TWI829537B - Devices and equipment for silicon wafer degumming - Google Patents

Abstract

The embodiment of the present invention discloses a device and equipment for silicon wafer degumming. The device includes: a top-open accommodation module for accommodating cleaning fluid and a queue of silicon wafers that have been wire-cut and are still adhered by glue; A support module for supporting the silicon wafer queue in the accommodation module; the support module includes: a support plate provided on the bottom of the accommodation module, so that when the silicon wafer queue is placed on the When placed on the support plate, the glued part of the silicon chip array can be submerged by the cleaning liquid in the accommodation module. The support plate includes a first end and a second end along the length direction of the support plate; it is arranged perpendicular to the support plate. a stop plate on the support plate; the support plate is configured to be rotatable about the first end relative to the accommodation module between a first position and a second position, in the second position, the second end of the support plate is relative to the accommodation module The bottom of the module is raised to a predetermined height so that each silicon chip is tilted toward the direction of the stopper plate.

Description

Devices and equipment for silicon wafer degumming

Embodiments of the present invention belong to the technical field of silicon wafer processing, and particularly relate to devices and equipment for silicon wafer degumming.

As a carrier of semiconductor circuit manufacturing processes, the quality of silicon wafers has a decisive impact on the formation of integrated circuits. At present, the main processes in the preliminary forming process of silicon wafers include: silicon rod cutting, physical and chemical grinding, chemical etching, physical and chemical polishing, etc. Silicon rod cutting is one of the core steps in the silicon wafer forming process, which mainly includes multi-line mortar (SiC) cutting and inner circle cutting. The mainstream technology currently used is multi-line cutting, because compared to internal circle cutting, multi-line cutting has the advantages of high efficiency, good quality, and high film yield.

Multi-wire cutting is currently an advanced slicing processing technology. Its principle is to wind the cutting wires sequentially into guide grooves spaced apart from each other and formed on the circumferential surface of the spool so that the cutting wires form an array of cutting line segments. In the guide grooves Under the guidance of the cutting wire, the high-speed reciprocating motion of the cutting line is used to bring the abrasive into the processing area of the workpiece to be cut (such as a silicon rod) for grinding, and the workpiece to be cut is bonded to the workbench through the resin strip and passes through the workbench. The lifting and lowering of the machine realizes vertical feeding, thereby cutting the workpiece into several thin slices (such as wafers) of the required size and shape at the same time.

The cut workpieces are not immediately separated from each other but are still bonded to the resin strips through glue. Therefore, the workpieces and the resin strips need to be removed from the workbench and placed together in a special degumming device for processing. , so that the workpiece can be smoothly separated from the glue on the resin strip, and the impurities remaining on the workpiece from the wire cutting operation are also cleaned.

In view of this, embodiments of the present invention are expected to provide devices and equipment for degumming silicon wafers, which can provide reasonable support to the silicon wafers when the silicon wafers are accommodated therein, thereby preventing the silicon wafers from collapsing and colliding.

The technical solution of the embodiment of the present invention is implemented as follows:

In a first aspect, embodiments of the present invention provide a device for silicon wafer degumming, which device includes: A holding module with an open top is used to hold cleaning fluid and a queue of silicon wafers that have been wire-cut and are still bonded by glue; A support module provided in the accommodation module for supporting the silicon wafer queue; in, The support module includes: A support plate is provided on the bottom of the accommodation module, so that when the silicon wafer queue is placed on the support plate with each silicon wafer standing upright, the glued portion of the silicon wafer queue can be held by the silicon wafer queue. The cleaning liquid in the accommodation module is immersed, and the support plate includes a first end and a second end along the length direction of the support plate; a stop plate, which is arranged on the support plate perpendicularly to the support plate; Wherein, the support plate is configured to be rotatable around the first end relative to the accommodation module between a first position and a second position. In the first position, the support plate is located horizontally at the bottom of the accommodation module. On, in the second position, the second end of the support plate is raised to a predetermined height relative to the bottom of the accommodation module, so that each silicon chip is inclined toward the direction of the stopper plate.

In a second aspect, embodiments of the present invention provide equipment for silicon wafer degumming, which equipment includes: A device for silicon wafer degumming according to the first aspect; The chip picking robot is used to pick up the silicon wafer in the silicon wafer queue to separate the silicon wafer from the silicon wafer queue and remove the silicon wafer from the device.

