CN115008621A

CN115008621A - Silicon wafer production system

Info

Publication number: CN115008621A
Application number: CN202210689626.2A
Authority: CN
Inventors: 丁海军; 邢旭; 兰勇刚
Original assignee: Leshan Gaoce New Energy Technology Co ltd
Current assignee: Gaoce Yancheng Technology Co ltd
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2022-09-06
Also published as: CN114559571A; CN114559571B; CN115230001A

Abstract

An embodiment of the present application provides a silicon wafer production system, including: the slicing machine is used for cutting the silicon rod into silicon wafers, and placing the silicon wafers and the crystal support assembly into the tool basket; the transportation trolley is used for transporting the tooling basket to the degumming device; the degumming device is internally provided with a staying space for accommodating the transport trolley; the degumming device is used for degumming and slicing the silicon wafer; the inserting and washing device is used for inserting the silicon wafers subjected to the slicing treatment; the degumming device comprises a silicon wafer operating line and a crystal support recycling line, and the conveying manipulator mechanism drives the tooling basket to move so that the silicon wafer sequentially undergoes degumming and frictioning on the silicon wafer operating line; and a thick sheet removing mechanical arm mechanism beside the crystal support recycling line removes the thick sheet on the crystal support assembly, and the crystal support assembly is placed into the crystal support recycling line through a conveying mechanical arm mechanism. The silicon wafer production system provided by the embodiment of the application can realize automatic degumming, glue wiping and slicing operation on the silicon wafer, and improves the production efficiency.

Description

Silicon wafer production system

The application is a divisional application of a patent application with an application date of 2022, 4 and 14 and an application number of 202210387322.0, and named as a silicon wafer production system.

Technical Field

The application relates to a silicon wafer production technology, in particular to a silicon wafer production system.

Background

In the traditional scheme, a small monocrystalline silicon battery is generally formed by cutting a monocrystalline silicon rod into a large silicon wafer, and then scribing and cutting the large silicon wafer by adopting a laser technology to form a small silicon wafer.

A slicing machine is an apparatus for slicing a bar of hard and brittle material, and is generally configured with two parallel main rollers arranged horizontally, and a single diamond wire wound around the two main rollers to form at least 2000 fretsaws. The silicon rod moves from top to bottom and penetrates through the two main rollers, and the main rollers rotate to drive the diamond wires to move at a high speed so as to slice the silicon rod.

A group of silicon wafers formed by cutting a silicon rod are placed into a tooling basket, the tooling basket is manually conveyed into a degumming device, and the silicon wafers sequentially enter a cleaning tank for pre-cleaning and enter a degumming tank for degumming. After the silicon wafer is degummed from the degumming tank, manually and visually check whether the silicon wafer has residual glue or not, and manually erase the residual glue. Then the silicon wafer is transferred to another type of tool basket and is carried to an inserting and washing device for inserting and washing.

From the above, it can be seen that: in the traditional scheme, more workers participate in the work, and the production efficiency and the product quality are greatly influenced.

Disclosure of Invention

In order to solve one of the technical defects, the embodiment of the application provides a silicon wafer production system.

According to a first aspect of embodiments of the present application, there is provided a silicon wafer production system including:

the slicing machine is used for cutting the silicon rod into silicon wafers, and placing the silicon wafers and the crystal support assembly into the tool basket;

the transportation trolley is used for transporting the tooling basket to the degumming device;

the degumming device is internally provided with a staying space for accommodating the transport trolley; the degumming device is used for degumming and slicing the silicon wafer;

the inserting and washing device is used for inserting the silicon wafers subjected to the slicing treatment;

the degumming device comprises:

a silicon wafer production line; the silicon wafer production line is provided with a degumming station and a glue wiping station; the degumming station is used for degumming the silicon wafer and the crystal support component contained in the tooling basket so as to separate the silicon wafer from the crystal support component; the glue wiping station is used for wiping the adhesive surface of the degummed silicon wafer so as to remove residual glue on the adhesive surface of the silicon wafer;

the crystal support recovery line is arranged in parallel with the silicon wafer operating line; a thick sheet dismantling station is arranged beside the crystal support recycling line; the thick sheet removing station is used for removing the thick sheet adhered to the crystal support assembly; the thick sheet removing station is provided with an image acquisition assembly for identifying the thick sheet and a thick sheet removing mechanical arm mechanism for clamping the thick sheet and separating the thick sheet from the crystal support assembly;

the conveying manipulator mechanism is used for grabbing the tooling baskets and driving the tooling baskets to sequentially move to the degumming station and the frictioning station; the wafer support assembly is also used for grabbing the wafer support assembly adhered with the thick sheet after degumming at the degumming station, driving the wafer support assembly to move to the thick sheet dismantling station, and placing the wafer support assembly into a wafer support recovery line after the thick sheet is dismantled.

According to the technical scheme, the silicon wafer and the crystal support assembly obtained by cutting the slicing machine are placed in the tooling basket, and the tooling basket is transferred to the degumming device through the transport trolley. And carrying out degumming treatment in a degumming device to separate the silicon wafer from the crystal support component, and carrying out slicing treatment. And then, the silicon wafer enters the inserting and washing device for inserting, the thick sheet on the crystal support assembly can be automatically broken off, and the crystal support assembly is placed in the crystal support recovery line, so that the automatic operation of the silicon wafer production process is realized, the production efficiency is improved, the manual participation is reduced, the silicon wafer damage can be reduced, and the yield is improved.

Drawings

Fig. 1 is a schematic structural diagram of a silicon wafer production system according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a degumming apparatus provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a silicon wafer placed in a tool basket according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a silicon wafer degumming treatment method applied to a degumming device according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of a crystal support assembly and a silicon wafer provided in an embodiment of the present application;

FIG. 6 is an enlarged view of area A of FIG. 4;

fig. 7 is a schematic structural diagram of an image acquisition assembly in a degumming apparatus provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a conveying manipulator mechanism in the degumming device provided by the embodiment of the present application;

FIG. 9 is a schematic view of another embodiment of a silicon wafer loading tool basket;

FIG. 10 is an enlarged partial schematic view of FIG. 2;

fig. 11 is a schematic structural diagram of a frictioning manipulator mechanism in the degumming device provided in the embodiment of the present application;

fig. 12 is a schematic structural diagram of a glue wiping mechanism in the degumming device provided in the embodiment of the present application;

fig. 13 is a schematic structural diagram of a rubber applying robot mechanism in the degumming device according to the embodiment of the present application;

FIG. 14 is an enlarged partial view of FIG. 2;

fig. 15 is a schematic structural view of a thick plate on a wafer support assembly according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram of a slab removing robot mechanism in a degumming device according to an embodiment of the present application;

fig. 17 is a schematic structural diagram of a thick-plate clamping jaw assembly in the degumming apparatus provided in the embodiment of the present application;

fig. 18 is a schematic structural view of a thick sheet clamping component in the degumming apparatus according to the embodiment of the present application for clamping a thick sheet;

FIG. 19 is a perspective view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 20 is a side view of a tool basket provided in accordance with an embodiment of the present application;

FIG. 21 is a top view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 22 is an enlarged view of area B of FIG. 21;

fig. 23 is a schematic structural diagram of a tooling basket entering a slicing station according to an embodiment of the present application;

FIG. 24 is a perspective view of a tooling basket provided in accordance with an embodiment of the present application;

FIG. 25 is a perspective view of a silicon wafer mounted on a tool basket according to an embodiment of the present application;

FIG. 26 is a side view of a tool basket provided in accordance with an embodiment of the present application;

fig. 27 is a perspective view of a tool basket and a trigger plate provided in an embodiment of the present disclosure;

FIG. 28 is a top view of a tool basket and trigger plate according to an embodiment of the present disclosure;

FIG. 29 is an enlarged view of area C of FIG. 22;

FIG. 30 is a cross-sectional view taken along line D-D of FIG. 26;

FIG. 31 is an enlarged view of area E of FIG. 30;

FIG. 32 is a schematic view of the structure of the baffle;

fig. 33 is a top view of another tooling basket applied to a slicing station according to an embodiment of the present disclosure.

