TWI821179B - 積層體及其製造方法、以及閘密封件 - Google Patents
積層體及其製造方法、以及閘密封件 Download PDFInfo
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- TWI821179B TWI821179B TW107110901A TW107110901A TWI821179B TW I821179 B TWI821179 B TW I821179B TW 107110901 A TW107110901 A TW 107110901A TW 107110901 A TW107110901 A TW 107110901A TW I821179 B TWI821179 B TW I821179B
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- Prior art keywords
- fluoroelastomer
- layer
- cross
- fluororesin
- laminated
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 229920001973 fluoroelastomer Polymers 0.000 claims abstract description 172
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 63
- 229910052782 aluminium Inorganic materials 0.000 claims description 55
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 54
- 238000004132 cross linking Methods 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 50
- 238000011282 treatment Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 34
- 229920006169 Perfluoroelastomer Polymers 0.000 claims description 33
- 238000007743 anodising Methods 0.000 claims description 18
- 229920001971 elastomer Polymers 0.000 claims description 10
- 239000000806 elastomer Substances 0.000 claims description 8
- 238000000748 compression moulding Methods 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 152
- 239000002585 base Substances 0.000 description 60
- 239000000203 mixture Substances 0.000 description 27
- 238000003486 chemical etching Methods 0.000 description 26
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 25
- 239000003431 cross linking reagent Substances 0.000 description 24
- -1 that is Chemical compound 0.000 description 22
- 229920001577 copolymer Polymers 0.000 description 18
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000007788 liquid Substances 0.000 description 15
- 238000005259 measurement Methods 0.000 description 15
- 230000003746 surface roughness Effects 0.000 description 15
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000000178 monomer Substances 0.000 description 12
- 150000002978 peroxides Chemical class 0.000 description 12
- 150000001451 organic peroxides Chemical class 0.000 description 11
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 10
- 229920002449 FKM Polymers 0.000 description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 229920009441 perflouroethylene propylene Polymers 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 229920003249 vinylidene fluoride hexafluoropropylene elastomer Polymers 0.000 description 9
- 229910000838 Al alloy Inorganic materials 0.000 description 8
- 239000000654 additive Substances 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 125000002560 nitrile group Chemical group 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- RRZIJNVZMJUGTK-UHFFFAOYSA-N 1,1,2-trifluoro-2-(1,2,2-trifluoroethenoxy)ethene Chemical compound FC(F)=C(F)OC(F)=C(F)F RRZIJNVZMJUGTK-UHFFFAOYSA-N 0.000 description 5
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 125000005843 halogen group Chemical group 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229920006367 Neoflon Polymers 0.000 description 4