Embodiments of the present invention provide a device and equipment for silicon wafer degumming; the device includes an accommodation module for accommodating cleaning fluid and a queue of silicon wafers. When the queue of silicon wafers is placed in the accommodation module, the silicon wafers The glued part of the queue is immersed in the cleaning liquid, so that the cleaning liquid can penetrate into the colloid to soften and decompose the glue. After the glue is softened and decomposed to a certain extent, each part of the silicon wafer queue can be cleaned. The silicon chip exerts appropriate force to separate the silicon chip from the glue. In order to prevent the silicon chip from falling over due to self-degumming during the soaking process, the support module of the device includes a support module that can be wound around one end in the first position and the second position. Between the rotating support plate and the stopper plate vertically arranged on the support plate, in the first position, the support plate is placed horizontally on the bottom of the accommodation module to facilitate placing the silicon wafer queue on it. When starting to align When the silicon wafer queue is soaked, the support plate can be rotated upward at a certain angle around one end relative to the accommodation module so that the other end rises upward by a corresponding height, so that each of the silicon wafer queues located on the support plate The silicon wafer is slightly tilted toward the stopper. In this way, if a silicon wafer is debonded in advance and tilts, the stopper can resist the tilted or even moved silicon wafer, thereby preventing the silicon wafer from completely toppling over and breaking.

In order to help the review committee understand the technical features, content and advantages of the present invention and the effects it can achieve, the present invention is described in detail below in the form of embodiments with the accompanying drawings and attachments, and the drawings used therein are , its purpose is only for illustration and auxiliary description, and may not represent the actual proportions and precise configurations after implementation of the present invention. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited to the actual implementation of the present invention. The scope shall be stated first.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical" The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description. , rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be construed as a limitation of the present invention.

In addition, the terms “first” and “second” are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as “first” and “second” may explicitly or implicitly include one or more of the described features. In the description of the embodiments of the present invention, "plurality" means two or more than two, unless otherwise explicitly and specifically limited. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to Figure 1, a schematic diagram of a conventional wire cutting device 1 is shown. It can be understood that the structure shown in Figure 1 is only used for principle explanation, and does not mean that those with ordinary knowledge in the art will not implement it according to the specific implementation. The state adds or subtracts elements from the composition structure shown in Figure 1, and this embodiment of the present invention does not specifically limit this. As shown in Figure 1, the wire cutting equipment 1 may include a wire cutting unit 11 and a carrying unit 12; the wire cutting unit 11 may be placed vertically below the carrying unit 12 as shown in Figure 1 in some examples, and may also be placed in some examples. As shown in Figure 2, it is placed above the vertical direction of the carrying unit 12. Specifically, the wire cutting unit 11 may include a plurality of wire spools 111 and cutting wires 112. The cutting wires 112 are wound around the spools 111 to form an array composed of mutually parallel cutting wire segments; in FIG. 1, the number of wire spools 111 is 2. An example is given for illustration, and the reciprocating direction of the bobbin 111 and the cutting wire 112 toward and away from the carrying unit 12 is shown by the solid arrow in FIG. 1 , and the reciprocating speed may be exemplarily 10 m/s to 15 m/s. The carrying unit 12 is used to load and fix the silicon rod 2 to be processed. In the examples shown in FIGS. 1 and 2 , the carrying unit 12 may include a base 121 and an intermediary software 122 . The intermediary software 122 may fix the silicon rod 2 to be processed. To the base 121, for example, the intermediary software 122 can be a long resin strip, and the silicon rod to be processed can be bonded to the resin strip through its circumferential surface, where the length direction of the resin strip is consistent with the length of the silicon rod to be processed. The axial direction is parallel, and the resin strip is then fixed to the lower surface (Figure 1) or the upper surface (Figure 2) of the abutment, thereby fixing the silicon rod to be processed and the resin strip to the abutment together.

