10384238B2 (en) | 2007-09-17 | 2016-05-20 | Debris removal in high aspect structures |
| US15/160,263 | 2016-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202313219A TW202313219A (zh) | 2023-04-01 |
| TWI841110B true TWI841110B (zh) | 2024-05-01 |
Family
ID=58772394
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111147463A TWI841110B (zh) | 2016-05-20 | 2017-05-02 | 從高深寬比結構移除碎片 |
| TW106114454A TWI787181B (zh) | 2016-05-20 | 2017-05-02 | 從高深寬比結構移除碎片 |
| TW113113483A TWI892579B (zh) | 2016-05-20 | 2017-05-02 | 從高深寬比結構移除碎片 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106114454A TWI787181B (zh) | 2016-05-20 | 2017-05-02 | 從高深寬比結構移除碎片 |
| TW113113483A TWI892579B (zh) | 2016-05-20 | 2017-05-02 | 從高深寬比結構移除碎片 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3251760B1 (enExample) |
| JP (1) | JP7042039B2 (enExample) |
| KR (1) | KR102433627B1 (enExample) |
| TW (3) | TWI841110B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3964841A1 (de) | 2020-09-02 | 2022-03-09 | Siltronic AG | Messapparatur und verfahren zum untersuchen eines bereichs einer oberfläche eines substrats mit hilfe einer kraft-messsonde |
| DE102021201669B4 (de) * | 2021-02-22 | 2023-08-17 | Carl Zeiss Smt Gmbh | Verfahren und vorrichtung zum bearbeiten einer probe |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005084582A (ja) * | 2003-09-11 | 2005-03-31 | Sii Nanotechnology Inc | フォトマスクのパーティクル除去方法 |
| TW200924039A (en) * | 2007-09-17 | 2009-06-01 | Rave Llc | Debris removal in high aspect structures |
| JP2009265176A (ja) * | 2008-04-22 | 2009-11-12 | Toshiba Corp | 異物除去方法、異物除去装置および半導体装置の作製方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05164512A (ja) * | 1991-12-13 | 1993-06-29 | Toshiba Corp | 表面測定装置 |
| TW285721B (enExample) * | 1994-12-27 | 1996-09-11 | Siemens Ag | |
| CA2580115C (en) * | 2004-09-03 | 2011-04-05 | Honeywell International Inc. | Drawn gel-spun polyethylene yarns and process for drawing |
| JP2006339472A (ja) * | 2005-06-03 | 2006-12-14 | Matsushita Electric Ind Co Ltd | プローブカード触針のクリーニング装置およびクリーニング方法 |
| JP4820740B2 (ja) * | 2006-12-08 | 2011-11-24 | エスアイアイ・ナノテクノロジー株式会社 | 加工用ダイヤモンド探針の加工方法 |
| JP2008209544A (ja) * | 2007-02-26 | 2008-09-11 | Sii Nanotechnology Inc | フォトマスク上の異物の組成分析方法 |
| JP2009006378A (ja) * | 2007-06-29 | 2009-01-15 | Sii Nanotechnology Inc | 微細加工方法及び微細加工装置 |
| JP5031509B2 (ja) * | 2007-10-23 | 2012-09-19 | キヤノン株式会社 | 近接場光散乱用プローブおよびその製造方法 |
| JP2011133296A (ja) * | 2009-12-24 | 2011-07-07 | Yamaha Corp | クリーニング装置、及び、プローブ針のクリーニング方法 |
| CN102798735B (zh) * | 2012-08-14 | 2015-03-04 | 厦门大学 | 针尖增强暗场显微镜、电化学测试装置和调平系统 |
| JP6215677B2 (ja) * | 2013-12-05 | 2017-10-18 | 株式会社日立ハイテクマニファクチャ＆サービス | 顕微ラマン分光装置および顕微ラマン分光システム |
-
2017
- 2017-05-02 TW TW111147463A patent/TWI841110B/zh active
- 2017-05-02 TW TW106114454A patent/TWI787181B/zh active
- 2017-05-02 TW TW113113483A patent/TWI892579B/zh active
- 2017-05-18 KR KR1020170061709A patent/KR102433627B1/ko active Active
- 2017-05-22 EP EP17172132.7A patent/EP3251760B1/en active Active
- 2017-05-22 JP JP2017100801A patent/JP7042039B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005084582A (ja) * | 2003-09-11 | 2005-03-31 | Sii Nanotechnology Inc | フォトマスクのパーティクル除去方法 |
| TW200924039A (en) * | 2007-09-17 | 2009-06-01 | Rave Llc | Debris removal in high aspect structures |
| JP2009265176A (ja) * | 2008-04-22 | 2009-11-12 | Toshiba Corp | 異物除去方法、異物除去装置および半導体装置の作製方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202313219A (zh) | 2023-04-01 |
| TWI892579B (zh) | 2025-08-01 |
| TW202446498A (zh) | 2024-12-01 |
| JP2017207755A (ja) | 2017-11-24 |
| KR102433627B1 (ko) | 2022-08-18 |
| EP3251760A1 (en) | 2017-12-06 |
| TWI787181B (zh) | 2022-12-21 |
| JP7042039B2 (ja) | 2022-03-25 |
| TW201805078A (zh) | 2018-02-16 |
| KR20170131264A (ko) | 2017-11-29 |
| EP3251760B1 (en) | 2025-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11964310B2 (en) | Debris removal from high aspect structures | |
| US11391664B2 (en) | Debris removal from high aspect structures | |
| JP7727155B2 (ja) | 高アスペクト構造からのデブリ除去 | |
| US10618080B2 (en) | Debris removal from high aspect structures | |
| TWI841110B (zh) | 從高深寬比結構移除碎片 | |
| EP3748431B1 (en) | Debris removal from high aspect structures |