- 239000002033 PVDF binder Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000013065 commercial product Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000006242 Semi-Reinforcing Furnace Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- BLTXWCKMNMYXEA-UHFFFAOYSA-N 1,1,2-trifluoro-2-(trifluoromethoxy)ethene Chemical compound FC(F)=C(F)OC(F)(F)F BLTXWCKMNMYXEA-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- HSTOKWSFWGCZMH-UHFFFAOYSA-N 3,3'-diaminobenzidine Chemical compound C1=C(N)C(N)=CC=C1C1=CC=C(N)C(N)=C1 HSTOKWSFWGCZMH-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000006244 Medium Thermal Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005865 ionizing radiation Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 229920005609 vinylidenefluoride/hexafluoropropylene copolymer Polymers 0.000 description 2
- OXYKVVLTXXXVRT-UHFFFAOYSA-N (4-chlorobenzoyl) 4-chlorobenzenecarboperoxoate Chemical compound C1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1 OXYKVVLTXXXVRT-UHFFFAOYSA-N 0.000 description 1
- KHXKESCWFMPTFT-UHFFFAOYSA-N 1,1,1,2,2,3,3-heptafluoro-3-(1,2,2-trifluoroethenoxy)propane Chemical compound FC(F)=C(F)OC(F)(F)C(F)(F)C(F)(F)F KHXKESCWFMPTFT-UHFFFAOYSA-N 0.000 description 1
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- KECOIASOKMSRFT-UHFFFAOYSA-N 2-amino-4-(3-amino-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(O)C(N)=CC(S(=O)(=O)C=2C=C(N)C(O)=CC=2)=C1 KECOIASOKMSRFT-UHFFFAOYSA-N 0.000 description 1
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 1
- SVYBEBLNQGDRHF-UHFFFAOYSA-N 4-amino-N-(5-ethyl-1,3,4-thiadiazol-2-yl)benzenesulfonamide Chemical compound S1C(CC)=NN=C1NS(=O)(=O)C1=CC=C(N)C=C1 SVYBEBLNQGDRHF-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 241001136616 Methone Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Chemical group 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical class OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical group NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- JRDVYNLVMWVSFK-UHFFFAOYSA-N aluminum;titanium Chemical compound [Al+3].[Ti].[Ti].[Ti] JRDVYNLVMWVSFK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- NLNRQJQXCQVDQJ-UHFFFAOYSA-N bis(3,4-diaminophenyl)methanone Chemical compound C1=C(N)C(N)=CC=C1C(=O)C1=CC=C(N)C(N)=C1 NLNRQJQXCQVDQJ-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- IRVXMVSXMSXNLD-UHFFFAOYSA-N fluoromethoxyethene Chemical compound FCOC=C IRVXMVSXMSXNLD-UHFFFAOYSA-N 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- UJMWVICAENGCRF-UHFFFAOYSA-N oxygen difluoride Chemical compound FOF UJMWVICAENGCRF-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000005062 perfluorophenyl group Chemical group FC1=C(C(=C(C(=C1F)F)F)F)* 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical group 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960003288 sulfaethidole Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- IYZPIFPRGKIJQT-UHFFFAOYSA-N tert-butyl propan-2-yl carbonate Chemical compound CC(C)OC(=O)OC(C)(C)C IYZPIFPRGKIJQT-UHFFFAOYSA-N 0.000 description 1
- 238000004227 thermal cracking Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- IFOIAHYDBXLNJX-UHFFFAOYSA-N trioxazole Chemical compound O1OC=NO1 IFOIAHYDBXLNJX-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/14—Layered products comprising a layer of natural or synthetic rubber comprising synthetic rubber copolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/243—Chemical after-treatment using organic dyestuffs
