CN207509515U - Exempt to insert baffle clamping tool and silicon wafer stripping tooling - Google Patents
Exempt to insert baffle clamping tool and silicon wafer stripping tooling Download PDFInfo
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- CN207509515U CN207509515U CN201721583457.5U CN201721583457U CN207509515U CN 207509515 U CN207509515 U CN 207509515U CN 201721583457 U CN201721583457 U CN 201721583457U CN 207509515 U CN207509515 U CN 207509515U
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- cross bar
- silicon chip
- lasso
- eccentric wheel
- clamping tool
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
Exempt to insert baffle clamping tool and silicon wafer stripping tooling the utility model is related to one kind, shown clamping tool is for clamping silicon chip, including cross bar group, including interval and horizontally disposed cross bar；Lasso group, several lassos being set in including solid matter on the cross bar, the lasso can be rotated relative to the cross bar, and for non axial lasso for clamping silicon chip, the lasso does not generate damage with silicon chip phase-contact surface to silicon chip.It is above-mentioned to exempt to insert baffle clamping tool and degumming tooling, several lassos is set to realize the not damaged clamping to silicon chip by horizontally disposed cross bar and solid matter, it is tilted in one direction after avoiding silicon wafer stripping, it realizes and exempts to insert the effect that baffle clamps, whole degumming efficiency is improved, is conducive to improve degumming the degree of automation.
Description
Technical field
The utility model is related to photovoltaic art, more particularly to exempting to insert baffle clamping tool and silicon wafer stripping tooling.
Background technology
Before photovoltaic industry Degumming Procedures, upper degumming machine, slotting baffle, baffle number about 18, consumption are averagely inserted per knife by hand
When 2.5min, by degumming machine carry out silicon wafer stripping operation after, need degumming personnel that will insert baffle and take out and send to feeding, hand
Work is walked about often (nearly 200 times/day), and distance is remote, and action waste is more apparent, and personnel's operation intensity is caused to increase, and efficiency is low.
With the importing of Buddha's warrior attendant wire cutting technology, cutting efficiency promotes 2 times, and above-mentioned time-consuming longer slotting baffle mode is more
The requirement for meeting lean production is difficult to, becomes the bottleneck that whole process imports automation.In addition, with existing board plug type operating type
Automation difficult to realize, therefore work out a kind of operating type for substituting existing artificial slotting baffle and had become to improve degumming efficiency
It is more urgent and necessary.
Utility model content
Based on this, it is necessary to which baffle operation is time-consuming and laborious and efficiency is low for being inserted in existing Degumming Procedures, influences degumming
The problems such as efficiency and automation, provides one kind and exempts to insert baffle clamping tool and silicon wafer stripping tooling.
One kind is exempted to insert baffle clamping tool, for clamping silicon chip, including：
Cross bar group, including interval and horizontally disposed at least two cross bars；
Lasso group, several lassos being set in including solid matter on the cross bar, the lasso can be relative to the cross bars
Rotation, for non axial lasso for clamping silicon chip, the lasso does not generate damage with silicon chip phase-contact surface to silicon chip.
It is above-mentioned to exempt to insert baffle clamping tool, several lassos is set to realize to silicon chip by horizontally disposed cross bar and solid matter
Not damaged clamping, tilted in one direction after avoiding silicon wafer stripping；Lasso can be rotated relative to cross bar simultaneously can facilitate silicon
Piece takes piece, while ensures the whole not reviewing of clamped silicon chip in rotation process, realizes and exempts to insert the effect that baffle clamps, improves
Whole degumming efficiency is conducive to improve degumming the degree of automation.
In one of the embodiments, the lasso include cushion rubber and the interior axle sleeve set on the cushion rubber, the cushion rubber with
The axle sleeve can not relatively rotate, and the axle sleeve is sheathed on the cross bar.
The material of the lasso and the silicon chip phase-contact surface is acid and alkali-resistance, resistance to 100 DEG C of height in one of the embodiments,
The soft materials of warm and anti-ultrasound.
It further includes in one of the embodiments,：
Roll-setting gear is connect with the cross bar, to adjust the spacing between the adjacent cross bar.
The roll-setting gear is eccentric clamp system in one of the embodiments,.
The roll-setting gear includes in one of the embodiments,：
Eccentric wheel is connect with the end of the cross bar, to adjust the spacing between adjacent crossbars；
Handle mechanism can drive the rotation of the eccentric wheel.