For the wire cutting equipment 1 shown in Figures 1 and 2, the wire cutting unit 11 or the carrying unit 12 can be moved to cause the cutting wire 112 and the silicon rod 2 to be processed to move relative to each other in the vertical direction. After the silicon rods 2 to be processed come into contact with each other, the silicon rods 2 to be processed are cut by using the movement of the cutting line 112 along its extending direction. In the example shown in FIG. 1 , the wire cutting unit 11 can be moved in the direction shown by the black arrow, and the carrying unit 12 can also be moved in the direction of the dotted white arrow, so as to realize the connection between the cutting line 112 and the silicon rod 2 to be processed. Movement in the vertical direction. In the example shown in FIG. 2 , the carrying unit 12 can be moved in the direction shown by the black arrow, or the wire cutting unit 11 can be moved in the direction of the dotted white arrow, so as to realize the connection between the cutting line 112 and the silicon rod 2 to be processed. Movement in the vertical direction. It should be noted that in the embodiment of the present invention, a lifting device (not shown in the figure) is installed to realize the movement of the wire cutting unit 11 or the carrying unit 12. It is understandable that those with ordinary knowledge in the art can also move the wire cutting unit 11 or the carrying unit 12 according to actual needs and requirements. The implementation scenario implements the movement of the wire cutting unit 11 or the carrying unit 12 in other ways, which will not be described in detail in the embodiment of the present invention.

Since the silicon rod to be processed is glued to the abutment through its circumferential surface, when the silicon rod is wire-cut, it does not immediately fall to the ground as scattered silicon pieces, but is still jointly glued to the intermediary software. Form a queue of silicon wafers that are coaxially connected to each other. In this case, the intermediary software and the queue of silicon wafers need to be placed together in a dedicated degumming device for soaking and cleaning to separate the silicon wafers from the glue, and the residue also needs to be cleaned Contaminants on the silicon wafer, such as mortar, silicon slag, etc.

The conventional degumming device is roughly in the shape of a trough with an open top. The intermediary software and the silicon chip queue are placed into the degumming device as a whole in such a way that the intermediary software is located below and each silicon chip remains upright. Then, the degumming device is filled with cleaning fluid. , to soften and decompose the glue through soaking, spraying, etc., and clean the impurities on the silicon wafers. Finally, the chip-taking robot applies force to the silicon wafers one by one to degumm the silicon wafers and separate them from the intermediary software, and The silicon wafer is removed from the degumming device and the cleaning operation ends.

Ideally, within a predetermined time, the glue is only partially softened and decomposed and can also provide a certain holding force for the silicon wafer, so that the silicon wafer can still stand upright in the degumming device, and then be removed by the chip-taking robot or The operator holds the silicon wafer and applies appropriate force to separate the silicon wafer from the glue. The entire process will not cause damage to the silicon wafer. However, in actual operation, the softening and decomposition state of the glue cannot be strictly controlled. It may happen that the glue is excessively softened and decomposed by the cleaning solution within a predetermined time, thereby losing its holding effect on the silicon wafer. Once the silicon wafer and the glue are If it detaches itself, it may tip over under the influence of gravity. However, the internal structure of conventional degumming devices is relatively simple and does not provide additional support for the silicon wafers, causing the silicon wafers to collapse and collide after being degummed by themselves in advance, resulting in damage to the silicon wafers.

In view of the above situation, embodiments of the present invention are expected to provide devices and equipment for silicon wafer degumming; which can provide reasonable support to the silicon wafer when the silicon wafer is accommodated therein, thereby preventing the silicon wafer from collapsing and colliding.

Referring to Figures 3 and 4, a device 20 for silicon wafer degumming provided by an embodiment of the present invention is shown. The device 20 includes: The accommodation module 21 with an open top is used to accommodate the cleaning fluid and the queue SY of silicon wafers that have been wire-cut and are still adhered by glue; A support module 22 provided in the accommodation module 21 for supporting the silicon wafer queue SY; Among them, the support module 22 includes: The support plate 221 is disposed on the bottom of the accommodation module 21, so that when the silicon wafer queue SY is placed on the support plate 221 with each silicon wafer S standing upright, the silicon wafer queue SY The glued part can be submerged by the cleaning liquid in the accommodation module 21. The support plate 221 includes a first end 221a and a second end 221b along the length direction of the support plate 221; The stop plate 222 is arranged on the support plate 221 perpendicularly to the support plate 221; Wherein, the support plate 221 is configured to be able to rotate around the first end 221a relative to the accommodation module 21 between a first position and a second position. As shown in FIG. 4 , in the first position, the support plate 221 is located horizontally on the bottom of the accommodation module 21. As shown in Figure 3, in the second position, the second end 221b of the support plate 221 is raised to a predetermined height relative to the bottom of the accommodation module 21, Each silicon chip S is tilted toward the direction of the stopper plate 222 .