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/246—Chemical after-treatment for sealing layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2019/00—Use of rubber not provided for in a single one of main groups B29K2007/00 - B29K2011/00, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2009/00—Layered products
- B29L2009/003—Layered products comprising a metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/101—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/105—Metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
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- B32B2310/00—Treatment by energy or chemical effects
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- B32B2311/00—Metals, their alloys or their compounds
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Abstract
本發明提供一種積層體、及包含其之閘閥,該積層體包含:金屬基材,其具有化學蝕刻表面;及氟彈性體層,其係與化學蝕刻表面相接而積層,或與氟樹脂層之表面相接而積層,該氟樹脂層係與化學蝕刻表面相接而積層。
Description
本發明係關於一種具備金屬基材與氟彈性體層之積層體及其製造方法、以及包含該積層體之閘密封件。
通常,於半導體製造裝置之真空室中,設置有用以取出放入晶圓等被處理物之閘,且於該閘中具備用以進行閘之開啟及關閉之閘密封件。閘密封件通常包含金屬基材、及與其表面密接而配置之密封材料,且利用該密封材料之密封性可保持腔室內外之差壓。 於日本專利特開平06-157686號公報(專利文獻1)中記載有將經由接著劑將金屬與含氟彈性體組合物之硬化物積層而成之積層體應用於油封、曲軸密封件等。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開平06-157686號公報
[發明所欲解決之問題] 使用接著劑之閘密封件至少於以下之方面尚有改善之餘地。 (a)於嚴酷之使用環境下(例如高溫環境、腐蝕性環境、UV(Ultra Violet,紫外線)環境、電漿環境下等),存在於金屬基材與密封材料之間產生剝離之情形。認為其原因在於,於嚴酷之使用環境下,接著劑進行分解。 (b)於每次變更密封材料中所使用之氟彈性體之種類時,必須開發、選定適當之接著劑,於開發成本之方面較不利。 本發明之目的在於提供一種改善金屬基材與氟彈性體層之間之剝離強度之積層體、及包含其之閘密封件。 [解決問題之技術手段] 本發明提供一種如下所示之積層體及其製造方法、以及閘閥。 [1]一種積層體,其包含: 金屬基材,其具有化學蝕刻表面;及 氟彈性體層,其係與上述化學蝕刻表面相接而積層,或與氟樹脂層之表面相接而積層,該氟樹脂層係與上述化學蝕刻表面相接而積層。 [2]一種積層體,其包含: 金屬基材,其具有藉由對化學蝕刻表面實施陽極氧化處理而形成有具有多孔性之陽極氧化皮膜之表面;及 氟彈性體層,其係與上述陽極氧化皮膜相接而積層,或與氟樹脂層之表面相接而積層,該氟樹脂層係與上述陽極氧化皮膜相接而積層。 [3]如[1]或[2]之積層體,其中上述氟彈性體層包含交聯性全氟彈性體之交聯物。 [4]如[1]至[3]中任一項之積層體,其中上述金屬基材包含鋁。 [5]一種閘密封件,其包含如[1]至[4]中任一項之積層體。[6]一種積層體之製造方法,其包括如下步驟: 準備具有化學蝕刻表面之金屬基材之步驟; 於上述化學蝕刻表面、或與上述化學蝕刻表面相接而積層之氟樹脂層之表面形成包含交聯性氟彈性體之層之步驟;及 使上述包含交聯性氟彈性體之層交聯而形成氟彈性體層之步驟。 [7]如[6]之積層體之製造方法,其中上述形成包含交聯性氟彈性體之層之步驟包括如下步驟: 於將熔融後之氟樹脂配置於上述化學蝕刻表面後,進行壓縮成形而形成上述氟樹脂層之步驟;及 於上述氟樹脂層之與上述金屬基材相反之側之表面形成上述包含交聯性氟彈性體之層之步驟。 [8]一種積層體之製造方法,其包括如下步驟: 準備具有藉由對化學蝕刻表面實施陽極氧化處理而形成有具有多孔性之陽極氧化皮膜之表面之金屬基材之步驟; 於上述陽極氧化皮膜之表面、或與上述陽極氧化皮膜之表面相接而積層之氟樹脂層之表面形成包含交聯性氟彈性體之層之步驟;及 使上述包含交聯性氟彈性體之層交聯而形成氟彈性體層之步驟。 [9]如[8]之積層體之製造方法,其中上述形成包含交聯性氟彈性體之層之步驟包括如下步驟: 於將熔融後之氟樹脂配置於上述陽極氧化皮膜之表面後,進行壓縮成形而形成上述氟樹脂層之步驟;及 於上述氟樹脂層之與上述金屬基材相反之側之表面形成上述包含交聯性氟彈性體之層之步驟。 [10]如[6]至[9]中任一項之積層體之製造方法,其中上述交聯性氟彈性體為交聯性全氟彈性體。 [11]如[6]至[10]中任一項之積層體之製造方法,其中上述金屬基材包含鋁。 [發明之效果] 本發明可提供一種改善金屬基材與氟彈性體層之間之剝離強度(以下,有時僅稱為「剝離強度」)之積層體、及包含其之閘密封件。
<積層體> 以下,示出實施形態而詳細地說明本發明。 圖1係表示本發明之積層體之一例之概略剖視圖。圖2係表示本發明之積層體之另一例之概略剖視圖。 如圖1及圖2所示,本發明之積層體包含:金屬基材10;及氟彈性體層30,其係積層於金屬基材10之一主面上。 於本發明之積層體中,氟彈性體層30可於金屬基材10之一主面上直接積層(圖1),亦可與氟樹脂層20之表面(與金屬基材10相反之側之表面)相接而積層,該氟樹脂層20係與金屬基材10之一主面相接而積層(圖2)。 供積層氟樹脂層20或氟彈性體層30之金屬基材10之表面係化學蝕刻表面,或係藉由對化學蝕刻表面實施陽極氧化處理而形成之陽極氧化皮膜11。將與陽極氧化皮膜11之表面相接而積層有氟彈性體層30之積層體之例示於圖3。 (1)金屬基材 構成金屬基材10之金屬係可進行化學蝕刻之金屬,較佳為可進而進行陽極氧化之金屬,例如可列舉:鋁;鎂;鈦;包含鋁、鎂或鈦之合金;不鏽鋼等。構成金屬基材10之金屬較佳為鋁;鈦;包含鋁或鈦之合金(例如將鋁作為主成分之鋁合金),更佳為包含鋁之金屬材料即,鋁;包含鋁之合金(例如將鋁作為主成分之鋁合金)。 金屬基材10之形狀可設為用作閘閥時所需之形狀等適當之形狀。金屬基材10之厚度例如為1~30 mm左右。 金屬基材10於其至少一個表面(例如一主面)具有化學蝕刻表面(經化學蝕刻處理之表面)。藉由在化學蝕刻表面積層氟彈性體層30,或於化學蝕刻表面經由氟樹脂層20積層氟彈性體層30,可改善剝離強度。 化學蝕刻處理可為將金屬基材浸漬於酸或鹼液等蝕刻液中之處理。作為蝕刻液,例如可列舉:氫氧化鉀或氫氧化四甲基銨、硝酸、鹽酸等。於金屬基材10包括包含鋁之金屬材料之情形時,作為蝕刻液,較佳為使用氫氧化鈉或硫酸等。 化學蝕刻處理之條件並無特別限制,處理溫度(蝕刻液之溫度)例如可選自10~100℃(更典型地為20~80℃)之範圍。又,蝕刻深度例如為0.1~50 μm,較佳為0.3~20 μm。化學蝕刻處理為了調整蝕刻深度以可獲得下述多孔區域或表面形狀,較佳為調整蝕刻之處理時間、溫度、處理次數等。 