The roll-setting gear further includes in one of the embodiments,：
Bindiny mechanism connect respectively with the eccentric wheel and the handle mechanism, for by by the handle mechanism
Movement passes to the eccentric wheel rotation.
The bindiny mechanism includes in one of the embodiments,：
Toggle is connect respectively with the handle mechanism and the eccentric wheel, and torsional moment is converted into institute by the toggle
State the rotation of eccentric wheel.
The handle mechanism includes installing plate and the handle being set on the installing plate in one of the embodiments,
Hand, the installing plate are equipped at least one connector being connect with the toggle；
The handle mechanism can be moved up and down integrally, and the toggle can be driven to move.
The outer diameter of the cushion rubber and axle sleeve ratio is 1~3 in one of the embodiments,.
The application also provides a kind of silicon wafer stripping tooling, including：
Frame ontology；
Collet is set to the lower section of the frame ontology, is used to support silicon chip；And
Above-mentioned exempts from slotting baffle clamping tool, is set on the frame ontology, for clamping silicon chip.
It further includes in one of the embodiments,：
Roll-setting gear is connect with the cross bar, to adjust the spacing between the adjacent cross bar；
Wherein, the roll-setting gear includes：
Eccentric wheel is connect with the end of the cross bar, to adjust the spacing between adjacent crossbars；
Handle mechanism is arranged on the frame ontology, and the eccentric wheel can be driven to rotate；And
Bindiny mechanism connect respectively with the eccentric wheel and the handle mechanism, for by by the handle mechanism
Movement passes to the eccentric wheel rotation.
The handle mechanism includes the installing plate and the setting that are arranged on the frame ontology in one of the embodiments,
Handle on the installing plate, the installing plate are equipped at least one connector being connect with the bindiny mechanism；It is described
Handle mechanism can be moved up and down integrally, and the bindiny mechanism can be driven to move.
In one of the embodiments, the bindiny mechanism include toggle, respectively with the handle mechanism and it is described partially
Heart wheel connects, and torsional moment is converted into the rotation of the eccentric wheel by the toggle.
Description of the drawings
Fig. 1 is a kind of part-structure schematic diagram for exempting to insert baffle clamping tool of the utility model；
Fig. 2 is the structure diagram of the lasso of the utility model；
Fig. 3 is a kind of vertical view of silicon wafer stripping tooling of the utility model；
Fig. 4 is a kind of oblique view of silicon wafer stripping tooling of the utility model.
It is as follows that label is corresponded in figure：
110th, cross bar, 120, lasso, 121, cushion rubber, 122, axle sleeve, 130, roll-setting gear, 131, eccentric wheel, 132, handle
Mechanism, 133, bindiny mechanism, 1321, installing plate, 1322, handle, 1323, connector, 210, frame ontology, 220, collet.
Specific embodiment
Above-mentioned purpose, feature and advantage to enable the utility model are more obvious understandable, below in conjunction with the accompanying drawings to this
The specific embodiment of utility model is described in detail.Elaborate many details in order to abundant in the following description
Understand the utility model.But the utility model can be much to implement different from other manner described here, this field
Technical staff can do similar improvement in the case of without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific embodiment opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to the technology of the utility model
The normally understood meaning of technical staff in domain is identical.It is only in the term used in the description of the utility model herein
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term as used herein " and/or " include
The arbitrary and all combination of one or more relevant Listed Items.
Below in conjunction with the accompanying drawings, illustrate the better embodiment of the utility model.
Embodiment 1
Shown in Figure 1, one kind is exempted to insert baffle clamping tool, for clamping silicon chip.Wherein, exempt to insert baffle clamping tool
It may include cross bar group and lasso group.
In the present embodiment, cross bar group may include interval and horizontally disposed two cross bars 110.In other embodiment
In, cross bar group may include interval and horizontally disposed four or more cross bars 110, and several cross bars 110 are respectively separated and level is set
It puts.Cross bar 110 can be common pole stock in Degumming Procedures, with certain intensity and mechanical property, and can be resistant to degumming work
The requirement of sequence use environment.