Reference numerals:

1-slicing machine;

2-a degumming device; 21-silicon wafer production line; 211-degumming tank; 212-a transit trough; 22-a crystal support recovery line; 23-thick sheet collection basket; 24-a transport robot mechanism; 241-longitudinal guide rails; 242-transverse guide rails; 243-vertical guide rail; 2441-tooling top plate; 2442-tooling basket jaws; 2443-crystal holder jaw; 25-a thick sheet removing mechanical arm mechanism; 251-removing a thick sheet mechanical arm base; 252-a de-thicknessing robot arm; 253-thick plate jaw assembly; 2531-jaw holder; 2532-splint; 2533-jaw drive; 254-thick film acquisition camera; 255-thick light source; 26-a glue wiping manipulator mechanism; 261-a glue spreading manipulator base; 262-a glue wiping mechanical arm; 263-glue wiping mechanism; 2631-roller holder; 2632-a glue roller; 264-residual glue collecting camera; 265-a light source for applying glue; 271-a slide rail; 272-degumming collecting camera; 273-camera support; 274-a degumming light source;

31-a crystal support assembly; 311-metal plate; 312-resin plate; 32-thick piece; 33-a silicon wafer;

41-a belt transport mechanism;

5-a tooling basket; 511-frame front panel; 5111-front plate through hole; 512-frame back plate; 513-frame floor; 52-side support assembly; 521-an elastic cord; 522-a magnetic ring; 523-buffer sleeve; 524-a threaded fastener; 525-thread bush; 53-a bottom support assembly; 531-stainless steel rod; 532-rubber sleeve; 54-a tool rack; 541-a bottom frame plate; 542-front frame plate; 5421-shelf through hole; 543-rear frame plate; 55-a side stop assembly; 551-clamp plate stop lever; 552-a first strut; 553-a second strut; 56-a cleat assembly; 561-a baffle; 5611-an intermediate portion; 56111-a collar; 5612-a clamping portion; 5613-a trigger; 562-torsion spring; 563-clamping washer; 57-a bottom take-up assembly;

71-a slicing worktable; 721-a slice conveying mechanism; 722-a magnetic member; 723-slicing nozzle; 73-a trigger plate;

8-inserting and washing device.

Detailed Description

Fig. 1 is a schematic structural diagram of a silicon wafer production system according to an embodiment of the present application. As shown in fig. 1, the silicon wafer production system includes: the device comprises a slicer 1, a degumming device 2 and an insertion washing device 8.

Wherein, slicer 1 is used for cutting into the silicon chip with the silicon rod to place silicon chip and brilliant support subassembly in the frock basket. Before slicing by a slicer, the side of the square bar is glued and stuck on the crystal support component. The crystal support component is clamped by a silicon rod clamping jaw on the slicing machine 1 and moved to a cutting area for cutting. The silicon wafer obtained by cutting is adhered to the lower part of the crystal support component and cannot fall off at once, then the silicon wafer and the crystal support component are integrally arranged in a tooling basket, and the silicon wafer falls off from the crystal support component through a subsequent degumming process.

Adopt travelling bogie to transport the frock basket to device 2 that comes unstuck, travelling bogie can be for following the dolly that the track traveled, also can be for the dolly that traveles subaerial, and the frock basket is placed in the dolly top. Through travelling bogie with frock basket 5 from slicer automatic transfer to the mucilage binding that takes off, save artifical transport operation. A stopping space for accommodating a transport trolley is arranged in the degumming device 2, and the transport trolley directly enters the stopping space.

The degumming device 2 is used for degumming the silicon wafer so as to separate the silicon wafer from the crystal support assembly. The degumming device 2 can also perform the slicing treatment on the silicon wafers, so that each silicon wafer can be separated from the adjacent silicon wafer and can be taken out.

Insert and wash device 8 and be used for carrying out the inserted sheet to each silicon chip and handle, insert and wash device 8 and be provided with and insert and wash the frock basket, the silicon chip inserts and inserts in washing the frock basket.

In the above scheme, silicon chip and the brilliant subassembly that holds in the palm that the slicer cutting obtained place the frock basket in, transport the frock basket to the mucilage binding that takes off device through the travelling bogie. And carrying out degumming treatment in a degumming device to separate the silicon wafer from the crystal support component and carrying out slicing treatment. And then, the silicon wafer enters the inserting and washing device for inserting the silicon wafer, so that the automatic operation of the production process of the silicon wafer is realized, the production efficiency is improved, the manual participation is reduced, the damage of the silicon wafer can be reduced, and the yield is improved.

Further, a silicon wafer transfer mechanism is arranged between the degumming device and the inserting and washing device and used for transferring the silicon wafers subjected to the slicing treatment to the inserting and washing device. In this embodiment, the silicon wafer transferring mechanism is specifically a belt conveying mechanism, and is configured to transfer each silicon wafer to the inserting and washing device.

The embodiment provides a specific implementation manner of a degumming device, and the degumming device provided by the embodiment is used for degumming a silicon wafer.

Fig. 2 is a schematic structural diagram of a degumming device provided in the embodiment of the present application, and fig. 3 is a schematic structural diagram of a silicon wafer placed in a tool basket provided in the embodiment of the present application. As shown in fig. 2 and fig. 3, the degumming apparatus provided in this embodiment includes: a silicon wafer line 21. The silicon wafer operation line 21 is sequentially provided with a degumming station and a glue wiping station, wherein the degumming station is used for degumming the silicon wafer 33 and the crystal support component 31 which are contained in the tool basket 5 so as to separate the silicon wafer from the crystal support component. And the erasing station is used for wiping the adhesive surface of the degummed silicon wafer so as to remove residual glue on the adhesive surface of the silicon wafer.

In addition, the degumming device is also provided with a conveying manipulator mechanism 24 for grabbing the tool basket 5 and driving the tool basket 5 to move. Specifically, the silicon wafer 33 and the crystal support assembly 31 cut by the slicing machine are placed in the tool basket 5, and the transportation trolley conveys the tool basket 5 into the degumming device. The conveying mechanical arm mechanism 24 grabs the tooling basket 5, conveys the tooling basket 5 to a degumming station for degumming, and conveys the tooling basket 5 to a degumming station for degumming after degumming is completed.

Preferably, a waiting area is arranged in the degumming device, after the transport trolley enters the degumming device, the conveying manipulator mechanism 24 conveys the tool basket 5 provided with the silicon wafer and the crystal support assembly to the waiting area for waiting, then the transport trolley returns to the slicing machine for recycling, and after the degumming station is idle, the conveying manipulator mechanism 24 conveys the tool basket 5 provided with the silicon wafer and the crystal support assembly and positioned in the waiting area to the degumming station for degumming the silicon wafer.

Further, the degumming device is also provided with a crystal support recycling line 22, and the crystal support recycling line 22 and the silicon wafer operation line 21 are arranged side by side. And a thick sheet removing station is arranged beside the crystal support recycling line 22 and used for removing the thick sheet adhered to the crystal support assembly. The conveying manipulator mechanism 24 is also used for grabbing the crystal support assembly adhered with the thick plate and driving the crystal support assembly to move to the thick plate removing station after the tooling basket moves to the glue wiping station, so as to remove the thick plate. The transfer robot mechanism 24 then places the susceptor assembly on the susceptor recovery line 22 to return the susceptor assembly to the microtome for recycling.

Further, a tool basket recovery line is arranged in the degumming device and is arranged in parallel with the silicon wafer operation line 21 and the crystal support recovery line 22. The conveying manipulator mechanism 24 is also used for conveying the empty work basket to a work basket recycling line for recycling after the silicon wafers are completely sliced and taken away.

A specific implementation manner is as follows: as shown in fig. 2, the wafer processing line 21, the work basket recovery line, and the wafer carrier recovery line 22 are arranged side by side. The transport trolley loads the tooling basket 5, enters the degumming device 2 from the left side, and the conveying manipulator mechanism 24 grabs the tooling basket to move rightwards, enters a waiting area firstly, and then sequentially enters a degumming station and a frictioning station. The wafer carrier recovery line 22 and the tool basket recovery line are both transported from right to left to carry the wafer carrier assembly and the tool basket to the left.

The conveying manipulator mechanism 24 is arranged above and has at least six moving directions, so that the conveying manipulator mechanism 24 can freely move on each conveying line, production is matched, and efficiency is improved.