經化學蝕刻處理之金屬基材10之表面通常呈現具有某種深度之凹凸形狀。於與化學蝕刻表面相接而積層氟樹脂層20或氟彈性體層30之情形時,較佳為於上述凹凸形狀之至少一部分中,進入構成積層於其上之氟樹脂層20或氟彈性體層30之氟樹脂或氟彈性體。該情況於提高剝離強度之方面較有利。 關於由化學蝕刻處理而導致之上述凹凸形狀,於JIS B 0601:1994中所規定之算術平均粗糙度Ra例如為0.1~50 μm,就提高剝離強度之觀點而言,較佳為0.3~30 μm,更佳為0.5~10 μm。 算術平均粗糙度Ra可使用雷射顯微鏡或三維形狀測定機等而加以測定。 關於化學蝕刻表面(供積層氟樹脂層20或氟彈性體層30之表面)之上述凹凸形狀,就提高剝離強度之觀點而言,於JIS B 0601:1994中所規定之算術平均粗糙度Ra較佳為0.1~50 μm,更佳為0.3~30 μm,進而較佳為0.5~10 μm或0.8~10 μm。就同樣之觀點而言,於JIS B 0601:1994中所規定之上述凹凸形狀之最大高度粗糙度Ry較佳為0.1~100 μm,更佳為0.5~50 μm。又,就同樣之觀點而言,於JIS B 0601:1994中所規定之上述凹凸形狀之十點平均粗糙度Rz較佳為0.3~100 μm,更佳為0.5~50 μm,進而較佳為5~50 μm。 該等表面粗糙度參數可使用雷射顯微鏡或SEM(Scanning Electron Microscope,掃描式電子顯微鏡)等而加以測定。 供積層氟樹脂層20或氟彈性體層30之金屬基材10之表面可為以上述方法形成之藉由對化學蝕刻表面實施陽極氧化處理而形成之具有多孔性之陽極氧化皮膜11之表面。 藉由在陽極氧化皮膜11之表面積層氟彈性體層30,或於陽極氧化皮膜11之表面經由氟樹脂層20積層氟彈性體層30,可改善剝離強度。又,藉由形成陽極氧化皮膜11,可提高金屬基材10之表面硬度,故而可提高藉由化學蝕刻處理及陽極氧化處理形成之表面形狀或孔形狀之保持性。 所謂陽極氧化皮膜11,係藉由將金屬基材10作為陽極之電解處理而形成於金屬基材10之化學蝕刻表面之氧化皮膜(金屬氧化物之皮膜)。電解處理中所使用之電解液並無特別限制,可使用硫酸、草酸、磷酸、鉻酸、硼酸等之水溶液。 對化學蝕刻表面實施陽極氧化處理而獲得之陽極氧化皮膜11通常為多孔膜。陽極氧化皮膜11之開孔徑例如為0.05~100 μm,就提高剝離強度之觀點而言,較佳為0.1~50 μm,更佳為2~30 μm。陽極氧化皮膜11之開孔徑可藉由SEM或TEM(Transmission Electron Microscope,穿透式電子顯微鏡)觀察而進行測定。 陽極氧化皮膜11之孔徑可藉由施加電壓等而進行控制。 較佳為於陽極氧化皮膜11之孔之至少一部分中,進入構成積層於其上之氟樹脂層20或氟彈性體層30之氟樹脂或氟彈性體。該情況於提高剝離強度之方面較有利。 陽極氧化皮膜11之厚度可利用陽極氧化處理時之電量(電流量或電解處理時間)等而進行控制。陽極氧化皮膜11之厚度例如為0.1~100 μm,就提高剝離強度之觀點而言,較佳為0.1~50 μm,更佳為2~40 μm,進而較佳為5~30 μm。陽極氧化皮膜11之厚度可使用Fischer Instruments股份有限公司製造之Fischerscope 「XDL210」等膜厚計而加以測定。 陽極氧化皮膜11之表面(供積層氟樹脂層20或氟彈性體層30之表面)通常具有凹凸形狀。就提高剝離強度之觀點而言,於JIS B 0601:1994中所規定之陽極氧化皮膜11之算術平均粗糙度Ra較佳為0.05~100 μm,更佳為0.1~50 μm,進而較佳為0.3~30 μm,尤佳為0.5~10 μm或0.8~10 μm。就同樣之觀點而言,於JIS B 0601:1994中所規定之陽極氧化皮膜11之最大高度粗糙度Ry較佳為0.1~100 μm,更佳為0.1~50 μm。又,就同樣之觀點而言,於JIS B 0601:1994中所規定之陽極氧化皮膜11之十點平均粗糙度Rz較佳為0.1~100 μm,更佳為0.1~50 μm,進而較佳為0.5~50 μm,尤佳為5~50 μm。 該等表面粗糙度參數可使用雷射顯微鏡或SEM等而加以測定。 (2)氟樹脂層 積層體可包含配置於金屬基材10與氟彈性體層30之間之氟樹脂層20。於該情形時,與金屬基材10之化學蝕刻面或陽極氧化皮膜11之表面相接而積層氟樹脂層20,且與氟樹脂層20之表面相接而積層氟彈性體層30。 存在藉由介存氟樹脂層20,可改善剝離強度之情形。 氟樹脂層20係包含氟樹脂之層。所謂氟樹脂係分子內具有氟原子之熱塑性樹脂,但彈性體除外。氟樹脂可僅單獨使用一種,亦可併用兩種以上。 作為氟樹脂,例如可列舉:聚四氟乙烯(PTFE)、四氟乙烯-全氟烷基乙烯醚共聚物(PFA)、四氟乙烯-六氟丙烯共聚物(FEP)、四氟乙烯-乙烯共聚物(ETFE)、聚氯三氟乙烯(PCTFE)、氯三氟乙烯-乙烯共聚物(ECTFE)、聚偏二氟乙烯(PVDF)、聚氟乙烯(PVF)、偏二氟乙烯-六氟丙烯共聚物(VDF-HFP共聚物)、偏二氟乙烯-六氟丙烯-四氟乙烯共聚物(VDF-HFP-TFE共聚物)等。 其中,就提高剝離強度之觀點而言,可較佳地使用PFA、FEP、ETFE、PVDF。 就利用向化學蝕刻表面或陽極氧化皮膜11之表面之熔融接著進行之氟樹脂層20之形成較容易之方面而言,氟樹脂之熔點較佳為310℃以下,更佳為250℃以下。 氟樹脂層20之厚度例如為0.05 μm~10 mm,就提高剝離強度及積層體之薄膜化之觀點而言,較佳為0.1 μm~5 mm,更佳為10 μm~2 mm,進而較佳為20 μm~1 mm,再者,進而較佳為40 μm~1 mm,尤佳為50~500 μm。 氟樹脂層20可包含氟樹脂以外之成分。作為氟樹脂以外之成分,關於氟彈性體層30,可列舉下述添加劑。其中,就提高剝離強度之觀點而言,較佳為添加劑之量較少,具體而言,氟樹脂層20中之氟樹脂之含有率較佳為80重量%以上,更佳為90重量%以上,進而較佳為95重量%以上(例如為100重量%)。 根據本發明之積層體,可成為金屬基材10與氟彈性體層30之間之剝離強度優異者,另一方面,金屬基材10與氟彈性體層30之接合未使用接著劑,故而於有意地剝離金屬基材10與氟彈性體層30之情形時亦無接著劑殘留於金屬基材10之虞。因此,例如,於因使用而氟彈性體層30劣化之情形時亦可自金屬基材10分離劣化之氟彈性體層30,並對金屬基材10進行再利用,而並非更換整個積層體。 尤其是根據具有金屬基材10/氟樹脂層20/氟彈性體層30之層構成之積層體,由於可藉由加熱使介存於金屬基材10與氟彈性體層30之間之氟樹脂層20熔融,故而可容易地使氟彈性體層30自金屬基材10分離,並對金屬基材10進行回收、再利用。 (3)氟彈性體層 氟彈性體層30包含交聯性氟彈性體之交聯物。氟彈性體層30亦可包含交聯性氟彈性體之交聯物。 氟彈性體層30可藉由使包含交聯性氟彈性體之交聯性氟彈性體組合物進行交聯而形成。 交聯性氟彈性體較佳為可藉由分子鏈間之交聯反應而形成交聯結構,且較佳為藉此可形成表現出橡膠彈性之彈性體(交聯橡膠)者。交聯性氟彈性體較佳為不含熱塑性彈性體。 作為交聯性氟彈性體,可列舉交聯性全氟彈性體(FFKM)、及其以外之氟彈性體(FKM)。 作為FFKM,可列舉四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物、或TFE-全氟(烷氧基烷基乙烯醚)系共聚物等。該等共聚物可進而含有源自其他全氟單體之構成單元。 FFKM可使用1種或2種以上。 形成四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物之全氟(烷基乙烯醚)之烷基之碳數可為1~10,例如可為全氟(甲基乙烯醚)、全氟(乙基乙烯醚)、全氟(丙基乙烯醚)等。較佳為全氟(甲基乙烯醚)。 形成TFE-全氟(烷氧基烷基乙烯醚)系共聚物之全氟(烷氧基烷基乙烯醚)之鍵結於乙烯醚基(CF2
