JP2022184949A - フラックスおよび電子デバイスの製造方法 - Google Patents

フラックスおよび電子デバイスの製造方法 Download PDF

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Publication number
JP2022184949A
JP2022184949A JP2022146272A JP2022146272A JP2022184949A JP 2022184949 A JP2022184949 A JP 2022184949A JP 2022146272 A JP2022146272 A JP 2022146272A JP 2022146272 A JP2022146272 A JP 2022146272A JP 2022184949 A JP2022184949 A JP 2022184949A
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JP
Japan
Prior art keywords
flux
acid
organic solvent
mass
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022146272A
Other languages
English (en)
Japanese (ja)
Inventor
靖久 須川
Yasuhisa Sugawa
裕之 山▲崎▼
Hiroyuki Yamasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021201805A external-priority patent/JP7328311B2/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of JP2022184949A publication Critical patent/JP2022184949A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C22C11/06—Alloys based on lead with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2022146272A 2021-03-12 2022-09-14 フラックスおよび電子デバイスの製造方法 Pending JP2022184949A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021040416 2021-03-12
JP2021040415 2021-03-12
JP2021040415 2021-03-12
JP2021040416 2021-03-12
JP2021201805A JP7328311B2 (ja) 2021-03-12 2021-12-13 フラックスおよび電子デバイスの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2021201805A Division JP7328311B2 (ja) 2021-03-12 2021-12-13 フラックスおよび電子デバイスの製造方法

Publications (1)

Publication Number Publication Date
JP2022184949A true JP2022184949A (ja) 2022-12-13

Family

ID=83226783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022146272A Pending JP2022184949A (ja) 2021-03-12 2022-09-14 フラックスおよび電子デバイスの製造方法

Country Status (4)

Country Link
JP (1) JP2022184949A (fr)
KR (1) KR20230150882A (fr)
TW (1) TWI836369B (fr)
WO (1) WO2022191227A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JPH08213746A (ja) * 1995-02-03 1996-08-20 Sony Corp フラツクス
JP3498427B2 (ja) * 1995-06-19 2004-02-16 ソニー株式会社 成形はんだ用フラックス
JP3518512B2 (ja) * 2001-01-25 2004-04-12 松下電器産業株式会社 半田ボールの搭載用フラックス
JP2003051668A (ja) 2001-08-06 2003-02-21 Tdk Corp 電子部品の製造方法と製造装置
JP6405920B2 (ja) * 2014-11-12 2018-10-17 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP6191896B2 (ja) * 2015-08-10 2017-09-06 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト

Also Published As

Publication number Publication date
TW202241626A (zh) 2022-11-01
KR20230150882A (ko) 2023-10-31
TWI836369B (zh) 2024-03-21
WO2022191227A1 (fr) 2022-09-15

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