As shown in Figure 3, the device 20 for silicon wafer degumming includes a storage module 21 and a support module 22 arranged in the storage module 21. The cleaning liquid and the silicon wafer queue SY to be degummed are accommodated in the storage module. Among them, as described above for the conventional wire cutting equipment, the silicon wafer queue SY is also bonded to the intermediary software 122 through glue at this time. Therefore, the two will also be placed into the accommodation module 21 together. The support module 22 includes a support plate 221 provided at the bottom of the accommodation module and a stopper plate 222 vertically provided on the support plate 221 . When the silicon wafer queue SY obtained by wire cutting the silicon rod is placed in the accommodation module 21, the silicon wafer queue SY can be placed on the support plate 221 with the glued part and the intermediary software 122 downward. , at this time, the support plate 221 may be in a horizontal position, that is, in the first position, as shown in FIG. 4 , so as to stably place the silicon wafer queue SY on the support plate 221 . Then, the cleaning liquid can be filled into the accommodation module 21. The cleaning liquid does not need to completely immerse the silicon wafer queue, but can only immerse the glued part. The cleaning liquid immersed in the glue can soften and decompose the glue. As a result, the glue gradually loses its stickiness to the silicon wafer.

After the silicon wafer queue SY is placed smoothly on the support plate 221, for example, after filling the cleaning liquid, the support plate 221 can be adjusted to an inclined position at a certain angle with the bottom of the accommodation module 21, that is, so that The support plate 221 is adjusted to the second position as shown in FIG. 3 so that each silicon chip in the silicon chip queue SY is tilted toward the stopper plate 222. Therefore, during the soaking process and the subsequent chip removal process, Once the glue loses its adhesion to the silicon chip and causes the silicon chip to detach from the glue, the silicon chip can lean on the stopper plate 222 without breaking due to collapse in any direction.

It should be noted that in the second position, the height at which the second end 221b of the support plate 221 rises relative to the bottom of the accommodation module 21 , that is, the degree of inclination of the support plate 221 , can be determined according to actual operational needs. The adjustment can, for example, be determined and adjusted based on the size of the silicon wafers in the silicon wafer queue, the number of silicon wafers, etc., so the device 20 can be suitable for more applications.

After the glue is softened and decomposed to a certain extent, the operator applies an appropriate force to each silicon wafer S in the silicon wafer queue SY manually or via the wafer picking robot R, and with the help of other silicon wafers in the silicon wafer queue And the gravity of the intermediary software 122 can separate the silicon chips from the glue and the intermediary software 122 one by one.

The embodiment of the present invention provides a device 20 for silicon wafer degumming; the device 20 includes an accommodation module 21 for accommodating cleaning liquid and silicon wafer queue SY. When the silicon wafer queue SY is placed in the accommodation module 21 At this time, the glued part of the silicon wafer queue SY is immersed in the cleaning liquid, so that the cleaning liquid can penetrate into the colloid to soften and decompose the glue. After the glue is softened and decomposed to a certain extent, the silicon wafer can be processed Each silicon chip S in the queue SY exerts an appropriate force to separate the silicon chip from the glue. In order to prevent the silicon chip from falling over and breaking due to self-degumming during the soaking process, the support module of the device includes a support module that can be wound around one end. A support plate that rotates between a first position and a second position and a stopper plate that is vertically disposed on the support plate. In the first position, the support plate is placed horizontally on the bottom of the accommodation module to facilitate placing the silicon wafers in a queue. On it, when starting to soak the silicon wafer queue, the support plate can be rotated upward at a certain angle around one end relative to the accommodation module to raise the other end upward by a corresponding height, so that the Each silicon chip in the silicon chip queue is slightly tilted toward the stopper. In this way, once a silicon chip is debonded in advance and tilts, the stopper can resist the tilted or even moved silicon chip, thereby preventing the silicon chip from completely toppling over. And rupture occurs.