=CFO-)之基之碳數可為3~15,例如可為 CF2
=CFOCF2
CF(CF3
)OCn
F2n+1
、 CF2
=CFO(CF2
)3
OCn
F2n+1
、 CF2
=CFOCF2
CF(CF3
)O(CF2
O)m
Cn
F2n+1
、或 CF2
=CFO(CF2
)2
OCn
F2n+1
。 上述式中,n例如為1~5,m例如為1~3。 藉由使交聯部位單體共聚(包含源自交聯部位單體之構成單元),可對FFKM賦予交聯性。所謂交聯部位係指可進行交聯反應之部位。作為交聯部位,例如可列舉:腈基、鹵基(例如I基、Br基等)、全氟苯基等。 具有腈基作為交聯部位之交聯部位單體之一例為含腈基之全氟乙烯醚。作為含腈基之全氟乙烯醚,例如可列舉: CF2
=CFO(CF2
)n
OCF(CF3
)CN(n例如為2~4)、 CF2
=CFO(CF2
)n
CN(n例如為2~12)、 CF2
=CFO[CF2
CF(CF3
)O]m
(CF2
)n
CN(n例如為2,m例如為1~5)、 CF2
=CFO[CF2
CF(CF3
)O]m
(CF2
)n
CN(n例如為1~4,m例如為1~2)、 CF2
=CFO[CF2
CF(CF3
)O]n
CF2
CF(CF3
)CN(n例如為0~4)等。 具有鹵基作為交聯部位之交聯部位單體之一例為含鹵基之全氟乙烯醚。作為含鹵基之全氟乙烯醚,例如可列舉於上述含腈基之全氟乙烯醚之具體例中,將腈基置換成鹵基而得者。 FFKM可具有使2個主鏈間交聯之交聯結構。 FFKM中之源自TFE之構成單元/全氟(烷基乙烯醚)或源自全氟(烷氧基烷基乙烯醚)之構成單元/源自交聯部位單體之構成單元的比以莫耳比計通常為53.0~79.9%/20.0~46.9%/0.4~1.5%。 亦可使用上述構成單元之比不同之2種以上之FFKM。 作為FFKM以外之氟彈性體之FKM係具有氫原子與氟原子之氟彈性體。 作為FKM,可列舉:偏二氟乙烯(VDF)-六氟丙烯(HFP)系聚合物;偏二氟乙烯(VDF)-六氟丙烯(HFP)-四氟乙烯(TFE)系聚合物;四氟乙烯(TFE)-丙烯(Pr)系聚合物;偏二氟乙烯(VDF)-丙烯(Pr)-四氟乙烯(TFE)系聚合物;乙烯(E)-四氟乙烯(TFE)-全氟甲基乙烯醚(PMVE)系聚合物;偏二氟乙烯(VDF)-四氟乙烯(TFE)-全氟甲基乙烯醚(PMVE)系聚合物、偏二氟乙烯(VDF)-全氟甲基乙烯醚(PMVE)系聚合物。 亦可藉由在FKM中,使交聯部位單體共聚(包含源自交聯部位單體之構成單元),而賦予交聯性。交聯部位單體之例係與FFKM同樣。 交聯性氟彈性體之交聯系並無特別限制,例如,若為FFKM,則可列舉:過氧化物交聯系、雙酚交聯系、三𠯤交聯系、㗁唑交聯系、咪唑交聯系、噻唑交聯系,若為FKM,則可列舉:過氧化物交聯系、聚胺交聯系、多元醇交聯系。 交聯性氟彈性體可利用任1種交聯系進行交聯,亦可利用2種以上之交聯系進行交聯。 交聯性氟彈性體組合物可包含與交聯性氟彈性體之交聯系相對應之交聯劑。 作為過氧化物交聯系中所使用之過氧化物交聯劑(自由基聚合起始劑),例如可列舉:2,5-二甲基-2,5-二(過氧化第三丁基)己烷(市售品之例:日油製造之「Perhexa 25B」);過氧化二異丙苯(市售品之例:日油製造之「Percumyl D」);2,4-二氯苯甲醯過氧化物;二第三丁基過氧化物;第三丁基二異丙苯過氧化物;過氧化苯甲醯(市售品之例:日油製造之「Nyper B」);2,5-二甲基-2,5-(過氧化第三丁基)己炔-3(市售品之例:日油製造之「Perhexin 25B」);2,5-二甲基-2,5-二(過氧化苯甲醯)己烷;α,α'-雙(過氧化第三丁基-間異丙基)苯(市售品之例:日油製造之「PERBUTYL P」);過氧化異丙基碳酸第三丁酯;對氯苯甲醯過氧化物等有機過氧化物。 過氧化物交聯劑可僅使用1種,亦可併用2種以上。 於過氧化物交聯系中,可併用過氧化物交聯劑及共交聯劑。作為共交聯劑,可列舉:異氰尿酸三烯丙酯(市售品之例:日本化成公司製造之「TAIC」);氰尿酸三烯丙酯;三烯丙基縮甲醛;偏苯三酸三烯丙酯;N,N'-間伸苯基雙順丁烯二醯亞胺;對苯二甲酸二丙炔酯;鄰苯二甲酸二烯丙酯;四烯丙基對苯二甲醯胺等可利用自由基進行之共交聯之化合物(不飽和多官能性化合物)。 共交聯劑可僅使用1種,亦可併用2種以上。上述之中,就提高反應性、或於高溫環境下之壓縮永久變形特性(係於高溫環境下使用時之壽命之指標)之觀點而言,共交聯劑較佳為包含異氰尿酸三烯丙酯。 共交聯劑之其他較佳之例為下述式: CH2
=CH-(CF2
)n
-CH=CH2
所表示之二烯烴化合物。式中之n較佳為4~12之整數,更佳為4~8之整數。 可併用上述異氰尿酸三烯丙酯等與二烯烴化合物。 作為㗁唑交聯系中所使用之交聯劑,例如可列舉:2,2-雙(3-胺基-4-羥基苯基)六氟丙烷(BOAP);4,4'-磺醯基雙(2-胺基苯酚)[雙(3-胺基-4-羥基苯基)碸]、3,3'-二胺基聯苯胺、3,3',4,4'-四胺基二苯甲酮。較佳為可使用BOAP。 於三𠯤交聯系中,可使用有機錫化合物、四級鏻鹽或四級銨鹽等鎓鹽、脲、氮化矽等交聯觸媒。 作為咪唑交聯系、噻唑交聯系中所使用之交聯劑,可使用先前公知者。作為咪唑交聯系中所使用之交聯劑,可列舉3,3',4,4'-四胺基二苯甲酮、3,3'-二胺基聯苯胺等。 關於交聯劑(於使用2種以上之情形時為其合計量)之使用量,交聯性氟彈性體每100重量份例如為0.01~20重量份,就提高高溫環境下之壓縮永久變形特性之觀點而言,較佳為10重量份以下,更佳為5重量份以下。 關於共交聯劑(於使用2種以上之情形時為其合計量)之使用量,交聯性氟彈性體每100重量份例如為0.1~40重量份,就提高高溫環境下之壓縮永久變形特性之觀點而言,較佳為0.2~10重量份。 為了改善加工性或調整物性等,交聯性氟彈性體組合物視需要可包含抗老化劑、抗氧化劑、硫化加速劑、加工助劑(硬脂酸等)、穩定劑、黏著賦予劑、矽烷偶合劑、塑化劑、阻燃劑、脫模劑、蠟類、潤滑劑等添加劑。添加劑之其他例為氟系油(例如全氟醚等)之類的黏著性減少(防止)劑。 添加劑可僅使用1種,亦可併用2種以上。 其中,於在高溫環境下使用積層體之情形時等,由於有產生揮發、溶出或析出之虞,故而較佳為添加劑之量儘量地少(例如交聯性氟彈性體每100重量份為10重量份以下,較佳為5重量份以下,更佳為2重量份以下,進而較佳為1重量份以下),較理想為不含添加劑。 交聯性氟彈性體組合物視需要可包含二氧化矽、氧化鋁、氧化鋅、氧化鈦、黏土、滑石、矽藻土、硫酸鋇、碳酸鈣、碳酸鎂、氧化鈣、雲母、石墨、氫氧化鋁、矽酸鋁、水滑石、金屬粉、玻璃粉、陶瓷粉之類的無機填充劑。 其中,無機填充劑若其含量增多,則有於嚴酷之環境下飛散之問題明顯化之虞,故而無機填充劑之量較佳為儘量地少(例如交聯性氟彈性體每100重量份為10重量份以下,較佳為5重量份以下,更佳為2重量份以下,進而較佳為1重量份以下),較理想為不調配無機填充劑。再者,所謂無機填充劑係指含有金屬元素(Ba、Ti、Zn、Al、Mg、Ca、Si等)之填充劑。 氟彈性體層30之厚度通常為0.5~10 mm,就密封性及耐熱性等觀點而言,較佳為1~5 mm。 (4)積層體之用途 本發明之積層體可適宜地用作密封材料,更具體而言,可適宜地用作設置於真空室之閘之閘密封件等。本發明之積層體可尤其適宜地用作於在使用接著劑之先前之積層體中於金屬基材與氟彈性體層之間容易產生剝離之環境下(例如高溫環境、腐蝕性環境、UV環境、電漿環境下等)所使用之閘密封件例如半導體製造裝置用之閘密封件。 <積層體之製造方法> 於金屬基材10之化學蝕刻表面,視需要經由氟樹脂層20積層氟彈性體層30而成之積層體例如可藉由包括以下之步驟之方法而適宜地製造。 準備具有化學蝕刻表面之金屬基材10之步驟(第1-1步驟), 於化學蝕刻表面、或與化學蝕刻表面相接而積層之氟樹脂層20之表面形成包含交聯性氟彈性體之層之步驟(第1-2步驟), 使包含交聯性氟彈性體之層交聯而形成氟彈性體層之步驟(第1-3步驟)。 