TWI836205B - 發光元件之安裝方法及顯示裝置 - Google Patents
發光元件之安裝方法及顯示裝置 Download PDFInfo
- Publication number
- TWI836205B TWI836205B TW110111788A TW110111788A TWI836205B TW I836205 B TWI836205 B TW I836205B TW 110111788 A TW110111788 A TW 110111788A TW 110111788 A TW110111788 A TW 110111788A TW I836205 B TWI836205 B TW I836205B
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- substrate
- emitting element
- terminal portion
- array substrate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000009434 installation Methods 0.000 title description 9
- 239000000758 substrate Substances 0.000 claims abstract description 220
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 56
- 239000010980 sapphire Substances 0.000 claims abstract description 56
- 238000007789 sealing Methods 0.000 claims abstract description 33
- 230000001678 irradiating effect Effects 0.000 claims abstract 5
- 239000000463 material Substances 0.000 claims description 13
- 239000003566 sealing material Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 39
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 39
- 229910004444 SUB1 Inorganic materials 0.000 description 39
- 229910004438 SUB2 Inorganic materials 0.000 description 33
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 33
- 101150018444 sub2 gene Proteins 0.000 description 33
- 238000000608 laser ablation Methods 0.000 description 7
- 239000007769 metal material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020067627A JP7434037B2 (ja) | 2020-04-03 | 2020-04-03 | 発光素子の実装方法および表示装置 |
| JP2020-067627 | 2020-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202205694A TW202205694A (zh) | 2022-02-01 |
| TWI836205B true TWI836205B (zh) | 2024-03-21 |
Family
ID=77997494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110111788A TWI836205B (zh) | 2020-04-03 | 2021-03-31 | 發光元件之安裝方法及顯示裝置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7434037B2 (ja) |
| CN (1) | CN113497165B (ja) |
| TW (1) | TWI836205B (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122225A (zh) * | 2021-11-09 | 2022-03-01 | Tcl华星光电技术有限公司 | 一种Micro LED显示面板的制备方法 |
| CN117012783A (zh) * | 2022-04-29 | 2023-11-07 | 成都辰显光电有限公司 | 一种显示面板及显示面板的制备方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019018988A1 (en) * | 2017-07-24 | 2019-01-31 | Goertek.Inc | MICRO-LED DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| US20190157523A1 (en) * | 2017-11-20 | 2019-05-23 | Kaistar Lighting (Xiamen) Co., Ltd. | Micro led display device and method for manufacturing same |
| US20190181122A1 (en) * | 2017-12-13 | 2019-06-13 | Innolux Corporation | Electronic device and method of manufacturing the same |
| TW201937720A (zh) * | 2018-02-05 | 2019-09-16 | 日商Ｖ科技股份有限公司 | 全彩ｌｅｄ顯示面板及其製造方法 |
| TW201939790A (zh) * | 2018-02-06 | 2019-10-01 | 日商Ｖ科技股份有限公司 | Ｌｅｄ顯示器之製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5526782B2 (ja) | 2007-11-29 | 2014-06-18 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| CN101713882B (zh) * | 2008-10-01 | 2013-07-17 | 株式会社日立显示器 | 液晶显示装置 |
| JP6224918B2 (ja) * | 2013-05-31 | 2017-11-01 | 株式会社ジャパンディスプレイ | 表示装置及びその製造方法 |
| JP6200340B2 (ja) * | 2014-02-04 | 2017-09-20 | 株式会社ジャパンディスプレイ | 表示装置およびその製造方法 |
| WO2017180693A1 (en) | 2016-04-15 | 2017-10-19 | Glo Ab | Method of forming an array of a multi-device unit cell |
| JP2019220666A (ja) | 2018-06-19 | 2019-12-26 | 株式会社ブイ・テクノロジー | 半導体素子形成サファイア基板、及び前記半導体素子形成サファイア基板の製造方法、並びに前記半導体素子の転写方法 |
| JP2020013954A (ja) | 2018-07-20 | 2020-01-23 | 株式会社ブイ・テクノロジー | 基板接続構造、マイクロｌｅｄディスプレイ及び部品実装方法 |
-
2020
- 2020-04-03 JP JP2020067627A patent/JP7434037B2/ja active Active
-
2021
- 2021-03-31 TW TW110111788A patent/TWI836205B/zh active
- 2021-04-01 CN CN202110354292.9A patent/CN113497165B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019018988A1 (en) * | 2017-07-24 | 2019-01-31 | Goertek.Inc | MICRO-LED DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME |
| US20190157523A1 (en) * | 2017-11-20 | 2019-05-23 | Kaistar Lighting (Xiamen) Co., Ltd. | Micro led display device and method for manufacturing same |
| US20190181122A1 (en) * | 2017-12-13 | 2019-06-13 | Innolux Corporation | Electronic device and method of manufacturing the same |
| TW201937720A (zh) * | 2018-02-05 | 2019-09-16 | 日商Ｖ科技股份有限公司 | 全彩ｌｅｄ顯示面板及其製造方法 |
| TW201939790A (zh) * | 2018-02-06 | 2019-10-01 | 日商Ｖ科技股份有限公司 | Ｌｅｄ顯示器之製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113497165A (zh) | 2021-10-12 |
| TW202205694A (zh) | 2022-02-01 |
| CN113497165B (zh) | 2024-06-18 |
| JP2021163945A (ja) | 2021-10-11 |
| JP7434037B2 (ja) | 2024-02-20 |
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