The degumming station is used for degumming the silicon wafer, and the embodiment provides a specific scheme that:

fig. 4 is a schematic structural diagram of a silicon wafer degumming treatment method applied to a degumming device according to an embodiment of the present application, and fig. 5 is a schematic structural diagram of a crystal support assembly and a silicon wafer according to an embodiment of the present application. As shown in fig. 4 and 5, the degumming station is provided with a degumming tank 211, and an image acquisition assembly is arranged above the degumming tank 211. The conveying manipulator mechanism 24 lifts the tool basket 5 to move and downwards enters the degumming tank 211 for degumming. After the degumming is primarily completed, the conveying manipulator mechanism 24 lifts the tooling basket 5 to the height of the image acquisition assembly, and acquires the side images of the silicon wafer and the crystal support assembly through the image acquisition assembly. And the image acquisition component performs data interaction with the processor.

Firstly, the processor acquires side images of the silicon wafer and the crystal support assembly, then determines the distance between the top of the silicon wafer and the bottom of the crystal support assembly according to the side images, judges whether the distance meets the degumming finishing condition or not, and finishes degumming if the distance meets the degumming finishing condition. In the degumming process, the silicon wafer is separated from the crystal support assembly and falls into the tool basket, and the distance between the silicon wafer and the crystal support assembly is increased, so that whether the silicon wafer is degummed or not can be determined according to the distance between the silicon wafer and the crystal support assembly, automatic identification is realized, high efficiency is achieved, high accuracy is achieved, and the yield is improved.

A specific implementation way is as follows: acquiring a side image of the silicon wafer and the crystal support assembly, which can be specifically as follows: the method comprises the steps of firstly controlling an image acquisition assembly to move at a constant speed along the length direction of a crystal support assembly, acquiring a plurality of side images of a silicon wafer and the crystal support assembly in the moving process, and then splicing the acquired side images to obtain a group of side images of the whole silicon wafer.

Specifically, fig. 6 is an enlarged view of an area a in fig. 4, and fig. 7 is a schematic structural diagram of an image capturing assembly in the degumming apparatus according to the embodiment of the present application. As shown in fig. 6 and 7, a slide rail 271 extending in the horizontal direction and a driving mechanism are disposed on the frame of the degumming apparatus, and the image acquisition component, specifically, the degumming acquisition camera 272, is disposed on the slide rail 271 through a camera bracket 273.

Further, control the image acquisition subassembly and hold in the palm the length direction uniform velocity of subassembly along the crystalline substance and move, specifically include: the work of control actuating mechanism drives the image acquisition subassembly and moves at the uniform velocity along slide rail 271, and slide rail 271 is the same with the length direction of brilliant support subassembly, promptly: extending in a horizontal direction. The driving mechanism drives the camera bracket 273 to slide along the horizontal direction relative to the sliding rail 271, and drives the degumming acquisition camera 272 to synchronously move. The length of the slide rail 271 is matched with the length of the crystal support assembly, so that the moving stroke of the degumming acquisition camera 272 can shoot the complete images of the crystal support assembly and the silicon wafer.

Further, a light source is provided on the top of the camera holder 273, and the light source moves together with the camera holder 273. The light source is called as a degumming light source 274, emits light towards the direction of the silicon wafer, and is used for improving the brightness in the shooting visual field of the camera and improving the image definition. The brightness of the degumming light source 274 may be constant or adjustable. In the embodiment, in the moving process of the camera, the brightness of the light source is adjusted in real time according to the collected side images, so that the brightness of different environments in the degumming device is adapted to obtain images with uniform brightness, bright-dark contrast exists at the edge of the top of the silicon wafer and the bottom of the crystal support assembly, and subsequent image analysis and feature extraction are facilitated to obtain the edge profile.

Alternatively, the light source 274 is an inductive light source, and a sensor is disposed thereon to sense the brightness of the reflected light and automatically adjust the brightness of the output light.

A specific implementation way is as follows: adjusting the brightness of the light source according to the collected lateral image comprises: determining the gray value of each pixel in the acquired side image; when the average gray value of each pixel is smaller than the lower gray limit value, controlling the light source to increase the brightness; and when the average gray value of each pixel is larger than the gray upper limit value, controlling the light source to reduce the brightness.

The gray value in the image can represent the brightness of the image, the gray value is 0-255, and the smaller the gray value is, the darker the image is; the larger the grayscale value, the brighter the image. Extracting the gray value of each pixel in the image, calculating the average value of the gray values of all the pixels, and if the average value is smaller than the lower gray limit value, indicating that the image is darker and needing to control a light source to increase the brightness; if the average value is larger than the upper gray limit value, the image is brighter, and the light source needs to be controlled to reduce the brightness.

Further, in the above step, the distance between the top of the silicon wafer and the bottom surface of the wafer support assembly is determined according to the side image, which can be specifically realized by the following method:

firstly, identifying silicon slice outlines in the side images by adopting an image processing and analyzing technology, wherein the silicon slice outlines at least comprise top and side outlines. The top edge profile of each wafer was then fit to a curve. The silicon wafers fall downwards after degumming, and part of the silicon wafers which are not completely degummed still adhere to the crystal support assembly and are higher in position, so that the silicon wafers are uneven.

And identifying the bottom edge profile of the crystal support assembly, wherein the crystal support assembly comprises a crystal support, a metal plate 311 and a resin plate 312 which are sequentially arranged from top to bottom, and the silicon wafer is adhered to the resin plate 312 before degumming. The bottom edge profile of the lowermost resin plate 312 in the tray assembly is fitted to a straight line.

And finally, acquiring the vertical distance between the fitting straight line and the fitting curve to obtain the shortest distance D as the distance between the top of the silicon wafer and the bottom surface of the crystal support assembly.

When the shortest distance is within a preset range, the degumming condition is met, degumming is finished, and the subsequent working procedures can be carried out; if the content is not within the preset range, the degumming condition is not met, and degumming needs to be carried out again. The preset range can be set according to different degumming processes or sizes of silicon wafers. For example: the preset range is 5mm-20mm, and when the shortest distance is 5mm-20mm, the degumming condition is satisfied.

Assuming that the degumming acquisition camera 272 and the degumming light source 274 are at a fixed height, after the preliminary degumming is completed, the conveying manipulator mechanism 24 is controlled to work to drive the tool basket 5 containing the silicon wafer 33 to ascend to a preset position, and the degumming acquisition camera 272 is ensured to be capable of completely acquiring images of the silicon wafer 33 and the viscose part of the crystal support assembly in the movement process.

After the separation of the silicon wafer and the crystal support assembly is confirmed through the scheme, the conveying manipulator mechanism 24 drives the tool basket 5 to move to the transfer groove of the glue wiping station.

On the basis of the above technical solution, the present embodiment further provides an implementation manner of the conveying manipulator mechanism 24:

fig. 8 is a schematic structural diagram of a conveying manipulator mechanism in a degumming apparatus provided in an embodiment of the present application. As shown in fig. 8, the transfer robot mechanism 24 includes: longitudinal rail 241, transverse rail 242, vertical rail 243, jaw assembly, vertical drive, transverse drive, longitudinal drive.

The longitudinal guide rails 241 extend along the crystal support recovery line direction, and the number of the longitudinal guide rails 241 is two and the longitudinal guide rails are arranged side by side. The transverse guide 242 is perpendicular to the direction of the wafer carrier recovery line and is disposed between the two longitudinal guides 241. The longitudinal driver is used to drive the transverse rail 242 and the jaw assembly to move along the longitudinal rail 241 as a whole.

The vertical rail 243 extends in a vertical direction and the vertical driver drives the jaw assembly up and down along the vertical rail 243. The lateral driver is used to drive the jaw assembly and the vertical rail 243 to move integrally along the lateral rail. So that the clamping jaw assembly can move along the longitudinal direction, the transverse direction and the vertical direction.

The clamping jaw assembly is used for clamping the tool basket. Specifically, the clamping jaw subassembly includes: a tooling top plate 2441 and tooling basket clamping jaws 2442. Wherein, frock roof 2441 links to each other with vertical driver. Frock basket clamping jaw 2442 sets up in the bottom surface of frock roof, and frock basket clamping jaw 2442 extends along vertical direction, and its bottom is reverse to be buckled and is formed hook-like structure, and hook-like structure is hung on the frock basket, can hoist the frock basket.