於藉由對化學蝕刻表面實施陽極氧化處理而形成之具有多孔性之金屬基材10之陽極氧化皮膜11之表面,視需要經由氟樹脂層20積層氟彈性體層30而成之積層體例如可藉由包括以下之步驟之方法而適宜地製造。 準備具有藉由對化學蝕刻表面實施陽極氧化處理而形成有具有多孔性之陽極氧化皮膜11之表面之金屬基材10之步驟(第2-1步驟), 於陽極氧化皮膜11之表面、或與陽極氧化皮膜11之表面相接而積層之氟樹脂層20之表面形成包含交聯性氟彈性體之層之步驟(第2-2步驟), 使包含交聯性氟彈性體之層交聯而形成氟彈性體層之步驟(第2-3步驟)。 藉由上述製造方法而獲得之積層體均可成為金屬基材與氟彈性體層之間之剝離強度優異者。 (1)第1-1步驟及第2-1步驟 第1-1步驟中之具有化學蝕刻表面之金屬基材10可藉由金屬基材之化學蝕刻處理而獲得。 第2-1步驟中之具有形成有陽極氧化皮膜11之表面之金屬基材10可藉由對實施了上述化學蝕刻處理之金屬基材之該化學蝕刻表面實施陽極氧化處理(將金屬基材作為陽極之電解處理)而獲得。對於化學蝕刻處理及陽極氧化處理之更詳細之說明係引用上述<積層體>之項中之記載。 (2)第1-2步驟及第2-2步驟 於第1-2步驟及第2-2步驟包括於金屬基材10之表面(化學蝕刻表面或陽極氧化皮膜11之表面)形成包含交聯性氟彈性體之層之步驟之情形時,作為形成包含交聯性氟彈性體之層之方法,可列舉如下方法:使包含交聯性氟彈性體之上述交聯性氟彈性體組合物成形為特定之形狀(尺寸、厚度)而形成為片狀物,並將其配置於金屬基材10之上述表面。 成形方法可為先前公知之方法,成形溫度例如為130~260℃左右。 於第1-2步驟及第2-2步驟包括於與金屬基材10之表面(化學蝕刻表面或陽極氧化皮膜11之表面)相接而積層之氟樹脂層20之表面形成包含交聯性氟彈性體之層之步驟之情形時,作為於金屬基材10之上述表面形成氟樹脂層20之方法,較佳為於金屬基材10之上述表面使氟樹脂熔融接著之方法。所謂熔融接著係使氟樹脂熔融,並將該熔融樹脂應用(配置)於上述表面之方法。根據該方法,可使熔融樹脂進入至藉由化學蝕刻形成之孔或陽極氧化皮膜11之孔中,故而可有利於剝離強度之提高。 亦可代替氟樹脂,而將包含氟樹脂與其以外之成分(例如上述添加劑)之氟樹脂組合物應用於上述表面。 將熔融樹脂(或包含其之樹脂組合物)應用於上述表面時之樹脂溫度只要為樹脂熔融之溫度即可,例如為氟樹脂之熔點以上,為150~310℃,較佳為180~250℃。若樹脂溫度過高,則處理性降低,並且有樹脂劣化之虞。 於將熔融樹脂應用於上述表面後,例如進行壓縮成形,藉此形成氟樹脂層20。 (3)第1-3步驟及第2-3步驟 藉由使形成於金屬基材10或氟樹脂層20上之包含交聯性氟彈性體之層於高溫加壓下交聯,可獲得積層體。交聯溫度通常為150~280℃左右。 視需要例如為了提高積層體之耐熱性,可於150~320℃左右之溫度下進行二次交聯。亦可藉由游離輻射之照射而進行二次交聯。作為游離輻射,可較佳地使用電子束或γ射線。 [實施例] 以下,列舉實施例及比較例更詳細地說明本發明,但本發明並不限定於該等。 <實施例1> 依據以下之順序,製作積層體。 準備板狀之鋁基材(包含鋁合金。厚度1 mm)。對該鋁基材之一主面實施化學蝕刻處理。化學蝕刻之條件係如下所述。 ・化學蝕刻液:NaOH溶液 ・向化學蝕刻液中之浸漬時間:2分鐘 ・化學蝕刻液之溫度:60℃ 將化學蝕刻表面之表面粗糙度參數之測定結果示於表1。化學蝕刻表面之表面粗糙度參數(於JIS B 0601:1994中所規定之算術平均粗糙度Ra、最大高度粗糙度Ry及十點平均粗糙度Rz)係使用雷射顯微鏡(基恩士股份有限公司製造之「VK-8510」)而進行測定。任一者均對任意之5個部位進行測定,並將其平均值設為Ra、Ry、Rz。於其他實施例中亦同樣。 利用開口滾筒對以下之成分進行混練,而製備氟彈性體組合物。 FKM 100重量份 有機過氧化物 1重量份 共交聯劑 2重量份 FKM係使用Solvay公司製造之偏二氟乙烯-六氟丙烯-四氟乙烯共聚物(VDF-HFP-TFE共聚物)「Tecnoflon P459」(於表1中稱為FKM)。 有機過氧化物係使用日油股份有限公司製造之過氧化物「Perhexa 25B」(化學名:2,5-二甲基-2,5-二(過氧化第三丁基)己烷)。 共交聯劑係使用日本化成公司製造之異氰尿酸三烯丙酯「TAIC」。 利用開口滾筒將上述氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。 於將上述氟彈性體片材配置於鋁基材之化學蝕刻表面後,於180℃、20分鐘之條件下實施熱處理而使氟彈性體片材交聯,進而於200℃、48小時之條件下進行二次交聯,藉此獲得具有鋁基材/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <實施例2> 化學蝕刻表面之表面粗糙度參數係如表1中所示,及作為形成氟彈性體層之交聯性氟彈性體,使用Solvay公司製造之四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物「Tecnoflon PFR94」(於表1中稱為FFKM)代替「Tecnoflon P459」,除此以外,以與實施例1同樣之方式,製作具有鋁基材/氟彈性體層之構成之積層體。 再者,化學蝕刻之條件係設為與實施例1相同。將化學蝕刻表面之表面粗糙度參數之測定結果示於表1。 <實施例3> 依據以下之順序,製作積層體。 準備板狀之鋁基材(包含鋁合金。厚度1 mm)。對該鋁基材之一主面實施化學蝕刻處理。化學蝕刻之條件係設為與實施例1相同。將化學蝕刻表面之表面粗糙度參數之測定結果示於表1。 準備作為氟樹脂之FEP樹脂(Daikin公司製造之「NEOFLON」,熔點270℃,不含源自交聯部位單體之構成單元)。將該FEP樹脂加熱熔融至280℃,並使之於鋁基材之化學蝕刻表面進行壓縮成形(壓接)。利用游標卡尺測得之氟樹脂層之厚度為50 μm(對任意之5個部位進行測定,並將其平均值設為厚度)。 利用開口滾筒將與於實施例1中所使用者相同之氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於氟樹脂層之與鋁基材相反之側之表面上,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟樹脂層/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <實施例4> 依據以下之順序,製作積層體。 以與實施例1同樣之方式,製作具有化學蝕刻表面之板狀之鋁基材。 其次,藉由對化學蝕刻表面實施陽極氧化處理而形成陽極氧化皮膜。陽極氧化處理之條件係如下所述。 ・處理液:硫酸水溶液 ・電壓值:15 V ・浸漬時間:10分鐘 ・處理液之溫度:25℃ 將陽極氧化皮膜之厚度及表面粗糙度參數之測定結果示於表1。 陽極氧化皮膜之厚度係使用Fischer Instruments股份有限公司製造之膜厚計Fischerscope 「XDL210」而進行測定。對任意之5個部位進行測定,並將其平均值設為厚度。於其他實施例中亦同樣。 利用Hitachi High-Tech Fielding股份有限公司製造之SEM「SN-3400N」測得之陽極氧化皮膜之開孔徑為1.7~2.3 μm。 利用開口滾筒將與於實施例1中所使用者相同之氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於鋁基材之陽極氧化皮膜表面,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <實施例5> 作為形成氟彈性體層之交聯性氟彈性體,使用Solvay公司製造之四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物「Tecnoflon PFR94」(於表1中稱為FFKM)代替「Tecnoflon P459」,除此以外,以與實施例4同樣之方式,製作具有鋁基材/氟彈性體層之構成之積層體。 