In the operation of degumming silicon wafers using a chip picking robot, after the silicon wafer queue is soaked in the degumming device for a predetermined time, the chip picking robot uses negative pressure to adsorb the outermost silicon wafer in the silicon wafer queue. surface facing the outside, and then lift the silicon wafer in the direction away from the glue to deglue it, and completely leave the silicon wafer queue, and finally leave the degumming device. However, as mentioned above, in conventional degumming operations, the soaking for degumming cannot be accurately controlled. It is also possible that the glue is not properly softened and decomposed after soaking, resulting in obstacles during degumming. , especially when the force threshold of the chip-picking robot has been set, there may be a situation where the chip-picking robot cannot deglue the silicon wafer. In response to the above situation, in order to assist the degumming operation of the silicon wafer, optionally, referring to Figure 5, the support module 22 also includes: a lifting module 23 provided on the support plate 221. The lifting module 23 It is configured to be able to lift a silicon chip in the silicon chip queue SY from below, so that the silicon chip S can be separated from the glue on the silicon chip queue SY.

Further optionally, as shown in Figure 5, the lifting module 23 includes: a clamping unit 231 and a driving unit 232. The clamping unit 231 is used to clamp the silicon chip S from below, and the driving unit 232 is used to clamp the silicon chip S from below. The clamping unit 231 is driven to move upward to separate the clamped silicon wafer S from the glue on the silicon wafer queue.

Referring to FIG. 5 , for example, the clamping unit 231 can be U-shaped, and the silicon chip can be inserted into the U-shaped notch of the clamping unit 231 . In order to stably hold up the silicon chip, see FIG. 6 , a pair of clamping units can be provided. , this pair of clamping units can be disposed on both sides symmetrically about the center of a single silicon chip under a single silicon chip, that is, on both sides of the glued part of the silicon chip. When the clamping unit 231 is driven by the driving unit 232 While the lower part is rising upward, also hold up the silicon chip until the silicon chip is separated from the glue. The driving unit 232 may be, for example, a hydraulic driving unit, a pneumatic driving unit, an electric driving unit, or the like.

It can be understood that the lifting module 23 can work independently to degumm the silicon wafers, or can also work in conjunction with the wafer picking robot R, that is, after the wafer picking robot R has adsorbed the silicon wafers, it is ready to lift the silicon wafers from the glue. At this time, the lifting module 23 also starts to work to assist the chip-taking robot to take away the silicon wafers.

In order to switch the support plate between the first position and the second position, optionally, referring to Figure 7, the support module further includes a lifting mechanism 223 for moving the support plate 221 around the first end 221a. Rotate between the first position and the second position. In the example shown in FIG. 7 , the lifting mechanism 223 is a lifting rod provided below the support plate 221 near the second end 221 b, and the height change of the second end of the support plate is realized by the expansion and contraction of the lifting rod. Of course, it can be understood that the lifting mechanism 223 can also be disposed above the support plate 221 and realize the height change of the second end of the support plate 221 by pulling upward the second end 221b of the support plate 221 .

In order to stabilize the horizontal position of the support plate within the support module, especially to prevent the support plate from sliding on the bottom of the support module when the support plate switches between the first position and the second position, optionally, see Figure 8 , the support plate 221 is connected to the bottom of the accommodation module 21 via the hinge 224 at the first end 221a, thereby preventing the support plate from switching between the first position and the second position without affecting the The support plate shifts horizontally.

Since the device 20 needs to cooperate with the chip picking robot, for example, the degummed silicon wafers need to be picked up and left by the chip picking robot or the device 20 will cooperate with the chip picking robot to perform silicon wafer degumming. In actual applications, in order to save To increase production costs, the posture and position of the wafer-picking robot are often set, which means that predetermined operations are performed at a fixed position. When performing degumming operations on the silicon wafer queue, the operation can only be performed on a single silicon wafer at a time. , however, obviously, the position of each silicon wafer in the silicon wafer queue is different, so the position of the silicon wafer queue needs to be continuously moved during the degumming operation. For this, optionally, see Figure 9, the device 20 It also includes: a displacement control module 24, which is used to control the stop plate 222 and the silicon wafer queue SY to move on the support plate 221 toward the second end 221b of the support plate 221, So that the specified silicon chip in the silicon chip queue SY can be moved to a predetermined position.