In the present embodiment, lasso group may include that solid matter is set in several lassos 120 on cross bar 110,120 energy of lasso
Enough to be rotated relative to cross bar 110, non axial lasso 120 is for clamping silicon chip, and lasso 120 is with silicon chip phase-contact surface not to silicon chip
Generate damage.Lasso 120 and silicon chip phase-contact surface do not generate damage to silicon chip, when can so avoid the lasso 120 from squeezing silicon chip
It causes to squeeze sliver.In addition, the distance of adjacent crossbars 110 and the size of silicon chip and lasso 120 match, lasso 120 being capable of phase
Cross bar 110 is rotated and can ensure the whole not reviewing of silicon chip.
The multiple lassos 120 set by solid matter can facilitate using and wear according to lasso 120 in use
Situation replace the lasso 120 of corresponding position, avoids replacing entire lasso group, so cost-saved.In addition,
Relative to complete lasso 120, multiple lassos 120 are easier to realize rotation.In addition, silicon chip take piece during, lasso 120
It can rotate, so sliding friction can be converted into rolling friction, reduce the frictional force to silicon chip, that is, facilitated and pick and place piece, and
And can reduce take during piece to the abrasion of silicon chip and caused by fragmentation problem, improve Degumming Procedures yield.
In this way, several lassos 120 is set to realize the not damaged folder to silicon chip by horizontally disposed cross bar 110 and solid matter
Tightly, it is tilted in one direction after avoiding silicon wafer stripping；Lasso 120 can be rotated relative to cross bar 110 simultaneously silicon chip to be facilitated to take
Piece, while ensure the whole not reviewing of clamped silicon chip in rotation process, it realizes and exempts to insert the effect that baffle clamps, improve whole
Degumming efficiency is conducive to improve degumming the degree of automation.
It should be noted that there are certain gap between adjacent axial direction lasso 120, it can ensure that lasso 120 can be relative to
Cross bar 110 rotates, but the gap between adjacent axial lasso 120 cannot be more than the thickness of silicon chip, that is, ensures that silicon chip cannot be inserted
Enter in the gap between adjacent axial lasso 120, silicon chip can so be avoided to be squeezed by the lasso 120 in adjacent axial direction and split
Piece.
It should be noted that in photovoltaic art, need to detach glass with silicon chip by the silicon chip of multi-wire saw,
And the binding agent between silicon chip and glass is usually epoxide-resin glue, so need degumming process.It is main at present in Degumming Procedures
To be contained in the degumming agents such as lactic acid by the way that the silicon chip after multi-wire saw is impregnated, be then heated to after certain temperature and carry out ultrasonic take off again
Glue.So in order to ensure the service life of degumming tooling, in the present embodiment, the material that lasso 120 is in contact with silicon chip is
The soft materials of acid and alkali-resistance, resistance to 100 DEG C of high temperature and anti-ultrasound.
In the present embodiment, shown in Figure 2, lasso 120 may include cushion rubber 121 and the interior axis set on cushion rubber 121
Set 122.Axle sleeve 122 can be sheathed on cross bar 110, while the size of axle sleeve 122 matches with cross bar 110.In present embodiment
In, the outer diameter ratio of cushion rubber 121 and axle sleeve 122 can be 1~3, it is preferred that the outer diameter ratio of the two can be 1.5~2.5.
Axle sleeve 122 can be common metallic sheath, so due to increase axle sleeve 122, can not only increase lasso 120 rigidity and
Itself and beam contact frictional force are reduced, improves service life；And lasso 120 can be further facilitated and turned relative to cross bar 110
It is dynamic, and then the rolling friction of silicon chip and lasso 120 can be further reduced, reduce the frictional force to silicon chip, to reduce fragment rate.
In present embodiment, axle sleeve 122 can be fixedly connected with cushion rubber 121, can make the two whole as one by common fixed form
Body, such as binding agent.It can so improve and improve 121 rotational stability of cushion rubber, cushion rubber 121 and axle sleeve 122 can not relatively rotate,
Cushion rubber 121 and axle sleeve 122 in lasso 120 can be rotated as an entirety relative to cross bar 110, it can be ensured that between cross bar 110
Spacing it is consistent, avoid that the spacing between cross bar 110 is caused to have an adverse effect to silicon chip there are deviation in rotation process.
In other embodiments, axle sleeve 122 can be also rotatablely connected, but its connection mode is also not necessarily limited to this with cushion rubber 121.