In the operation process, the clamping jaw assembly is adjusted to reach the upper side of the tool basket through the transverse driver and the longitudinal driver, then the clamping jaw assembly is driven to descend through the vertical driver, the hooked structure of the clamping jaw 2442 of the tool basket is located on the side face of the tool basket, then the clamping jaw assembly is driven to move transversely through the transverse driver, so that the hooked structure of the clamping jaw 2442 of the tool basket is inserted into the lower portion of a hanging rod in the tool basket, then the clamping jaw assembly is driven to ascend through the vertical driver, and the tool basket is lifted and moved.

Further, the clamping jaw assembly still includes: a crystal support clamping jaw 2443 for clamping the crystal support assembly and a driving mechanism for driving the crystal support clamping jaw 2443 to transversely move are arranged on the bottom surface of the tooling top plate 2441. The wafer holder clamp 2443 can be moved or elongated in the transverse direction to accommodate the size requirements of the wafer holder assembly. The structure of the wafer holder clamp 2443 can be set according to the hanging structure of the wafer holder assembly, for example: the top of the crystal support component is provided with a T-shaped groove, and the crystal support clamping claw 2443 is of a T-shaped structure and is inserted into the T-shaped groove at the top of the crystal support component so as to lift the crystal support component.

The wafer support assembly is lifted away by the conveying manipulator mechanism 24, the rest silicon wafers and the tooling basket are shown in fig. 9, and fig. 9 is another schematic structural diagram of the silicon wafer placing device provided by the embodiment of the application in the tooling basket.

Fig. 10 is a partially enlarged schematic view of fig. 2. As shown in fig. 2 and 10, the transfer slot 212 is disposed at the glue station 22, and the image capturing assembly and the glue spreading robot 26 are disposed beside the transfer slot 323. The image acquisition assembly is used for identifying the residual glue of the silicon wafer, and the glue wiping manipulator mechanism 26 is used for wiping the residual glue of the silicon wafer. Compared with the traditional manual erasing mode, the scheme provided by the embodiment has higher efficiency, and more operators are not needed, so that on one hand, the labor input is reduced, and the workload of the operators is reduced; on the other hand, the production rate is also improved.

The embodiment provides an implementation manner of a glue wiping manipulator mechanism: fig. 11 is a schematic structural diagram of a frictioning manipulator mechanism in the degumming device provided by the embodiment of the application. As shown in fig. 11, the glue wiping robot 26 includes: a rubber-wiping mechanical arm 262, a rubber-wiping mechanical arm 263. Wherein, the glue wiping manipulator base 261 is fixed on the work table. The glue wiping mechanical arm 262 is rotatably disposed on the glue wiping mechanical arm base 261 and can rotate relative to the glue wiping mechanical arm base 261. The dispensing robot 262 has at least 2 degrees of freedom, and may have more than 2, 3, 4, 5, 6, or 6 degrees of freedom, for example, to enable the working end of the dispensing robot 262 to move precisely. The glue wiping mechanism 263 is disposed at the working end of the glue wiping mechanical arm 262, and is used for wiping residual glue on the silicon wafer.

A specific implementation manner is as follows: fig. 12 is a schematic structural diagram of a glue wiping mechanism in the degumming device according to the embodiment of the present application. As shown in fig. 12, the glue wiping mechanism 263 includes: a roller mount 2631 and a squeegee 2632. The roller holder 2631 is disposed at the working end of the mechanical arm 262 of the dispensing machine. The rubbing roller 2632 is disposed on the roller holder 2631, and the rubbing roller 2632 is rotatable. The surface of the rubbing roller 2632 is provided with a glue removing layer capable of adhering glue, and the rubbing roller 2632 rolls on the side of the silicon wafer 33 to take away residual glue on the silicon wafer 33, so that the glue removing effect is achieved. The adhesive removing layer is made of soft and sticky materials.

Further, the image collecting assembly can be arranged on the roller bracket 2631, the image collecting assembly can specifically collect the camera 264 for the residual glue, and is arranged on the roller bracket 2631, and the residual glue collects the image of the camera 264 towards the direction of the silicon chip. The scrub robot 262 can move according to the collected image to drive the scrub roller 2632 to contact and roll on the silicon wafer.

Further, a light source (i.e., the light source 265 for wiping in fig. 12) may be disposed on the roller holder 2631. The light emitting direction of the glue wiping light source 265 faces the silicon wafer to be glued so as to improve the brightness of the region and facilitate the collection of clear images. The light source 265 may be a monochromatic light source, and the brightness thereof may be set according to the brightness of the working environment of the degumming device.

A specific scheme is as follows: as shown in fig. 9, a plurality of silicon chips 33 are accommodated in the tool basket 5, and the side of the silicon chip 33 having the residual glue is upward. The residual glue collecting camera 264 is disposed on the lower surface of the roller bracket 2631 to collect residual glue images therebelow. The light emitting direction of the rubbing light source 265 is downward to improve the luminance of the lower region.

Based on the above implementation manner of the frictioning station, this embodiment further provides a frictioning method: firstly, acquiring a silicon wafer image of a silicon wafer adhesive surface through an image acquisition assembly. The image acquisition assembly is in data interaction with the processor, the processor acquires a silicon wafer image of the adhesive surface of the silicon wafer, and then whether residual adhesive exists on the adhesive surface of the silicon wafer is determined according to the silicon wafer image. And when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer.

Further, in the above step, the glue wiping manipulator mechanism is controlled to wipe off the residual glue on the adhesive surface of the silicon wafer, and the following method can be specifically adopted:

firstly, acquiring the current position of a glue wiping manipulator mechanism and the position of a silicon wafer, and then controlling the glue wiping manipulator mechanism to move to the adhesive surface of the silicon wafer according to the current position of the glue wiping manipulator mechanism and the position of the silicon wafer; and controlling a glue wiping mechanical arm mechanism to wipe glue on the silicon wafer adhesive surface according to a preset glue wiping track.

Fig. 13 is a schematic structural diagram of a rubber applying robot mechanism in the degumming device according to the embodiment of the present application. As shown in fig. 13, specifically, controlling the mechanical arm mechanism for applying the adhesive on the adhesive surface of the silicon wafer according to the preset adhesive applying track includes: and controlling the glue wiping mechanical arm mechanism to move back and forth on the adhesive surface of the silicon wafer along the width direction of the group of silicon wafers from the end part of the group of silicon wafers for wiping until the other end part of the group of silicon wafers is reached. The group of silicon wafers is a collection of all silicon wafers obtained by slicing one silicon rod.

After finishing the frictioning of a group of silicon wafers, the method further comprises the following steps: controlling the gluing manipulator mechanism to move to a preset initial position, and acquiring an image of the adhesive surface of the silicon wafer again; determining whether residual glue exists on the adhesive surface of the silicon wafer again according to the re-acquired image; and when the residual glue exists, controlling the glue wiping mechanical arm mechanism to wipe the residual glue on the adhesive surface of the silicon wafer again until the residual glue is completely removed.

The embodiment also provides another glue wiping mode: controlling the frictioning manipulator mechanism to frictioning on the silicon wafer adhesive surface according to a preset frictioning track, and adopting the following mode: acquiring the length of a group of silicon wafers, and dividing the length into at least two sections; and the at least two sections of silicon wafers are repeatedly wiped at least twice, so that the step of re-acquiring the image in the scheme is omitted, and the wiping quality is improved.

For example: dividing the length into three segments; and respectively wiping the three sections of silicon wafers twice.

In addition, after at least two sections of silicon wafers are respectively wiped, the adhesive surface images of the silicon wafers can be respectively collected; and determining whether residual glue exists in each section of silicon wafer according to the viscose surface image of each section of silicon wafer, and if so, wiping the section of silicon wafer again.

A specific implementation manner is as follows: setting a preset photographing initial position, and when needing to perform frictioning, firstly controlling the frictioning manipulator mechanism to move to the initial position for photographing, and acquiring a silicon wafer adhesive surface image. Dividing the viscose surfaces of a group of silicon wafers into three sections, moving the section from the initial position to the first section, wiping the section twice along the width direction of the group of silicon wafers in a reciprocating manner, moving the section to the next section, wiping the section twice in a reciprocating manner, and finally moving the section to the third section, wiping the section twice in a reciprocating manner.

And then respectively photographing the three sections of silicon wafers, analyzing whether residual glue exists in the image of each section of silicon wafer, and controlling the glue wiping mechanical arm mechanism to move to the corresponding position for glue wiping again if the residual glue exists.

