TWI821580B - 雷射加工方法以及雷射加工裝置 - Google Patents

雷射加工方法以及雷射加工裝置 Download PDF

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Publication number
TWI821580B
TWI821580B TW109122848A TW109122848A TWI821580B TW I821580 B TWI821580 B TW I821580B TW 109122848 A TW109122848 A TW 109122848A TW 109122848 A TW109122848 A TW 109122848A TW I821580 B TWI821580 B TW I821580B
Authority
TW
Taiwan
Prior art keywords
laser
hole
substrate
penetrated
level
Prior art date
Application number
TW109122848A
Other languages
English (en)
Chinese (zh)
Other versions
TW202103831A (zh
Inventor
伊藤靖
市川健一
佐伯勇輝
西部達矢
Original Assignee
日商維亞機械股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商維亞機械股份有限公司 filed Critical 日商維亞機械股份有限公司
Publication of TW202103831A publication Critical patent/TW202103831A/zh
Application granted granted Critical
Publication of TWI821580B publication Critical patent/TWI821580B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
TW109122848A 2019-07-08 2020-07-07 雷射加工方法以及雷射加工裝置 TWI821580B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019126915A JP7251904B2 (ja) 2019-07-08 2019-07-08 レーザ加工方法及レーザ加工装置
JP2019-126915 2019-07-08

Publications (2)

Publication Number Publication Date
TW202103831A TW202103831A (zh) 2021-02-01
TWI821580B true TWI821580B (zh) 2023-11-11

Family

ID=74006034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109122848A TWI821580B (zh) 2019-07-08 2020-07-07 雷射加工方法以及雷射加工裝置

Country Status (4)

Country Link
JP (1) JP7251904B2 (ja)
KR (1) KR20210006294A (ja)
CN (1) CN112192055A (ja)
TW (1) TWI821580B (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08103879A (ja) * 1994-10-04 1996-04-23 Matsushita Electric Ind Co Ltd レーザ加工機
JPH10263873A (ja) * 1997-03-27 1998-10-06 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法
CN104002051A (zh) * 2014-06-03 2014-08-27 湖南大学 一种用于激光焊接的垂直检测装置和检测方法
CN106735944A (zh) * 2016-12-16 2017-05-31 江苏大学 一种基于穿透检测技术的改进型激光微孔制造实验方法
JP6443251B2 (ja) * 2015-07-17 2018-12-26 トヨタ自動車株式会社 レーザ穴あけ装置
JP2018202449A (ja) * 2017-06-02 2018-12-27 日本電気硝子株式会社 レーザー加工方法
JP6482740B1 (ja) * 2018-05-07 2019-03-13 三菱電機株式会社 レーザ加工機、制御装置および判定方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2864005B2 (ja) 1996-05-17 1999-03-03 住友重機械工業株式会社 トータルパルスエネルギー積算量検出によるレーザ加工補償システム
DE19949501A1 (de) * 1999-10-14 2001-04-19 Volkswagen Ag Verfahren zum Einbringen von Vertiefungen in Kunststoffteilen
JP3920710B2 (ja) 2002-06-04 2007-05-30 日立ビアメカニクス株式会社 レーザ加工方法
JP5964604B2 (ja) * 2012-02-09 2016-08-03 株式会社ディスコ レーザー加工装置
CN105328350A (zh) * 2015-10-09 2016-02-17 江苏大金激光科技有限公司 自动检测穿孔的激光切割头
CN107824989B (zh) * 2017-10-26 2019-11-12 大族激光科技产业集团股份有限公司 一种激光穿孔的检测方法及系统

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08103879A (ja) * 1994-10-04 1996-04-23 Matsushita Electric Ind Co Ltd レーザ加工機
JPH10263873A (ja) * 1997-03-27 1998-10-06 Sumitomo Heavy Ind Ltd レーザ加工装置及び加工方法
CN104002051A (zh) * 2014-06-03 2014-08-27 湖南大学 一种用于激光焊接的垂直检测装置和检测方法
JP6443251B2 (ja) * 2015-07-17 2018-12-26 トヨタ自動車株式会社 レーザ穴あけ装置
CN106735944A (zh) * 2016-12-16 2017-05-31 江苏大学 一种基于穿透检测技术的改进型激光微孔制造实验方法
JP2018202449A (ja) * 2017-06-02 2018-12-27 日本電気硝子株式会社 レーザー加工方法
JP6482740B1 (ja) * 2018-05-07 2019-03-13 三菱電機株式会社 レーザ加工機、制御装置および判定方法

Also Published As

Publication number Publication date
JP7251904B2 (ja) 2023-04-04
TW202103831A (zh) 2021-02-01
JP2021011410A (ja) 2021-02-04
KR20210006294A (ko) 2021-01-18
CN112192055A (zh) 2021-01-08

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