將陽極氧化皮膜之厚度及表面粗糙度參數之測定結果示於表1。 利用Hitachi High-Tech Fielding股份有限公司製造之SEM「SN-3400N」測得之陽極氧化皮膜之開孔徑為0.8~1.5 μm。 <實施例6> 依據以下之順序,製作積層體。 以與實施例4同樣之方式,製作於化學蝕刻表面形成有陽極氧化皮膜之板狀之鋁基材。將陽極氧化皮膜之厚度及表面粗糙度參數之測定結果示於表1。 利用Hitachi High-Tech Fielding股份有限公司製造之SEM「SN-3400N」測得之陽極氧化皮膜之開孔徑為0.9~1.3 μm。 準備作為氟樹脂之FEP樹脂(Daikin公司製造之「NEOFLON」,熔點270℃,不含源自交聯部位單體之構成單元)。將該FEP樹脂加熱熔融至280℃,並使之於鋁基材之化學蝕刻表面進行壓縮成形(壓接)。利用游標卡尺測得之氟樹脂層之厚度為50 μm(對任意之5個部位進行測定,並將其平均值設為厚度)。 利用開口滾筒將與於實施例1中所使用者相同之氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於氟樹脂層之與鋁基材相反之側之表面上,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟樹脂層/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <實施例7> 依據以下之順序,製作積層體。 以與實施例4同樣之方式,製作於化學蝕刻表面形成有陽極氧化皮膜之板狀之鋁基材。將陽極氧化皮膜之厚度及表面粗糙度參數之測定結果示於表1。 利用開口滾筒將與於實施例2中所使用者相同之氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於鋁基材之陽極氧化皮膜表面,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 再者,化學蝕刻之條件係設為與實施例2相同。將化學蝕刻表面之表面粗糙度參數之測定結果示於表1。 <實施例8> 依據以下之順序,製作積層體。 以與實施例7同樣之方式,製作具有化學蝕刻表面之板狀之鋁基材。將化學蝕刻表面之表面粗糙度參數之測定結果示於表1。 準備作為氟樹脂之FEP樹脂(Daikin公司製造之「NEOFLON」,熔點270℃,不含源自交聯部位單體之構成單元)。將該FEP樹脂加熱熔融至280℃,並使之於鋁基材之化學蝕刻表面進行壓縮成形(壓接)。利用游標卡尺測得之氟樹脂層之厚度為50 μm(對任意之5個部位進行測定,並將其平均值設為厚度)。 利用開口滾筒將與於實施例7中所使用者相同之氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於氟樹脂層之與鋁基材相反之側之表面上,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟樹脂層/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <實施例9> 依據以下之順序,製作積層體。 準備板狀之鋁基材(包含鋁合金。厚度1 mm)。對該鋁基材之一主面實施化學蝕刻處理。化學蝕刻之條件係如下所述。 ・化學蝕刻液:NaOH溶液 ・向化學蝕刻液中之浸漬時間:2分鐘 ・化學蝕刻液之溫度:60℃ 其次,藉由對化學蝕刻表面實施陽極氧化處理而形成陽極氧化皮膜。陽極氧化處理之條件係如下所述。 ・處理液:硫酸水溶液 ・電壓值:15 V ・浸漬時間:10分鐘 ・處理液之溫度:25℃ 將陽極氧化皮膜之厚度及表面粗糙度參數之測定結果示於表1。 利用Hitachi High-Tech Fielding股份有限公司製造之SEM「SN-3400N」測得之陽極氧化皮膜之開孔徑為0.7~1.2 μm。 利用開口滾筒對以下之成分進行混練,而製備氟彈性體組合物。 FFKM(全氟彈性體) 100重量份 有機過氧化物 1重量份 共交聯劑 2重量份 FFKM係使用Solvay公司製造之四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物「Tecnoflon PFR94」(於表1中稱為FFKM)。 有機過氧化物係使用日油股份有限公司製造之過氧化物「Perhexa 25B」(化學名:2,5-二甲基-2,5-二(過氧化第三丁基)己烷)。 共交聯劑係使用日本化成公司製造之異氰尿酸三烯丙酯「TAIC」。 利用開口滾筒將上述氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於鋁基材之陽極氧化皮膜表面,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <實施例10> 依據以下之順序,製作積層體。 準備板狀之鋁基材(包含鋁合金。厚度1 mm)。對該鋁基材之一主面實施化學蝕刻處理。化學蝕刻之條件係如下所述。 ・化學蝕刻液:NaOH溶液 ・向化學蝕刻液中之浸漬時間:5分鐘 ・化學蝕刻液之溫度:60℃ 其次,藉由對化學蝕刻表面實施陽極氧化處理而形成陽極氧化皮膜。陽極氧化處理之條件係如下所述。 ・處理液:硫酸水溶液 ・電壓值:15 V ・浸漬時間:10分鐘 ・處理液之溫度:25℃ 將陽極氧化皮膜之厚度及表面粗糙度參數之測定結果示於表1。 利用Hitachi High-Tech Fielding股份有限公司製造之SEM「SN-3400N」測得之陽極氧化皮膜之開孔徑為7.2~8.1 μm。 利用開口滾筒對以下之成分進行混練,而製備氟彈性體組合物。 FFKM(全氟彈性體) 100重量份 有機過氧化物 1重量份 共交聯劑 2重量份 FFKM係使用Solvay公司製造之四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物「Tecnoflon PFR94」(於表1中稱為FFKM)。 有機過氧化物係使用日油股份有限公司製造之過氧化物「Perhexa 25B」(化學名:2,5-二甲基-2,5-二(過氧化第三丁基)己烷)。 共交聯劑係使用日本化成公司製造之異氰尿酸三烯丙酯「TAIC」。 利用開口滾筒將上述氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於鋁基材之陽極氧化皮膜表面,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <比較例1> 依據以下之順序,製作積層體。 準備未實施化學蝕刻處理及陽極氧化處理(氧化鋁膜處理)之板狀之鋁基材(包含鋁合金。厚度1 mm)。 準備作為氟樹脂之FEP樹脂(Daikin公司製造之「NEOFLON」,熔點270℃,不含源自交聯部位單體之構成單元)。將該FEP樹脂加熱熔融至280℃,並使之於鋁基材之表面進行壓縮成形(壓接)。利用游標卡尺測得之氟樹脂層之厚度為50 μm(對任意之5個部位進行測定,並將其平均值設為厚度)。 利用開口滾筒對以下之成分進行混練,而製備氟彈性體組合物。 FFKM(全氟彈性體) 100重量份 有機過氧化物 1重量份 共交聯劑 2重量份 FFKM係使用Solvay公司製造之四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物「Tecnoflon PFR94」(於表1中稱為FFKM)。 有機過氧化物係使用日油股份有限公司製造之過氧化物「Perhexa 25B」(化學名:2,5-二甲基-2,5-二(過氧化第三丁基)己烷)。 