TWI836369B - 焊劑及電子裝置之製造方法 - Google Patents

焊劑及電子裝置之製造方法 Download PDF

Info

Publication number
TWI836369B
TWI836369B TW111108824A TW111108824A TWI836369B TW I836369 B TWI836369 B TW I836369B TW 111108824 A TW111108824 A TW 111108824A TW 111108824 A TW111108824 A TW 111108824A TW I836369 B TWI836369 B TW I836369B
Authority
TW
Taiwan
Prior art keywords
flux
solder
acid
organic solvent
substrate
Prior art date
Application number
TW111108824A
Other languages
English (en)
Chinese (zh)
Other versions
TW202241626A (zh
Inventor
須川靖久
山裕之
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021201805A external-priority patent/JP7328311B2/ja
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202241626A publication Critical patent/TW202241626A/zh
Application granted granted Critical
Publication of TWI836369B publication Critical patent/TWI836369B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C22C11/06—Alloys based on lead with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW111108824A 2021-03-12 2022-03-10 焊劑及電子裝置之製造方法 TWI836369B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021-040415 2021-03-12
JP2021-040416 2021-03-12
JP2021040415 2021-03-12
JP2021040416 2021-03-12
JP2021201805A JP7328311B2 (ja) 2021-03-12 2021-12-13 フラックスおよび電子デバイスの製造方法
JP2021-201805 2021-12-13

Publications (2)

Publication Number Publication Date
TW202241626A TW202241626A (zh) 2022-11-01
TWI836369B true TWI836369B (zh) 2024-03-21

Family

ID=83226783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108824A TWI836369B (zh) 2021-03-12 2022-03-10 焊劑及電子裝置之製造方法

Country Status (4)

Country Link
JP (1) JP2022184949A (fr)
KR (1) KR102690728B1 (fr)
TW (1) TWI836369B (fr)
WO (1) WO2022191227A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JPH08213746A (ja) * 1995-02-03 1996-08-20 Sony Corp フラツクス
TW299265B (fr) * 1995-06-19 1997-03-01 Chisumi Kinzoku Kogyo Kk
JP2001284787A (ja) * 2001-01-25 2001-10-12 Matsushita Electric Ind Co Ltd 半田ボールの搭載用フラックス
JP2016093816A (ja) * 2014-11-12 2016-05-26 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP2017035731A (ja) * 2015-08-10 2017-02-16 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051668A (ja) 2001-08-06 2003-02-21 Tdk Corp 電子部品の製造方法と製造装置
EP2221140B1 (fr) * 2007-11-27 2013-09-25 Harima Chemicals, Inc. Flux de brasage tendre, composition à braser et procédé de brasage associé
JP6138846B2 (ja) * 2015-03-26 2017-05-31 株式会社タムラ製作所 はんだ組成物およびそれを用いた電子基板の製造方法
JP6390989B1 (ja) * 2017-11-24 2018-09-19 千住金属工業株式会社 フラックス及びソルダペースト

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JPH08213746A (ja) * 1995-02-03 1996-08-20 Sony Corp フラツクス
TW299265B (fr) * 1995-06-19 1997-03-01 Chisumi Kinzoku Kogyo Kk
JP2001284787A (ja) * 2001-01-25 2001-10-12 Matsushita Electric Ind Co Ltd 半田ボールの搭載用フラックス
JP2016093816A (ja) * 2014-11-12 2016-05-26 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP2017035731A (ja) * 2015-08-10 2017-02-16 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト

Also Published As

Publication number Publication date
TW202241626A (zh) 2022-11-01
WO2022191227A1 (fr) 2022-09-15
KR102690728B1 (ko) 2024-08-05
JP2022184949A (ja) 2022-12-13
KR20230150882A (ko) 2023-10-31

Similar Documents

Publication Publication Date Title
WO2018225288A1 (fr) Flux destiné à des soudure à âme décapante de flux résineux, flux destiné à des soudures à âme décapante de flux, et soudure recouverte de flux
JP6390989B1 (ja) フラックス及びソルダペースト
JP6684372B2 (ja) ディスペンス塗布用はんだ組成物
JP2019111541A (ja) フラックス及びフラックス用樹脂組成物
KR20200029353A (ko) 제트 디스펜서용 땜납 조성물 및 전자 기판의 제조 방법
TW201936610A (zh) 助焊劑及焊料膏
JP2018161674A (ja) はんだ組成物および電子基板
JP7328310B2 (ja) フラックスおよび電子デバイスの製造方法
TWI836369B (zh) 焊劑及電子裝置之製造方法
JP6130418B2 (ja) 電子部品の接合方法、並びに、その方法に用いるはんだ組成物および前処理剤
JP2020055035A (ja) はんだ組成物および電子基板
TWI836368B (zh) 焊劑及電子裝置之製造方法
JP7133579B2 (ja) はんだ組成物および電子基板
TWI809578B (zh) 助焊劑塗覆焊料預成形物用的助焊劑、助焊劑塗覆焊料預成形物及於電子基板安裝電子零件的方法
JP7066798B2 (ja) はんだ組成物
CN117042914A (zh) 助焊剂和电子设备的制造方法
CN116981541A (zh) 助焊剂和电子设备的制造方法
TWI750060B (zh) 助焊劑組成物、及使用其之焊膏
WO2024122214A1 (fr) Flux de brasure et procédé de production de carte montée sur un composant électronique
JP2020157319A (ja) はんだ組成物および電子基板の製造方法
TWI782216B (zh) 包芯焊料用的助焊劑、包芯焊料、塗覆有助焊劑的焊料用的助焊劑、塗覆有助焊劑的焊料及焊接方法
TW202308838A (zh) 焊膏及電子裝置之製造方法
JP7181964B2 (ja) はんだ含有導電性組成物および電子基板の製造方法
JP7161510B2 (ja) はんだ組成物および電子基板
JP7148569B2 (ja) フラックス組成物、はんだ組成物および電子基板