In the example shown in FIG. 9 , the wafer picking robot R performs a wafer picking operation on the silicon wafer queue SY near the second end 221 b of the support plate 221 , and this position can be determined as the wafer picking position. Through the displacement control module 24, the silicon wafer S to be operated can be moved to the chip taking position. For example, the chips can be taken from the outside to the inside of the silicon wafer queue. Specifically, when the silicon wafer queue is When the soaking time has reached the predetermined time, the silicon wafer queue SY can be first shifted by the displacement control module 24 until the outermost silicon wafer reaches the chip removal position. After the outermost silicon wafer is taken away, the displacement control module Group 24 moves the silicon wafer queue again so that the silicon wafer that was originally the second from the outside to the inside but is now the outermost silicon wafer reaches the pick-up position, and so on, until the pick-up robot R removes all the silicon wafers. Take away. In this way, there is no need to adjust the position or attitude of the chip picking robot R, and the displacement control module 24 only needs to move the silicon wafer to be processed to the chip picking position.

In addition, it should be noted that during the movement of the silicon wafer queue, the silicon wafer is more likely to tilt due to changes in force. Therefore, when the silicon wafer queue is moved, the support plate 221 can be switched to In the second position, the stopper plate 222 is moved together with the silicon chip queue, so that even if the silicon chip falls under the action of external force, it will only fall towards the stopper plate 222 and can rely on the stopper plate 222 to avoid silicon wafers. Damage caused by sheet collapse.

Regarding the connection between the stop plate and the support plate, optionally, referring to FIG. 9 , the stop plate 222 is disposed on the support plate 221 in a manner that can slide on the support plate 221 , and the displacement control module 24 includes The power unit 241 is used to apply force to the stopper plate 222 to push the silicon chip queue SY on the support plate 221 toward the second end of the support plate 221 through the stopper plate 222 221b mobile. As shown in Figure 10, the stop plate 222 can be connected to the support plate 221 in a slider-slide rail manner, wherein the support plate 221 can be in the form of a slide rail, and the stop plate 222 "rides" on the support plate. 221, enabling it to slide along the support plate 221. It is conceivable that the stop plate 222 can also be connected to the support plate 221 in other ways, and these equivalent modifications all fall within the protection scope of the present invention.

In order to prevent the silicon wafers in the silicon wafer queue from tilting in other directions, optionally, referring to Figure 11, the device 20 also includes: a protection module 25, which is arranged in the horizontal direction within the accommodation module 21. On either side of the silicon wafer queue SY. As shown in FIG. 11 , the protective module 25 may, for example, be in the shape of a slat, and be fixed horizontally on both sides of the silicon wafer queue SY within the accommodation module 21 , so that once the silicon wafers are debonded by themselves and tend to move along their diameter When it tilts in the direction, it can be immediately blocked by the protection module 25 without collapsing and being damaged.

According to an optional embodiment of the present invention, referring to Figure 11, the device also includes a spray module 26, which is used to spray cleaning liquid to the silicon wafer queue SY to clean the silicon wafer queue SY. The silicon wafers in the chip are cleaned.

Referring to Figure 12, an embodiment of the present invention also provides an equipment 30 for silicon wafer degumming, which equipment includes: Device 20 for silicon wafer degumming as defined above; The chip picking robot R is used to pick up the silicon wafer in the silicon wafer queue to separate the silicon wafer from the silicon wafer queue and remove the silicon wafer from the device.

It should be noted that the technical solutions recorded in the embodiments of the present invention can be combined arbitrarily as long as there is no conflict.

The above are only preferred embodiments of the present invention and are not intended to limit the implementation scope of the present invention. If the present invention is modified or equivalently substituted without departing from the spirit and scope of the present invention, the protection shall be covered by the patent scope of the present invention. within the range.

1: Wire cutting equipment 2: Silicon rod to be processed 11: Wire cutting unit 12: Bearing unit 20:Device 21:accommodate module 22:Support module 23: Lifting module 24: Displacement control module 25:Protection module 26:Spray module 30:Equipment 111:Spool 112: Cutting line 121:Abutment 122: Intermediary software 221:Support plate 221a: first end 221b: second end 222:stop plate 223:Improvement mechanism 224:hinge 231: Clamping unit 232:Drive unit S: Silicon chip SY:Silicon chip queue R: manipulator