In order to ensure the service life of above-mentioned clamping tool, 120 material of lasso can be common acid and alkali-resistance and high temperature and tool
There is the high molecular material of certain flexibility.The surface of lasso 120 is smooth, and the outer diameter of lasso 120 is processed unanimously as far as possible,
To ensure the dimensional accuracy of lasso 120, reduce when lasso 120 rotates and have an adverse effect to silicon chip.
In above-mentioned clamping tool, the spacing between adjacent crossbars 110 can be adjusted according to the size of silicon chip and lasso 120.
It can be by setting two positions, respectively corresponding first position and the second position, and first position and the second position can roots
Be adjusted according to the size of silicon chip and lasso 120, with ensure silicon chip can film releasing between two cross bars 110 and lasso 120 with
Realize silicon wafer clamping.Specifically, it can realize cross bar by the way that cross bar 110 is respectively placed in corresponding first position and the second position
Spacing between 110 is adjusted, so as to fulfill the film releasing of silicon chip and clamping work.
The silicon wafer stripping tooling shown in Fig. 3 and 4 is referred to, exempts from slotting baffle clamping tool including the application.In this reality
It applies in mode, exempts from slotting baffle clamping tool and may also include the roll-setting gear 130 being connect with cross bar 110, which is used for
Adjust the spacing between adjacent crossbars 110.In the present embodiment, which can be eccentric clamp system.In other realities
It applies in mode, the spacing between adjacent crossbars 110 can be adjusted by increasing at least two groups of through-holes；It specifically, can be by cross bar 110
It is individually positioned in any group of through-hole to realize that the spacing of cross bar 110 is adjusted.It should be noted that roll-setting gear 130 and unlimited
In this.
Specifically, in the present embodiment, roll-setting gear 130 may include eccentric wheel 131 and handle mechanism 132.Eccentric wheel
131 to adjust the spacing between adjacent crossbars 110, and the specification of eccentric wheel 131 and size are according to the size and cross bar of silicon chip
110 spacing are accordingly adjusted.Handle mechanism 132, can the rotation with movable eccentric wheel 131, so as to fulfill the spacing of cross bar 110
It adjusts.
The number of eccentric wheel 131 and the number of cross bar 110 match.In the present embodiment, eccentric wheel 131 can set two
Group, and the both ends with two cross bars 110 are connect respectively.Handle mechanism 132 being capable of the rotation with movable eccentric wheel 131.At other
In embodiment, eccentric wheel 131 can set one group, and the end with the same side of two cross bars 110 is connect respectively；Likewise,
Eccentric wheel 131 can set multigroup, and the end at least side of more cross bars 110 is connect respectively.
In addition, in the present embodiment, roll-setting gear 130 may also include bindiny mechanism 133, respectively with eccentric wheel 131 and
Handle mechanism 132 connects, for being rotated by the way that the movement of handle mechanism 132 is passed to eccentric wheel 131.In present embodiment
In, bindiny mechanism 133 includes toggle, which connect respectively with handle mechanism 132 and eccentric wheel 131, and toggle will be turned round
Torque is converted into the rotation of eccentric wheel 131.Toggle can be common torsion arm configuration, by torsion away from the transmission for realizing power.
In Degumming Procedures, some silica flours can be generated in environment, these silica flours can enter in handle mechanism 132 and generate card
Phenomenon, therefore in order to reduce its interim card problem, we devise a kind of handle mechanism 132.In the present embodiment, mobile phone
Structure 132 includes installing plate 1321 and the handle 1322 being set on installing plate 1321, and installing plate 1321 is equipped with and toggle
At least one connector 1323 of connection；Handle mechanism 132 can be moved up and down integrally, and toggle can be driven to move.Tool
Body, connector 1323 can be connecting pole, and one end through-hole in toggle is socketed on connecting pole, other end through-hole by axis with
Eccentric wheel 131 connects, and eccentric wheel 131 is connect with the end of cross bar 110.The number of connector 1323 can be one or be arranged at intervals
It is multiple, when connector 1323 for it is multiple when, can match difference by adjusting connection of the toggle from different connectors 1323
The silicon chip of specification.Handle mechanism 132 can be moved up and down integrally, moved up and down by it and driven torsion brachiostrophosis, and then
Torsional moment is converted to the rotation of eccentric wheel 131 connected to it by toggle, and then drives the cross bar being connect with eccentric wheel 131
110 movements, so as to adjust the spacing between cross bar 110.