Furthermore, a light source is arranged in the degumming device, and the light source emits light towards the silicon wafer adhesive surface and is used for improving the visual field brightness of the image acquisition assembly. In the process of collecting images by the image collecting assembly, the brightness of the light source is adjusted according to the collected silicon wafer images, and the light source can be arranged on the mechanical hand mechanism of the glue wiping machine and also can be arranged on the frame of the glue removing device.

The conveying manipulator mechanism 24 lifts the wafer support assembly in the transfer tank 212, conveys the wafer support assembly to a thick sheet removing station, and breaks off the thick sheet from the wafer support assembly. The slab removal station is provided with an image acquisition assembly for identifying the slab and a slab removal manipulator mechanism for clamping the slab and separating the slab from the crystal support assembly, and then the conveying manipulator mechanism 24 places the crystal support assembly into the crystal support recovery line 22 so as to transport the crystal support assembly back to the slicing machine for recycling. Fig. 14 is a partial enlarged view of fig. 2, and fig. 15 is a schematic structural view of a thick plate on a wafer support assembly according to an embodiment of the present disclosure. As shown in fig. 2, 14 and 15, specifically, when the conveying robot mechanism 24 drives the wafer support assembly to move to the vicinity of the slab removing robot mechanism 25, the image capturing assembly acquires the front side image and identifies the slab. When the processor identifies the thick plate according to the image and determines the position of the thick plate, the thick plate removing mechanical arm mechanism 25 is controlled to move to the position to clamp the thick plate, and the thick plate is driven to move horizontally, move downwards and/or rotate so as to take the thick plate off the wafer support assembly, and then the thick plate is placed in the thick plate collecting area.

The above-described sheet removal robot mechanism 25 may be fixed to the ground or may be fixed to a table higher than the ground. In this embodiment, a workbench is disposed in the degumming apparatus, the slab removal manipulator mechanism 25 is fixed on the workbench, a slab collection basket 23 is disposed in the slab collection area, and the slab removed by the slab removal manipulator mechanism 25 is placed in the slab collection basket 23.

Further, the embodiment provides an implementation manner of the mechanism of the thick sheet removing manipulator:

fig. 16 is a schematic structural diagram of a slab removing robot mechanism in a degumming apparatus according to an embodiment of the present application. As shown in fig. 16, the slab removal robot mechanism includes: a de-thicknessing robot base 251, a de-thicknessing robot arm 252, and a thick film gripper assembly 253. Wherein, the robot base 251 is disposed on the worktable. The tablet removal robot 252 is rotatably disposed on the tablet removal robot base 251 and is rotatable with respect to the tablet removal robot base 251. The de-chuck robot 252 has at least 2 degrees of freedom, for example, 2, 3, 4, 5, 6, or 6 or more degrees of freedom, to enable the working end of the de-chuck robot 252 to move precisely. A slab gripper assembly 253 is provided at the working end of the slab removal robot 252 for gripping the slab.

The embodiment provides an implementation manner: the slab jaw assembly 253 includes: a jaw support, a jaw, and a jaw driver. Wherein the gripper bracket is rotatably disposed at the working end of the de-thicknessing robot arm 252, and an accommodating cavity is disposed in the gripper bracket. The clamping jaw is arranged in the accommodating cavity. The clamping jaw driver is arranged on the clamping jaw support and used for driving the clamping jaw to perform clamping action.

The structure of the clamping jaw can be various, for example, the following modes can be adopted:

fig. 17 is a schematic structural view of a thick-plate clamping jaw assembly in the degumming device according to the embodiment of the application, and fig. 18 is a schematic structural view of a thick plate clamped by the thick-plate clamping jaw assembly in the degumming device according to the embodiment of the application. As shown in fig. 17 and 18, in the present embodiment, the jaw support 2531 has a rectangular parallelepiped structure, and is provided with a receiving cavity therein, and an opening communicating with the receiving cavity is provided at one end.

The clamping jaw includes: two parallel and opposing clamp plates 2532 are disposed in the receiving cavity. The jaw drivers 2533 are respectively connected to the two clamp plates 2532 for driving the two clamp plates 2532 toward each other to generate a clamping action, and away from each other.

During application, the slab removal robot 252 drives the slab gripper assembly to move below the slab 32, adjusting the distance between the two clamp plates 2532 to be greater than the thickness of the slab 32. The slab removal robot 252 drives the slab gripper assembly to move slowly upward until the two clamp plates 2532 are positioned on either side of the slab 32, driving the two clamp plates 2532 closer to each other to contact the slab 32, and applying a clamping force to the slab 32. Thereafter, the wafer removal robot 252 may move the wafer chuck assembly downward or horizontally, or may rotate horizontally to separate the wafer 32 from the wafer support assembly 31.

The jaw driver 2533 may be a pneumatic cylinder, a hydraulic cylinder or a drive motor.

Further, the thick plate jaw assembly 253 further includes: and the clamping jaw telescopic driver is arranged in the accommodating cavity, is connected with the clamping jaw and is used for driving the clamping jaw to extend out of the accommodating cavity so as to execute clamping action. Still taking the clamping plate 2532 as an example, specifically, in the non-working state, the clamping jaw telescopic driver drives the clamping plate 2532 to retract into the accommodating cavity, and the clamping jaw bracket 2531 can protect the clamping plate 2532 from being damaged. In the working state, the clamping plate 2532 is driven to move outwards by the clamping jaw telescopic driver, and extends out of the opening of the clamping jaw bracket 2531 to perform the operation of clamping the thick sheet.

The image acquisition assembly can be specifically a thick sheet acquisition camera 254 and is arranged on the outer surface of the clamping jaw support 2531, and the thick sheet acquisition camera 254 acquires images towards the direction of the crystal support assembly. The de-thicknessing robot arm 252 may operate based on the captured images.

Furthermore, a light source (i.e., a thick light source 255 in FIG. 17) may be disposed on the jaw support 2531. The light exiting direction of the thick sheet light source 255 faces the crystal support assembly to improve the brightness of the area, so that a clear image can be conveniently collected. The thick light source 255 may be a monochromatic light source, and the brightness thereof may be set according to the brightness of the working environment of the degumming apparatus.

After the slab is broken off, the image acquisition assembly can recognize the state, and then the conveying mechanical arm mechanism 24 is controlled by the controller to place the crystal support assembly into the crystal support recovery line 22 and convey the crystal support assembly back to the slicing station for recycling.

Further, this embodiment also provides an implementation manner of the above-mentioned tool basket 5, and this tool basket 5 is used for containing the silicon wafers produced by the slicing machine cutting, and conveying the silicon wafers to the degumming device for degumming, frictioning and slicing. Silicon wafers are transported between different stations through a tooling basket, eliminating the need to transfer silicon wafers from one tooling basket to another.

Fig. 19 is a perspective view, fig. 20 is a side view, and fig. 21 is a plan view of a tool basket according to an embodiment of the present disclosure. As shown in fig. 19 to 21, the present embodiment provides a tool basket including: a tooling basket frame and side support assemblies 52.

Wherein, the tool basket frame can be a cuboid structure, and the length direction of the tool basket frame is the Y direction in fig. 20; the width direction of the tool basket frame is the X direction in FIG. 21; the height direction of the tool basket frame coincides with the vertical direction, such as the Z direction in fig. 20.

An accommodating space for accommodating the silicon wafer is formed in the silicon wafer accommodating device, and an opening for the silicon wafer to enter and exit the accommodating space is formed in the top of the tooling basket frame. A group of silicon wafers from the slicing machine fall from the opening into the accommodating space. In the accommodation space was located in vertical inserting of silicon chip, the silicon chip was perpendicular with the length direction of frock basket frame, and a plurality of silicon chips are arranged side by side, arrange along length direction in proper order.

The side supporting components 52 are arranged in the accommodating space, are respectively connected to two sides of the tooling basket frame, and are used for clamping silicon wafers from two sides to prevent the silicon wafers from toppling over. The side support component 52 extends along the length direction of the tool basket frame, the length of the side support component 52 can be set according to the length of a group of silicon wafers, and also can be set according to the length of a silicon rod before slicing, and the length of the side support component 52 is slightly larger than the length of a group of silicon wafers, so that all the silicon wafers can be clamped.

