TWI834630B - 聚醯亞胺、聚醯亞胺溶液組成物、聚醯亞胺膜及包含其的基材積層體、基板、顯示器，以及其製造方法 - Google Patents
聚醯亞胺、聚醯亞胺溶液組成物、聚醯亞胺膜及包含其的基材積層體、基板、顯示器，以及其製造方法 Download PDFInfo
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- TWI834630B TWI834630B TW107147627A TW107147627A TWI834630B TW I834630 B TWI834630 B TW I834630B TW 107147627 A TW107147627 A TW 107147627A TW 107147627 A TW107147627 A TW 107147627A TW I834630 B TWI834630 B TW I834630B
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- polyimide
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- 150000002739 metals Chemical class 0.000 description 1
- CZRKJHRIILZWRC-UHFFFAOYSA-N methyl acetate;propane-1,2-diol Chemical compound COC(C)=O.CC(O)CO CZRKJHRIILZWRC-UHFFFAOYSA-N 0.000 description 1
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- 229920006255 plastic film Polymers 0.000 description 1
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- FOWDZVNRQHPXDO-UHFFFAOYSA-N propyl hydrogen carbonate Chemical compound CCCOC(O)=O FOWDZVNRQHPXDO-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
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- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-253759 | 2017-12-28 | ||
| JP2017253759 | 2017-12-28 |
Publications (2)
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| WO (1) | WO2019131896A1 (fr) |
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| WO2021059843A1 (fr) * | 2019-09-24 | 2021-04-01 | 東レ株式会社 | Composition de résine, film de composition de résine, film durci, structure creuse utilisant ce dernier et dispositif semi-conducteur |
| EP4186695A4 (fr) * | 2020-07-21 | 2024-08-14 | Toyo Boseki | Stratifié, et procédé de manufacture de dispositif flexible |
| WO2022114136A1 (fr) * | 2020-11-27 | 2022-06-02 | 宇部興産株式会社 | Composition de précurseur de polyimide, film de polyimide et stratifié de film/substrat de polyimide |
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| TW201710234A (zh) * | 2015-03-25 | 2017-03-16 | 日產化學工業股份有限公司 | 二胺及其利用 |
| CN107108886A (zh) * | 2014-10-23 | 2017-08-29 | 宇部兴产株式会社 | 聚酰亚胺前体、聚酰亚胺和聚酰亚胺膜 |
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| JP6431369B2 (ja) | 2012-05-28 | 2018-11-28 | 宇部興産株式会社 | ポリイミド前駆体及びポリイミド |
| CN104837894B (zh) | 2012-09-18 | 2018-02-23 | 宇部兴产株式会社 | 聚酰亚胺前体，聚酰亚胺，聚酰亚胺膜，清漆以及基板 |
| CN105492496B (zh) | 2013-06-27 | 2017-09-22 | 宇部兴产株式会社 | 聚酰亚胺前体和聚酰亚胺 |
| JP2016132686A (ja) * | 2015-01-15 | 2016-07-25 | Ｊｘエネルギー株式会社 | ポリイミド、ポリイミドの製造方法、ポリイミド溶液及びポリイミドフィルム |
| US20190161581A1 (en) | 2016-05-06 | 2019-05-30 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin |
| JP2017133027A (ja) | 2016-09-13 | 2017-08-03 | Ｊｘｔｇエネルギー株式会社 | ポリイミド、ポリイミドの製造方法、ポリイミド溶液及びポリイミドフィルム |
| WO2018066522A1 (fr) * | 2016-10-07 | 2018-04-12 | Ｊｘｔｇエネルギー株式会社 | Polyimide, résine de précurseur de polyimide, solution de ceux-ci, procédé de fabrication de polyimide, et film mettant en œuvre ce polyimide |
| JP6766007B2 (ja) * | 2017-04-28 | 2020-10-07 | Ｅｎｅｏｓ株式会社 | テトラカルボン酸二無水物、ポリイミド前駆体樹脂及びその溶液、並びに、ポリイミド及びその溶液 |
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| CN107108886A (zh) * | 2014-10-23 | 2017-08-29 | 宇部兴产株式会社 | 聚酰亚胺前体、聚酰亚胺和聚酰亚胺膜 |
| TW201710234A (zh) * | 2015-03-25 | 2017-03-16 | 日產化學工業股份有限公司 | 二胺及其利用 |
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| WO2019131896A1 (fr) | 2019-07-04 |
| KR20220124824A (ko) | 2022-09-14 |
| CN111770949B (zh) | 2024-01-16 |
| KR20200093078A (ko) | 2020-08-04 |
| CN111770949A (zh) | 2020-10-13 |
| TW201942194A (zh) | 2019-11-01 |
| JPWO2019131896A1 (ja) | 2021-01-14 |
| JP7069478B2 (ja) | 2022-05-18 |
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