Embodiment 2
As shown in Figures 3 and 4, a kind of silicon wafer stripping tooling, including frame ontology 210, collet 220 and embodiment 1 is any exempts from
Insert baffle clamping tool.
Frame ontology 210 can be the frame body of degumming basket fabric.Collet 220 sets there are two and is arranged at intervals at frame ontology 210
Lower section, be used to support silicon chip.Exempt to insert baffle clamping tool, be set on frame ontology 210, for clamping silicon chip.
Such as embodiment 1, exempting from slotting baffle clamping tool may include cross bar group and lasso group.Cross bar group may include interval and level
Two cross bars 110 of setting.110 horizontal direction of cross bar is set and both ends are separately positioned on 210 rear and front end of frame ontology.
In one embodiment, silicon wafer stripping tooling further includes the roll-setting gear being connect with cross bar, to adjust adjacent horizontal stroke
Spacing between bar 110.
Further, roll-setting gear may include eccentric wheel 131 and handle mechanism 132.In the present embodiment, eccentric wheel
131 can set the inside of frame ontology 210 and be connected to 110 end of cross bar.Handle mechanism 132 is arranged on close on frame ontology 210
The outside of eccentric wheel 131.In the present embodiment, handle mechanism 132 can only set one, so convenient to adjust cross bar manually
110 spacing.Eccentric wheel 131 is to adjust the spacing between adjacent crossbars 110, and the specification of eccentric wheel 131 and size are according to silicon
The size and 110 spacing of cross bar of piece are accordingly adjusted.Handle mechanism 132, can the rotation with movable eccentric wheel 131, so as to real
The spacing of existing cross bar 110 is adjusted.
Further, roll-setting gear may also include bindiny mechanism 133, connect respectively with eccentric wheel 131 and handle mechanism 132
It connects, for being rotated by the way that the movement of handle mechanism 132 is passed to eccentric wheel 131.Specifically, bindiny mechanism 133 can be torsion
Arm is connect respectively with handle mechanism 132 and eccentric wheel 131, and torsional moment is converted into the rotation of eccentric wheel 131 by toggle.
In Degumming Procedures, some silica flours can be generated in environment, these silica flours can enter in handle mechanism 132 and generate card
Phenomenon, therefore in order to reduce its interim card problem, we design a kind of handle mechanism.In present embodiment, handle mechanism 132 wraps
The handle 1322 for including installing plate 1321 and being set on installing plate 1321, installing plate 1321 is equipped with to be connected with bindiny mechanism 133
At least one connector 1323 connect.Installing plate 1321 is slidably arranged on frame ontology 210 close to the outside of eccentric wheel 131, peace
Loading board 1321 can move up and down, it is impossible to move left and right, be moved up and down by handle 1322 and drive installing plate 1321 and connection
Part 1323 moves together, and so as to which bindiny mechanism 133 be driven to move, and then the eccentric wheel 131 by connecting bindiny mechanism 133 drives
Cross bar 110 rotates.
Specifically, in the present embodiment, bindiny mechanism 133 can be toggle, and connector 323 can be connecting pole, torsion
One end through-hole in arm is socketed on connecting pole, and other end through-hole is connect by axis with eccentric wheel 131, eccentric wheel 131 and cross bar
110 end connection.The number of connector 1323 can be one or spaced multiple, when connector 1323 is multiple,
The silicon chip of different specification size can be matched by adjusting connection of the toggle from different connectors 1323.132 energy of handle mechanism
Enough entirety moves up and down, and is moved up and down by it and drives torsion brachiostrophosis, and then torsional moment is converted to and is connected thereto by toggle
Eccentric wheel 131 rotation, and then the cross bar 110 that is connect with eccentric wheel 131 is driven to move, so as to adjust between cross bar 110
Spacing.
The specific structural details and other content for exempting from slotting baffle clamping tool can be found in embodiment 1, and details are not described herein.