Be equipped with in the collateral branch supporting component 52 and inhale the piece, when the side of frock basket was equipped with magnetic part, magnetic part and inhale and produce magnetic attraction between the piece, impel and inhale the collateral branch supporting component 52 near the piece of magnetism and outwards warp to the clamp force that makes to the silicon chip disappears, then the silicon chip that loses the clamp force is in free state. The slicing medium is sprayed towards the side of the silicon wafer through the slicing nozzle on the side face of the tooling basket, so that the distance between the silicon wafer and the adjacent silicon wafer is increased, and the slicing effect is achieved. And subsequently taking out the separated silicon wafer for subsequent production procedures.

The tooling basket provided by the embodiment is used for containing silicon wafers output from a slicing machine and then sending the silicon wafers into a degumming device for degumming and slicing, the tooling basket can adapt to degumming stations, frictioning stations and slicing stations, the silicon wafers do not need to be transferred into another tooling basket among the stations, the operating requirements of the stations can be met by using the same tooling basket, the automation of the process flows of the degumming, frictioning and slicing links is realized, on one hand, the time is saved, and the production efficiency is improved; on the other hand, the condition that the silicon wafer is collided and damaged in the transfer process is reduced, the yield is improved, and the production cost is reduced.

The tooling basket frame can be of a box structure and also can be of a hollow skeleton structure. The embodiment provides a specific implementation manner: as shown in fig. 19 to 21, the tool basket frame includes: a frame front panel 511, a frame back panel 512, and a frame bottom panel 513. The frame bottom plate 513 is a rectangular plate, the frame front plate 511 and the frame back plate 512 are parallel and opposite to each other, and the frame front plate 511 and the frame back plate 512 are respectively and vertically connected to two ends of the frame bottom plate 513 in the length direction.

The side support assembly 52 is connected between the frame front plate 511 and the frame rear plate 512, and the height of the side support assembly 52 is set according to the height of the silicon wafer, and the side support assembly 52 is located at the center height of the silicon wafer or higher than the center height. The number of the side support assemblies 52 is two and are respectively connected to the X-direction edge positions of the frame front plate 511 and the frame rear plate 512.

Fig. 22 is an enlarged view of region B in fig. 21. As shown in fig. 21 and 22, one implementation: the side support assembly 52 includes: an elastic cord 521, a magnetic ring 522 and a cushion sleeve 523. The elastic string 521 extends along the length direction of the tool basket frame and is connected between the frame front plate 511 and the frame rear plate 512. The elastic strands 521 have a certain stretch deformability.

The magnetic ring 522 is used as a magnetic member and is sleeved on the elastic rope. The number of the magnetic rings 522 is plural, and the plural magnetic rings are arranged at intervals. The buffer sleeve 523 is sleeved outside the magnetic rings 522, and is in press fit with the magnetic rings 522, so that relative sliding cannot occur. The damping sleeve 523 and the magnetic ring 522 may rotate together relative to the elastic cord. The magnetic ring 522 may be a circular ring, and may have a diameter of about 10 mm. The magnetic ring 522 may be made of a material that can generate a magnetic attraction with the magnetic member, for example: an electromagnet, a permanent magnet, or iron. In this embodiment, the magnetic ring 522 is an iron ring.

The damping sleeve 523 may be made of a material having a certain damping capacity, such as: rubber, silica gel, sponge, and the like. In this embodiment, a sponge is taken as an example, and the buffer sleeve 523 is specifically a sponge sleeve, which does not damage the silicon wafer while clamping the silicon wafer.

The elastic string 521 can be connected to the frame front plate 511 and the frame rear plate 512 in the same manner, for example, as follows:

taking the frame front plate 511 as an example, the frame front plate 511 is provided with a front plate through hole 5111, one end of the threaded sleeve 525 is connected with the elastic rope 521, and the other end is inserted into the front plate through hole 5111. The threaded sleeve 525 is provided with a threaded hole matched with the threaded fastener 524, the threaded fastener 524 is inserted into the threaded hole to be tightly connected with the threaded sleeve 525, and the threaded sleeve 525 is fixed on the frame front plate 511.

One way is as follows: the center line of the threaded hole is perpendicular to the center line of the threaded sleeve 525, and a front plate attachment hole having a center line perpendicular to the front plate through hole is formed in the side surface of the frame front plate 511. The threaded fastener 524 is threaded through the front plate attachment hole and then threaded into the threaded hole of the threaded sleeve 525 for attachment. The threaded fastener 524 also serves as a stop to prevent the threaded sleeve 525 from coming out of the front plate through hole. The position of the side support assembly can also be adjusted by adjusting the threaded fastener 524 to accommodate silicon wafers of different specifications.

The other mode is as follows: the centerline of the threaded hole is parallel to the centerline of the threaded sleeve 525. The opening of one end of the front plate through hole 5111 far away from the elastic rope is smaller than the head of the threaded fastener 524, so that the tail of the threaded fastener 524 enters from the front plate through hole 5111 and is screwed and fixed with the threaded hole of the threaded sleeve 525, and the head of the threaded fastener 524 is positioned on one side of the frame front plate 511 far away from the elastic rope 521, so that the threaded sleeve 525 can be limited from being separated from the front plate through hole.

Further, the front plate through hole 5111 is an oblong hole extending in the width direction of the tool basket frame. The width between the two side support assemblies 52 can be adjusted by adjusting the position of the threaded sleeve 525 in the oblong hole, so that the silicon wafers with different width sizes can be adapted.

On the basis of the technical scheme, the tooling basket further comprises a bottom supporting component 53 arranged at the bottom of the accommodating space, the silicon wafer enters the accommodating space and then is placed on the bottom supporting component 53, and the bottom supporting component 53 plays a role in supporting the silicon wafer from the bottom. Specifically, bottom support assembly 53 is coupled between frame front panel 511 and frame back panel 512. The number of the bottom support members 53 is two and they are arranged at intervals.

The bottom support assembly 53 includes: a stainless steel rod 531 and a rubber sleeve 532. Wherein, the stainless steel rod 531 is vertically connected between the frame front plate 511 and the frame rear plate 512, and the rubber sleeve 532 is sleeved outside the stainless steel rod 531. The stainless steel rod 531 plays a role in rigid support, and the rubber sleeve 532 plays a role in buffer protection, so that the silicon wafer is prevented from being damaged.

A set of wafers 33 from the microtome are adhered to the susceptor assembly 31 and placed integrally with the susceptor assembly 31 into the tool basket 5, as shown in detail in fig. 2. And then, conveying the tool basket into a degumming device for degumming. After degumming, the silicon wafer 33 is separated from the crystal support component 31, the silicon wafer 33 is left in the tool basket 5, the crystal support component 31 is recovered, as shown in fig. 9, a slicing station is further arranged behind the degumming station and the glue wiping station, and the tool basket 5 is sent to the slicing station after glue wiping.

Fig. 23 is a schematic structural diagram of a tooling basket entering a slicing station according to an embodiment of the present application. As shown in fig. 23, the silicon wafer line of the degumming apparatus is further provided with a slicing station, and the slicing station is provided with a slicing table 71, a slicing conveying mechanism 721, a magnetic member 722 and a slicing nozzle 723.

The sheet conveying mechanism 721 is provided on the sheet table 71. The work basket 5 is provided to the slice conveying mechanism 721, and is movable in the longitudinal direction of the work basket 5, that is, in the Y direction in fig. 7, by the slice conveying mechanism 721. The region in which the tool basket 5 moves serves as a stroke region.

The magnetic elements 722 are disposed on both sides of the tool basket travel area, for example: magnetic parts 722 are symmetrically arranged on two sides of the stroke area of the tool basket. The magnetic member 722 can generate a magnetic attraction force with the magnetic member (magnetic ring 522) on the tool basket 5. The slicing nozzle 723 is disposed at two sides of the tool basket stroke area, and is adjacent to the magnetic member 722, and an outlet of the slicing nozzle 723 faces the tool basket stroke area. The slicing nozzle 723 may eject a slicing medium, which may be a gas or a liquid.

Taking fig. 23 as an example, the tool basket 5 moves from left to right, when moving to the position of the magnetic member 722, the magnetic force action between the magnetic member 722 and the magnetic ring 522 causes the side support assembly 52 in the area of the magnetic ring 522 to stretch and deform outwards, the silicon wafer 33 at the position is away from the position, the clamping force on the silicon wafer is lost, the slicing nozzle 723 sprays water towards between two adjacent silicon wafers, so that the adjacent silicon wafers are separated, the distance is increased, and the silicon wafers can be conveniently taken out from the tool basket.

