TWI818470B - 測定工具、基板處理裝置以及基板製造方法 - Google Patents

測定工具、基板處理裝置以及基板製造方法 Download PDF

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Publication number
TWI818470B
TWI818470B TW111109728A TW111109728A TWI818470B TW I818470 B TWI818470 B TW I818470B TW 111109728 A TW111109728 A TW 111109728A TW 111109728 A TW111109728 A TW 111109728A TW I818470 B TWI818470 B TW I818470B
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TW
Taiwan
Prior art keywords
substrate
load
holding
contact
holding member
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TW111109728A
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English (en)
Chinese (zh)
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TW202238772A (zh
Inventor
古矢正明
小林浩秋
森秀樹
Original Assignee
日商芝浦機械電子裝置股份有限公司
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Publication of TW202238772A publication Critical patent/TW202238772A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0028—Force sensors associated with force applying means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0061—Force sensors associated with industrial machines or actuators
    • G01L5/0076—Force sensors associated with manufacturing machines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Robotics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Wire Bonding (AREA)
TW111109728A 2021-03-17 2022-03-17 測定工具、基板處理裝置以及基板製造方法 TWI818470B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021043559A JP7624331B2 (ja) 2021-03-17 2021-03-17 測定ツール、基板処理装置及び基板製造方法
JP2021-043559 2021-03-17

Publications (2)

Publication Number Publication Date
TW202238772A TW202238772A (zh) 2022-10-01
TWI818470B true TWI818470B (zh) 2023-10-11

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TW111109728A TWI818470B (zh) 2021-03-17 2022-03-17 測定工具、基板處理裝置以及基板製造方法

Country Status (4)

Country Link
JP (1) JP7624331B2 (https=)
KR (1) KR102719872B1 (https=)
CN (1) CN115112280B (https=)
TW (1) TWI818470B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023123066A1 (de) * 2023-08-28 2025-03-06 SmarAct Holding GmbH Kraftbestimmungsvorrichtung, Kraftbestimmungsverfahren, System und Verfahren zur Ausrichtung eines ersten Objekts zu einem zweiten Objekt

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050072358A1 (en) * 2002-11-15 2005-04-07 Seiji Katsuoka Substrate processing apparatus and substrate processing method
TW201234515A (en) * 2010-09-28 2012-08-16 Tokyo Electron Ltd Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method
TW201508859A (zh) * 2013-06-18 2015-03-01 斯克林集團公司 基板保持旋轉裝置及具備其之基板處理裝置，暨基板處理方法
TW201515134A (zh) * 2013-05-27 2015-04-16 東京威力科創股份有限公司 基板脫離檢測裝置及基板脫離檢測方法，以及使用此等之基板處理裝置及基板處理方法
TW201706446A (zh) * 2015-04-14 2017-02-16 荏原製作所股份有限公司 基板處理裝置及基板處理方法
US20190019710A1 (en) * 2017-07-12 2019-01-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

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JP3629751B2 (ja) * 1995-04-14 2005-03-16 ソニー株式会社 自動バフ研磨装置
JPH10199845A (ja) * 1997-01-14 1998-07-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP4327304B2 (ja) 1999-07-27 2009-09-09 芝浦メカトロニクス株式会社 スピン処理装置
JP2004079587A (ja) 2002-08-09 2004-03-11 Reitetsukusu:Kk ウエハ回転装置とこれを有する端部傷検査装置
JP2007220952A (ja) * 2006-02-17 2007-08-30 Dainippon Screen Mfg Co Ltd 基板位置決め方法、基板位置決め装置および基板処理装置
JP2008216014A (ja) * 2007-03-02 2008-09-18 Honda Motor Co Ltd 回転角度算出装置及び変位量算出装置
JP4367669B2 (ja) * 2008-04-01 2009-11-18 株式会社アドウェルズ 保持装置
JP2012043985A (ja) 2010-08-19 2012-03-01 Shin Etsu Polymer Co Ltd 半導体ウェーハの支持構造検討装置
TWI661479B (zh) * 2015-02-12 2019-06-01 Screen Holdings Co,. Ltd. 基板處理裝置、基板處理系統以及基板處理方法
KR101703904B1 (ko) 2015-08-28 2017-02-22 (주)오로스 테크놀로지 웨이퍼 그립핑 장치 및 이를 포함하는 양면 웨이퍼 스트레스 검사장치
KR102596608B1 (ko) * 2016-07-26 2023-11-01 주식회사 케이씨텍 기판 스피닝 장치 및 그 제어방법
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US20050072358A1 (en) * 2002-11-15 2005-04-07 Seiji Katsuoka Substrate processing apparatus and substrate processing method
TW201234515A (en) * 2010-09-28 2012-08-16 Tokyo Electron Ltd Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method
TW201515134A (zh) * 2013-05-27 2015-04-16 東京威力科創股份有限公司 基板脫離檢測裝置及基板脫離檢測方法，以及使用此等之基板處理裝置及基板處理方法
TW201508859A (zh) * 2013-06-18 2015-03-01 斯克林集團公司 基板保持旋轉裝置及具備其之基板處理裝置，暨基板處理方法
TW201706446A (zh) * 2015-04-14 2017-02-16 荏原製作所股份有限公司 基板處理裝置及基板處理方法
US20190019710A1 (en) * 2017-07-12 2019-01-17 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
JP7624331B2 (ja) 2025-01-30
TW202238772A (zh) 2022-10-01
KR20220130029A (ko) 2022-09-26
KR102719872B1 (ko) 2024-10-22
CN115112280A (zh) 2022-09-27
JP2022143176A (ja) 2022-10-03
CN115112280B (zh) 2025-01-03

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