TWI836544B - 壓電振動器件及壓電振動器件的製造方法 - Google Patents
壓電振動器件及壓電振動器件的製造方法 Download PDFInfo
- Publication number
- TWI836544B TWI836544B TW111129580A TW111129580A TWI836544B TW I836544 B TWI836544 B TW I836544B TW 111129580 A TW111129580 A TW 111129580A TW 111129580 A TW111129580 A TW 111129580A TW I836544 B TWI836544 B TW I836544B
- Authority
- TW
- Taiwan
- Prior art keywords
- cover member
- holding member
- vibration device
- piezoelectric vibration
- sealing material
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 55
- 239000003566 sealing material Substances 0.000 claims abstract description 109
- 238000010438 heat treatment Methods 0.000 claims abstract description 72
- 230000008018 melting Effects 0.000 claims abstract description 24
- 238000002844 melting Methods 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 22
- 238000002360 preparation method Methods 0.000 claims abstract description 17
- 239000006023 eutectic alloy Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 9
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 8
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 8
- 239000000155 melt Substances 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 120
- 229910052742 iron Inorganic materials 0.000 description 60
- 238000005476 soldering Methods 0.000 description 59
- 239000000463 material Substances 0.000 description 33
- 238000001179 sorption measurement Methods 0.000 description 24
- 239000007789 gas Substances 0.000 description 22
- 229910000679 solder Inorganic materials 0.000 description 13
- 239000010453 quartz Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000005489 elastic deformation Effects 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021131778 | 2021-08-12 | ||
JP2021-131778 | 2021-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202315310A TW202315310A (zh) | 2023-04-01 |
TWI836544B true TWI836544B (zh) | 2024-03-21 |
Family
ID=85200469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111129580A TWI836544B (zh) | 2021-08-12 | 2022-08-05 | 壓電振動器件及壓電振動器件的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPWO2023017743A1 (ko) |
CN (1) | CN117280602A (ko) |
TW (1) | TWI836544B (ko) |
WO (1) | WO2023017743A1 (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7060520B2 (en) * | 2002-03-25 | 2006-06-13 | Seiko Epson Corporation | Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device |
TW201010272A (en) * | 2008-02-18 | 2010-03-01 | Seiko Instr Inc | Method for fabricating piezoeledctric vibrator, piezoeledctric vibrator, oscillator, electronic apparatus and radio-controlled clock |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049353A (ja) * | 2004-07-30 | 2006-02-16 | Kyocera Kinseki Corp | パッケージの製造方法 |
JP2011228352A (ja) * | 2010-04-15 | 2011-11-10 | Daishinku Corp | リッドおよびベースおよび電子部品用パッケージ |
JP5508192B2 (ja) * | 2010-08-24 | 2014-05-28 | 日本電波工業株式会社 | 圧電デバイスの製造方法及び圧電デバイス |
JP2014038970A (ja) * | 2012-08-18 | 2014-02-27 | Seiko Epson Corp | 電子デバイスの製造方法および電子デバイス |
JP2014072883A (ja) * | 2012-10-02 | 2014-04-21 | Nippon Dempa Kogyo Co Ltd | 圧電デバイス |
KR102460754B1 (ko) * | 2016-03-17 | 2022-10-31 | 삼성전기주식회사 | 소자 패키지 및 그 제조방법 |
-
2022
- 2022-07-28 CN CN202280031818.2A patent/CN117280602A/zh active Pending
- 2022-07-28 JP JP2023541403A patent/JPWO2023017743A1/ja active Pending
- 2022-07-28 WO PCT/JP2022/029159 patent/WO2023017743A1/ja active Application Filing
- 2022-08-05 TW TW111129580A patent/TWI836544B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7060520B2 (en) * | 2002-03-25 | 2006-06-13 | Seiko Epson Corporation | Piezoelectric device and cover sealing method and apparatus therefor, cellular phone apparatus using piezoelectric device and electronic apparatus using piezoelectric device |
CN100407469C (zh) * | 2002-03-25 | 2008-07-30 | 精工爱普生株式会社 | 压电器件的制造方法 |
TW201010272A (en) * | 2008-02-18 | 2010-03-01 | Seiko Instr Inc | Method for fabricating piezoeledctric vibrator, piezoeledctric vibrator, oscillator, electronic apparatus and radio-controlled clock |
Also Published As
Publication number | Publication date |
---|---|
JPWO2023017743A1 (ko) | 2023-02-16 |
TW202315310A (zh) | 2023-04-01 |
CN117280602A (zh) | 2023-12-22 |
WO2023017743A1 (ja) | 2023-02-16 |
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