The tool basket 5 continues to move rightwards, the magnetic rings 522 are sequentially subjected to magnetic force from the right to the left direction, the side support assemblies 52 sequentially stretch outwards and deform, and the silicon wafer losing the clamping force is separated from the adjacent silicon wafer after being sprayed with water and is taken out. In the above scheme, only a small part of the silicon wafer can be taken out after losing the clamping force through the matching of the magnetic part 722 and the magnetic part, and the rest part of the silicon wafer still is in the clamped state and cannot fall over.

The conveying mechanism 721 may specifically include: conveying screw rod, conveying slip table and driving motor. Wherein the conveyor screw extends in the longitudinal direction of the tool basket 5. Transport the slip table and transport the screw rod and pass through screw-thread fit, transport the slip table and link to each other with the frock basket. The driving motor drives the conveying screw to rotate so as to drive the conveying sliding table and the tooling basket 5 to move along the Y direction.

As shown in fig. 10, a belt transport mechanism 41 is provided at the front end of the conveyor screw, and a belt in the belt transport mechanism 41 includes a vertically moving portion which is adjacent to the work basket 5 and a horizontally moving portion on which a glue is applied. The silicon wafers after being sliced in the steps are contacted with the surface of the belt, adhered to the belt, and horizontally moved to the inserting and washing device along the direction of the belt moving upwards and away from the tool basket in sequence. Insert the washing device and be equipped with the inserted sheet frock basket in, each silicon chip is inserted in the inserted sheet frock basket.

This embodiment provides another kind of frock basket 5's implementation, carries out the centre gripping to the silicon chip at burst in-process automation, avoids lodging, and can cooperate the burst station to separate the silicon chip.

Fig. 24 is a perspective view of a tool basket provided in an embodiment of the present application, fig. 25 is a perspective view of a silicon wafer mounted on the tool basket provided in the embodiment of the present application, fig. 26 is a side view of the tool basket provided in the embodiment of the present application, fig. 27 is a perspective view of the tool basket provided in the embodiment of the present application and a trigger plate, and fig. 28 is a top view of the tool basket provided in the embodiment of the present application and the trigger plate.

As shown in fig. 24 to 28, the present embodiment provides a tool basket including: a tool rack 54, a side stop assembly 55 and a clamp plate assembly 56. The tool rest 54 is a base structure for supporting the silicon wafer and mounting the components. In the present embodiment, the setting tool rest 54 has a longitudinal direction Y, a width direction X, and a height direction Z.

The side blocking assemblies 55 are disposed on two sides of the tool rack 54, and the side blocking assemblies 55 and the tool rack 54 enclose an accommodating space for accommodating the silicon wafer 33. A group of silicon wafers 33 enter the accommodating space from the upper part, the silicon wafers 33 are vertically inserted into the accommodating space, the silicon wafers 33 are vertical to the Y direction, and the silicon wafers 33 are arranged side by side and are sequentially arranged along the Y direction.

The debonding device is provided with a trigger plate 73 that cooperates with the clamping plate assembly 56 to effect clamping or unclamping of the silicon wafer 33. The clamp plate assembly 56 is rotatably disposed on the side stop assembly 55. The clamp assembly 56 is initially in a first position for clamping the wafer 33 and is rotated relative to the side stop assembly 55 to a second position for releasing the wafer 33 when forced by the trigger plate 73.

The number of the chucking assembly 56 is plural, and they are arranged in order in the Y direction. The arrangement length of the clamping plate component 56 can be set according to the length of a group of silicon wafers, and can also be set according to the length of the silicon rod before slicing, and the arrangement length of the clamping plate component 56 is slightly larger than the length of a group of silicon wafers, so that all the silicon wafers can be clamped.

After the wafer is placed in the tool basket, the clamping plate assembly 56 is in the first position, clamping the wafer 33. The tooling basket is placed into the slicing station, when the tooling basket is subjected to the acting force exerted by the trigger plate 73, a certain clamping plate assembly 56 rotates to the second position, the silicon wafer 33 is loosened, the clamping force on the silicon wafer disappears, and the silicon wafer losing the clamping force is in a free state. The slicing medium is sprayed towards the side of the silicon wafer through the slicing nozzles on the side face of the tool basket, so that the distance between the silicon wafer and the adjacent silicon wafer is increased, and the slicing effect is achieved. And subsequently taking out the separated silicon wafer for subsequent production procedures. While the remaining clamp plate assemblies 56 still clamp the remaining silicon wafers 33.

The tool frame can be of a box-type structure and also can be of a hollow skeleton-type structure. The embodiment provides a specific implementation manner: the tool rest 54 includes: a chassis plate 541, a front chassis plate 542, and a rear chassis plate 543. The chassis plate 541 is a rectangular plate-shaped structure, and the length direction thereof is the Y direction. The front chassis 542 and the rear chassis 543 are parallel, and the front chassis 542 and the rear chassis 543 are connected to both ends of the chassis 541 in a length direction, respectively, and are perpendicular to the length direction of the chassis 541. The side stop assembly 55 is connected between the front frame plate 542 and the rear frame plate 543.

A specific implementation manner is as follows: the bottom ends of the rear frame plate 543 and the front frame plate 542 are connected to the chassis plate 541, and the top end of the rear frame plate 543 is higher than the front frame plate 542. The top end of the rear frame plate 543 may be higher than the silicon wafer 33, and the silicon wafer 33 may abut against the rear frame plate 543. The front frame plate 542 and the bottom frame plate 541 are detachably connected, so that the front frame plate is convenient to disassemble and assemble and is also convenient for placing a silicon wafer.

This embodiment also provides an implementation of a side stop assembly, fig. 29 is an enlarged view of the area C in fig. 22, fig. 30 is a cross-sectional view taken along the direction D-D in fig. 26, and fig. 31 is an enlarged view of the area E in fig. 30; fig. 32 is a schematic structural view of a baffle plate. As shown in fig. 24 to 32, the side shield assembly 55 includes: a cleat stop 551, a first strut 552, and a second strut 553. The clamping plate blocking rod 551, the first supporting rod 552 and the second supporting rod 553 are parallel and are vertically connected between the front frame plate 542 and the rear frame plate 543. The clamping plate stop rod 551, the first support rod 552 and the second support rod 553 are distributed on three different vertical surfaces, the clamping plate stop rod 551 is higher than the first support rod 552, and the first support rod 552 is higher than the second support rod 553.

For example: the clamping plate stop bars 551, the first support bar 552 and the second support bar 553 on two sides of the tool rack are symmetrically arranged. The distance between the two second struts 553 is smaller than the distance between the two first struts 552, and the distance between the two clamp bars 551 is smaller than the distance between the two first struts 552.

Specifically, the front frame plate 542 and the rear frame plate 543 are respectively provided with through holes through which the cleat stop 551, the first support rod 552, and the second support rod 553 pass, which are referred to as frame plate through holes 5421, and the frame plate through holes 5421 are oblong holes extending in the width direction of the chassis plate. The clamping plate stop rod 551, the first support rod 552 and the second support rod 553 can move in the oblong holes, and the positions are adjusted to adapt to silicon wafers with different specifications.

The cleat stop lever 551, the first strut 552 and the second strut 553 fixedly couple with a nut through the end of the cleat through hole 5421 to fix the cleat stop lever 551, the first strut 552 and the second strut 553.

Further, the cleat assembly 56 includes: a flapper 561 and a torsion spring 562. The baffle 561 is rotatably connected to the first rod 522 and is located outside the clamping bar 551 and the second rod 553. The middle part of the torsion spring 562 is sleeved on the first supporting rod 552, the bottom end of the torsion spring 562 penetrates into a connecting hole formed in the second supporting rod 553, and the top end of the torsion spring 562 is clamped on the outer side of the baffle 561. In this embodiment, the inner side is directed to the accommodating space; the outer side and the inner side are opposite to each other.

The torsion spring 562 is rotatable with respect to the first support rod 552, but one end of the torsion spring 562 is restricted by the second support rod 553, and the other end is restricted by the blocking plate 561, so that a large rotation angle cannot be generated, and it is restored by an elastic force when the external force disappears.