共交聯劑係使用日本化成公司製造之異氰尿酸三烯丙酯「TAIC」。 利用開口滾筒將上述氟彈性體組合物成形為片狀,而製作交聯性之氟彈性體片材。將該氟彈性體片材配置於氟樹脂層之與鋁基材相反之側之表面上,其以後係以與實施例1同樣之方式,獲得具有鋁基材/氟樹脂層/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 <比較例2> 依據以下之順序,製作積層體。 準備未實施化學蝕刻處理及陽極氧化處理(氧化鋁膜處理)之板狀之鋁基材(包含鋁合金。厚度1 mm)。 利用開口滾筒對以下之成分進行混練,而製備氟彈性體組合物。 FFKM(全氟彈性體) 100重量份 有機過氧化物 1重量份 共交聯劑 2重量份 FFKM係使用Solvay公司製造之四氟乙烯(TFE)-全氟(烷基乙烯醚)系共聚物「Tecnoflon PFR94」(於表1中稱為FFKM)。 有機過氧化物係使用日油股份有限公司製造之過氧化物「Perhexa 25B」(化學名:2,5-二甲基-2,5-二(過氧化第三丁基)己烷)。 共交聯劑係使用日本化成公司製造之異氰尿酸三烯丙酯「TAIC」。 於鋁基材之一主面,以於交聯處理後所獲得之積層體之厚度成為1 μm之方式塗佈作為矽烷偶合劑系之接著劑之東洋化學研究所公司製造之「Metaloc S-10A」,並於其接著劑層上配置上述氟彈性體片材。其後,於180℃、20分鐘之條件下實施熱處理而使氟彈性體片材交聯,進而於200℃、48小時之條件下進行二次交聯,藉此獲得具有鋁基材/接著劑層/氟彈性體層之構成之積層體。利用游標卡尺測得之氟彈性體層之厚度為2 mm(對任意之5個部位進行測定,並將其平均值設為厚度)。 (剝離強度之評價) 使用拉伸試驗機(Minebea公司製造之「TG-50kN」)而進行於JIS K 6256-2:2013中所規定之90°剝離試驗,並測定鋁基材與氟彈性體層之間之23℃下之剝離強度。將結果示於表1。試片之尺寸係依據上述JIS標準,而設為長度125 mm、寬度25 mm。 [表1]
於實施例1、3、4及6之各者中,使用利用開口滾筒對以下之成分進行混練而成之氟彈性體組合物作為氟彈性體層之形成中所使用之氟彈性體組合物,除此以外,分別以與實施例1、3、4及6同樣之方式製作積層體,並進行剝離強度之評價,結果分別獲得與實施例1、3、4及6相同之值。 FKM(聚偏二氟乙烯,Daikin Industries股份有限公司製造之G-755) 100重量份 MT(Medium Thermal,中粒子熱裂法)碳黑(Cancarb公司製造之Thermax N-990) 20重量份 氧化鎂(協和化學工業股份有限公司製造之KYOWAMAG 30) 15重量份 硫化劑(Daikin Industries股份有限公司製造之V-3) 3重量份 於使用該氟彈性體組合物之情形時,將加壓成形條件設為160℃、20分鐘,繼而設為310℃、10分鐘,並將二次交聯條件設為150℃、48小時。 又,於實施例1、3、4及6之各者中,使用利用開口滾筒對以下之成分進行混練而成之氟彈性體組合物作為氟彈性體層之形成中所使用之氟彈性體組合物,除此以外,分別以與實施例1、3、4及6同樣之方式製作積層體,並進行剝離強度之評價,結果分別獲得與實施例1、3、4及6相同之值。 FKM(偏二氟乙烯/六氟丙烯共聚物,Daikin Industries股份有限公司製造之G-755) 100重量份 SRF(Semi-reinforcing furnace,半補強爐法)碳黑(東海碳股份有限公司 Seast S) 13重量份 氫氧化鈣(近江化學工業股份有限公司製造之CALDIC♯2000) 6重量份 氧化鎂(協和化學工業股份有限公司製造之KYOWAMAG 150) 3重量份 於使用該氟彈性體組合物之情形時,將加壓成形條件設為160℃、45分鐘,繼而設為275℃、10分鐘,並將二次交聯條件設為150℃、48小時。
10‧‧‧金屬基材11‧‧‧陽極氧化皮膜20‧‧‧氟樹脂層30‧‧‧氟彈性體層
圖1係表示本發明之積層體之一例之概略剖視圖。 圖2係表示本發明之積層體之另一例之概略剖視圖。 圖3係表示本發明之積層體之另一例之概略剖視圖。
10‧‧‧金屬基材
30‧‧‧氟彈性體層
Claims (11)
- 一種積層體,其包含:金屬基材,其具有化學蝕刻表面,該化學蝕刻表面之於JIS B 0601:1994中所規定之算術平均粗糙度Ra為0.1~50μm;及氟彈性體層,其係與氟樹脂層之表面相接而積層,該氟樹脂層係與上述化學蝕刻表面相接而積層。
- 一種積層體,其包含:金屬基材,其具有藉由對化學蝕刻表面實施陽極氧化處理而形成有具有多孔性之陽極氧化皮膜之表面,該化學蝕刻表面之於JIS B 0601:1994中所規定之算術平均粗糙度Ra為0.1~50μm;及氟彈性體層,其係與上述陽極氧化皮膜相接而積層,或與氟樹脂層之表面相接而積層,該氟樹脂層係與上述陽極氧化皮膜相接而積層。
- 如請求項1或2之積層體,其中上述氟彈性體層包含交聯性全氟彈性體之交聯物。
- 如請求項1或2之積層體,其中上述金屬基材包含鋁。
- 一種閘密封件,其包含如請求項1至4中任一項之積層體。
- 一種積層體之製造方法,其包括如下步驟: 準備具有化學蝕刻表面之金屬基材之步驟,該化學蝕刻表面之於JIS B 0601:1994中所規定之算術平均粗糙度Ra為0.1~50μm;於與上述化學蝕刻表面相接而積層之氟樹脂層之表面形成包含交聯性氟彈性體之層之步驟;及使上述包含交聯性氟彈性體之層交聯而形成氟彈性體層之步驟。
- 如請求項6之積層體之製造方法,其中上述形成包含交聯性氟彈性體之層之步驟包括如下步驟:於將熔融後之氟樹脂配置於上述化學蝕刻表面後,進行壓縮成形而形成上述氟樹脂層之步驟;及於上述氟樹脂層之與上述金屬基材相反之側之表面形成上述包含交聯性氟彈性體之層之步驟。
- 一種積層體之製造方法,其包括如下步驟:準備具有藉由對化學蝕刻表面實施陽極氧化處理而形成有具有多孔性之陽極氧化皮膜之表面之金屬基材之步驟,該化學蝕刻表面之於JIS B 0601:1994中所規定之算術平均粗糙度Ra為0.1~50μm;於上述陽極氧化皮膜之表面、或與上述陽極氧化皮膜之表面相接而積層之氟樹脂層之表面形成包含交聯性氟彈性體之層之步驟;及使上述包含交聯性氟彈性體之層交聯而形成氟彈性體層之步驟。
- 如請求項8之積層體之製造方法,其中上述形成包含交聯性氟彈性體之層之步驟包括如下步驟: 於將熔融後之氟樹脂配置於上述陽極氧化皮膜之表面後,進行壓縮成形而形成上述氟樹脂層之步驟;及於上述氟樹脂層之與上述金屬基材相反之側之表面形成上述包含交聯性氟彈性體之層之步驟。
- 如請求項6至9中任一項之積層體之製造方法,其中上述交聯性氟彈性體為交聯性全氟彈性體。
- 如請求項6至9中任一項之積層體之製造方法,其中上述金屬基材包含鋁。
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- 2018-03-22 CN CN201880023423.1A patent/CN110494598B/zh active Active
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WO2018180870A1 (ja) | 2018-10-04 |
US20200024765A1 (en) | 2020-01-23 |
US11236432B2 (en) | 2022-02-01 |
CN110494598B (zh) | 2022-05-10 |
KR102357437B1 (ko) | 2022-01-28 |
KR20190126367A (ko) | 2019-11-11 |
CN110494598A (zh) | 2019-11-22 |
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