Above-mentioned silicon wafer stripping tooling sets several lassos 120 to realize to silicon by horizontally disposed cross bar 110 and solid matter
The not damaged clamping of piece, tilts in one direction after avoiding silicon wafer stripping；Lasso 120 can be rotated relative to cross bar 110 simultaneously
Silicon chip can be facilitated to take piece, while ensure the whole not reviewing of clamped silicon chip in rotation process, realize and exempt to insert what baffle clamped
Effect improves whole degumming efficiency, is conducive to improve degumming the degree of automation.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that the common skill for this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. one kind is exempted to insert baffle clamping tool, for clamping silicon chip, which is characterized in that including：
Cross bar group, including interval and horizontally disposed at least two cross bars；
Lasso group, several lassos being set in including solid matter on the cross bar, the lasso can be rotated relative to the cross bar,
For non axial lasso for clamping silicon chip, the lasso does not generate damage with silicon chip phase-contact surface to silicon chip.
2. according to claim 1 exempt to insert baffle clamping tool, which is characterized in that the lasso includes cushion rubber and interior is set on
The axle sleeve of the cushion rubber, the cushion rubber and the axle sleeve can not relatively rotate；The axle sleeve is sheathed on the cross bar.
3. according to claim 1 exempt to insert baffle clamping tool, which is characterized in that the lasso is in contact with the silicon chip
The material in face is the soft materials of acid and alkali-resistance, resistance to 100 DEG C of high temperature and anti-ultrasound.
4. exempt from slotting baffle clamping tool according to claim 1-3 is any, which is characterized in that further include：
Roll-setting gear is connect with the cross bar, to adjust the spacing between the adjacent cross bar.
5. according to claim 4 exempt to insert baffle clamping tool, which is characterized in that the roll-setting gear includes：
Eccentric wheel is connect with the end of the cross bar, to adjust the spacing between adjacent crossbars；
Handle mechanism can drive the eccentric wheel to rotate.
6. according to claim 5 exempt to insert baffle clamping tool, which is characterized in that the roll-setting gear further includes：
Bindiny mechanism connect respectively with the eccentric wheel and the handle mechanism, for by by the movement of the handle mechanism
Pass to the eccentric wheel rotation.
7. according to claim 6 exempt to insert baffle clamping tool, which is characterized in that the bindiny mechanism includes：
Toggle is connect respectively with the handle mechanism and the eccentric wheel, and torsional moment is converted into described inclined by the toggle
The rotation of heart wheel.
8. a kind of silicon wafer stripping tooling, which is characterized in that including：
Frame ontology；
Collet is set to the lower section of the frame ontology, is used to support silicon chip；And
Exempt from slotting baffle clamping tool described in claim 1-3 is any, be set on the frame ontology, for clamping silicon chip.
9. silicon wafer stripping tooling according to claim 8, which is characterized in that further include：
Roll-setting gear is connect with the cross bar, to adjust the spacing between the adjacent cross bar；
Wherein, the roll-setting gear includes：
Eccentric wheel is connect with the end of the cross bar, to adjust the spacing between adjacent crossbars；
Handle mechanism is arranged on the frame ontology, and the eccentric wheel can be driven to rotate；And
Bindiny mechanism connect respectively with the eccentric wheel and the handle mechanism, for by by the movement of the handle mechanism
Pass to the eccentric wheel rotation.
10. silicon wafer stripping tooling according to claim 9, which is characterized in that
The handle mechanism includes the installing plate being arranged on the frame ontology and the handle being set on the installing plate, institute
It states installing plate and is equipped at least one connector being connect with the bindiny mechanism；
The handle mechanism can be moved up and down integrally, and the bindiny mechanism can be driven to move.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721583457.5U CN207509515U (en) | 2017-11-23 | 2017-11-23 | Exempt to insert baffle clamping tool and silicon wafer stripping tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721583457.5U CN207509515U (en) | 2017-11-23 | 2017-11-23 | Exempt to insert baffle clamping tool and silicon wafer stripping tooling |
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| Publication Number | Publication Date |
|---|---|
| CN207509515U true CN207509515U (en) | 2018-06-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114559571A (en) * | 2022-04-14 | 2022-05-31 | 乐山高测新能源科技有限公司 | Silicon wafer production system |
-
2017
- 2017-11-23 CN CN201721583457.5U patent/CN207509515U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114559571A (en) * | 2022-04-14 | 2022-05-31 | 乐山高测新能源科技有限公司 | Silicon wafer production system |
| CN114559571B (en) * | 2022-04-14 | 2022-09-23 | 乐山高测新能源科技有限公司 | Silicon wafer production system |
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