The trigger plate 73 applies an inward force to the bottom end of the flap 561, causing the top of the flap 561 to rotate outward, releasing the silicon die 33. When the force applied by the trigger plate disappears, the baffle 561 rotates reversely to restore the original state.

A specific implementation manner is as follows: the flapper 561 has an intermediate portion 5611, a clamping portion 5612, and a trigger portion 5613. The gripping portion 5612 is located at the top end of the intermediate portion 5611, and the trigger portion 5613 is located at the bottom end of the intermediate portion 5611. The middle portion 5611 extends vertically and is provided with a collar 56111 that is fitted over the first leg 522. The clamping portion 5612 is bent inwards from the top of the middle portion 5611, the inner surface of the clamping portion 5612 is provided with a clamping pad 563, the clamping pad 563 is made of a soft material, the silicon wafer can be protected while a clamping force is applied to the silicon wafer, and damage to the silicon wafer is avoided, for example: rubber, silicone, felt, sponge, and the like.

The trigger 5613 is bent outward from the bottom end of the intermediate portion and extends forward and inward in the direction of the front shelf 542 to engage with the trigger plate 73.

The trigger portion 5613 has a connecting section, a support section, and a trigger section, wherein the connecting section is connected to a bottom end of the intermediate portion 5611. The supporting section extends along the width direction (i.e., the X direction) of the chassis plate 541, and one end thereof is connected to the connecting section and the other end thereof is connected to the triggering section; the trigger segment extends along the length of the chassis plate (i.e., the Y-direction) to mate with the trigger plate.

Further, a bottom receiving assembly 57 may be further provided, which is connected between the front frame plate 542 and the rear frame plate 543, and is located at the bottom of the accommodating space. The number of the bottom receiving members 57 is two and arranged at intervals. The bottom receiving assembly 57 includes: stainless steel pole and rubber sleeve. Wherein, the stainless steel pole is connected perpendicularly between front frame plate 542 and back frame plate 543, and the outside of stainless steel pole is located to the rubber sleeve cover. The stainless steel rod plays a role in rigid support, and the rubber sleeve plays a role in buffering and protection, so that the silicon wafer is prevented from being damaged. The rubber sleeve can be replaced by a sponge sleeve, and can also be made of other soft materials.

Fig. 33 is a top view of another tooling basket applied to a slicing station according to an embodiment of the present disclosure. As shown in fig. 33, the sheet separation station is provided with a sheet separation table 71, a sheet separation conveying mechanism 721, a sheet separation nozzle 723, and a trigger plate 73.

The sheet conveying mechanism 721 is provided on the sheet table 71. The work basket 5 is provided to the slice conveying mechanism 721, and is movable in the longitudinal direction of the work basket 5, that is, in the Y direction in the drawing, by the slice conveying mechanism 721. The region in which the tool basket 5 moves serves as a stroke region.

Trigger plates 73 are provided on either side of the tool basket travel area for applying force to the clamp plate assembly 56 in the tool basket 5. The left side and the right side of the tool basket 5 are provided with trigger plates 73, and the trigger plates 73 on the two sides are symmetrically arranged to simultaneously loosen the two sides of the silicon wafer.

Slice nozzles 723 are provided on either side of the tooling basket travel area and adjacent to the trigger plate 73. The exit of the slice nozzle 723 is directed towards the tool basket travel area. The slicing nozzle 723 may eject a slicing medium, which may be a gas or a liquid.

Taking fig. 32 as an example, the tool basket 5 moves from left to right, and when the tool basket moves to the position of the trigger plate 73, the trigger plate 73 applies a force to the shutter 561 to rotate the shutter 561, thereby releasing the silicon wafer 33 at the position. The slicing nozzle 723 sprays water toward between two adjacent silicon wafers to separate the adjacent silicon wafers, so that the distance is increased, and the silicon wafers can be conveniently taken out of the tool basket.

The tooling basket 5 continues to move rightwards, the baffles 561 are sequentially acted by the trigger plate 73 from right to left, and rotate sequentially to loosen the silicon wafers, the silicon wafers losing the clamping force are separated from the adjacent silicon wafers after being sprayed with water, and then are adhered to the belt conveying mechanism 41 and conveyed to the inserting and washing device.

In the above solution, the baffle 561 cooperates with the trigger plate 73, so that only a small portion of the silicon wafer can be taken out without losing the clamping force, and the rest of the silicon wafer is still clamped and will not topple over.

Claims

1. A silicon wafer production system, comprising:

the degumming device comprises:

the conveying manipulator mechanism is used for grabbing the tooling basket and driving the tooling basket to sequentially move to a degumming station and a frictioning station; the wafer support assembly is also used for grabbing the wafer support assembly adhered with the thick sheet after degumming at the degumming station, driving the wafer support assembly to move to the thick sheet dismantling station, and placing the wafer support assembly into a wafer support recovery line after the thick sheet is dismantled.

2. The silicon wafer production system of claim 1, wherein the de-thicknessing robot mechanism comprises:

a mechanical arm base for removing thick pieces;

the tablet removing mechanical arm is rotatably arranged on the tablet removing mechanical arm base; the slab removal mechanical arm has at least 2 degrees of freedom;

and the thick sheet clamping jaw assembly is used for clamping a thick sheet and is arranged at the working end of the thick sheet removing mechanical arm.

3. The silicon wafer production system of claim 2, wherein the thick wafer gripper assembly comprises:

the clamping jaw support is rotatably arranged at the working end of the chip removing mechanical arm; an accommodating cavity is formed in the clamping jaw bracket; the image acquisition assembly is arranged on the outer surface of the clamping jaw bracket;

the clamping jaw is arranged in the accommodating cavity;

and the clamping jaw driver is used for driving the clamping jaw to execute clamping action and is arranged on the clamping jaw bracket.

4. The silicon wafer production system of claim 3, wherein the clamping jaw comprises: two parallel and oppositely arranged clamping plates; the clamping jaw driver is respectively connected with the two clamping plates and used for driving the two clamping plates to mutually approach to generate clamping action.

5. The silicon wafer production system of claim 4, wherein the thick wafer gripper assembly further comprises:

and the clamping jaw telescopic driver is arranged in the accommodating cavity, is connected with the clamping jaw and is used for driving the clamping jaw to extend out of the accommodating cavity so as to execute clamping action.

6. The silicon wafer production system of claim 3, wherein the de-thicknesser robot mechanism further comprises:

the light source is arranged on the clamping jaw bracket; the light emitting direction of the light source faces the crystal support assembly.

7. The silicon wafer production system according to claim 1, wherein the debonding apparatus further comprises:

the tool basket recycling line is arranged in parallel with the silicon wafer operating line and the crystal support recycling line; and the conveying mechanical arm mechanism is also used for conveying the tool basket above the silicon wafer operation line to a tool basket recovery line.

8. The silicon wafer production system according to claim 1, wherein the degumming station is provided with a degumming tank; an image acquisition assembly is arranged above the degumming tank; the image acquisition assembly is used for acquiring an image between the silicon wafer and the crystal support assembly after the silicon wafer rises from the degumming tank so as to determine whether degumming is finished according to the image; the top in the groove of degumming still is equipped with the slide rail, the image acquisition subassembly slide set up in on the slide rail.

9. The silicon wafer production system according to claim 1, wherein the frictioning station is provided with a transit trough; and an image acquisition assembly for identifying the residual glue of the silicon wafer and a glue wiping manipulator mechanism for wiping the residual glue of the silicon wafer are arranged beside the transfer groove.

10. The silicon wafer production system according to claim 9, wherein the frictioning robot mechanism comprises:

a gluing manipulator base;

the frictioning mechanical arm is rotationally arranged on the frictioning mechanical arm base; the frictioning mechanical arm has at least 2 degrees of freedom;

and the glue wiping mechanism is arranged at the working end of the glue wiping mechanical arm.

11. The silicon wafer production system as claimed in claim 10, wherein the glue wiping mechanism comprises:

the roller bracket is arranged at the working end of the frictioning mechanical arm; the image acquisition assembly for identifying the residual silicon on the silicon wafer is arranged on the roller bracket;

the frictioning roller is rotatably arranged on the roller bracket;

and the light source is arranged on the roller bracket, and the light emitting direction of the light source faces towards the silicon wafer to be rubbed.