Figure 1 is a schematic diagram of a conventional wire cutting equipment. Figure 2 is a schematic diagram of another conventional wire cutting equipment. Figure 3 is a schematic diagram of a device for silicon wafer degumming provided by an embodiment of the present invention. FIG. 4 is another schematic diagram of a device for silicon wafer degumming provided by an embodiment of the present invention. FIG. 5 is a schematic diagram of a device for silicon wafer degumming provided by another embodiment of the present invention. FIG. 6 is a partial schematic diagram of the device for silicon wafer degumming shown in FIG. 5 . Figure 7 is a schematic diagram of a device for silicon wafer degumming provided by yet another embodiment of the present invention. FIG. 8 is a schematic diagram of a device for silicon wafer degumming provided by yet another embodiment of the present invention. FIG. 9 is a schematic diagram of a device for silicon wafer degumming provided by another embodiment of the present invention. FIG. 10 is a partial schematic diagram of the device for silicon wafer degumming shown in FIG. 9 . Figure 11 is a schematic diagram of a device for silicon wafer degumming provided by yet another embodiment of the present invention. Figure 12 is a schematic diagram of equipment for silicon wafer degumming provided by an embodiment of the present invention.

20:Device

21:accommodate module

22:Support module

122: Intermediary software

221:Support plate

221a: first end

221b: second end

222:stop plate

S: Silicon chip

SY:Silicon chip queue

R: manipulator

Claims (10)

A device for degumming silicon wafers, the device includes: A holding module with an open top is used to hold cleaning fluid and a queue of silicon wafers that have been wire-cut and are still bonded by glue; A support module provided in the accommodation module for supporting the silicon wafer queue; in, The support module includes: A support plate is provided on the bottom of the accommodation module, so that when the silicon wafer queue is placed on the support plate with each silicon wafer standing upright, the glued portion of the silicon wafer queue can be held by the silicon wafer queue. The cleaning liquid in the accommodation module is immersed, and the support plate includes a first end and a second end along the length direction of the support plate; a stop plate, which is arranged on the support plate perpendicularly to the support plate; Wherein, the support plate is configured to be rotatable around the first end relative to the accommodation module between a first position and a second position. In the first position, the support plate is positioned horizontally at the bottom of the accommodation module. On, in the second position, the second end of the support plate is raised to a predetermined height relative to the bottom of the accommodation module, so that each silicon chip is inclined toward the direction of the stopper plate. The device for silicon chip degumming as described in claim 1, wherein the support module further includes: a lifting module provided on the support plate, and the lifting module is configured to be able to lift the silicon from below. A wafer in the wafer queue so that the wafer can be separated from the glue on the wafer queue. The device for degumming silicon wafers as described in claim 2, wherein the lifting module includes: a clamping unit and a driving unit, the clamping unit is used to clamp the silicon wafer from below, and the driving unit is used to The clamping unit is driven to move upward to separate the clamped silicon wafers from the glue on the silicon wafer queue. The device for silicon chip degumming according to claim 1, wherein the support module further includes a lifting mechanism for moving the support plate around the first end between the first position and the second position. Rotate. The device for silicon chip degumming as claimed in claim 1, wherein the support plate is connected to the bottom of the accommodation module via a hinge at the first end. The device for silicon wafer degumming as described in any one of claims 1 to 5, the device further includes: a displacement control module, the displacement control module is used to control the stopper plate and the silicon wafer queued up The support plate moves toward the second end of the support plate, so that the designated silicon wafer in the silicon wafer queue can be moved to a predetermined position. The device for silicon chip degumming as described in claim 6, wherein the stop plate is disposed on the support plate in a manner that can slide on the support plate, and the displacement control module includes a power unit, and the power unit The unit is used to apply force to the stopper plate to push the silicon chip queue to move on the support plate toward the second end of the support plate through the stopper plate. The device for silicon wafer degumming as described in any one of claims 1 to 5, the device further includes: a protection module, the protection module is arranged in the silicon wafer queue in the horizontal direction in the accommodation module both sides. The device for silicon wafer degumming as described in any one of claims 1 to 5, the device further includes a spray module for spraying cleaning fluid to the silicon wafer queue to clean the silicon wafer queue. The silicon wafers in the silicon wafer queue are cleaned. An equipment for silicon wafer degumming, which includes: The device for silicon wafer degumming according to any one of claims 1 to 9; The chip picking robot is used to pick up the silicon wafer in the silicon wafer queue to separate the silicon wafer from the silicon wafer queue and remove the silicon wafer from the device.