TWI816897B - 用於在基板中形成穿孔的方法 - Google Patents

用於在基板中形成穿孔的方法 Download PDF

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Publication number
TWI816897B
TWI816897B TW108135498A TW108135498A TWI816897B TW I816897 B TWI816897 B TW I816897B TW 108135498 A TW108135498 A TW 108135498A TW 108135498 A TW108135498 A TW 108135498A TW I816897 B TWI816897 B TW I816897B
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TW
Taiwan
Prior art keywords
substrate
laser
pulse
focused beam
repetition rate
Prior art date
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TW108135498A
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English (en)
Chinese (zh)
Other versions
TW202023734A (zh
Inventor
松本久
傑恩 克雷能特
林智斌
Original Assignee
美商伊雷克托科學工業股份有限公司
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Publication of TW202023734A publication Critical patent/TW202023734A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
TW108135498A 2018-10-08 2019-10-01 用於在基板中形成穿孔的方法 TWI816897B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862742694P 2018-10-08 2018-10-08
US62/742,694 2018-10-08

Publications (2)

Publication Number Publication Date
TW202023734A TW202023734A (zh) 2020-07-01
TWI816897B true TWI816897B (zh) 2023-10-01

Family

ID=70164817

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108135498A TWI816897B (zh) 2018-10-08 2019-10-01 用於在基板中形成穿孔的方法
TW112133781A TWI866446B (zh) 2018-10-08 2019-10-01 用於在基板中形成穿孔的方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112133781A TWI866446B (zh) 2018-10-08 2019-10-01 用於在基板中形成穿孔的方法

Country Status (9)

Country Link
US (2) US12070819B2 (https=)
EP (2) EP3843934B1 (https=)
JP (3) JP2022504439A (https=)
KR (1) KR102640881B1 (https=)
CN (2) CN112714681B (https=)
LT (1) LT3843934T (https=)
SG (1) SG11202101843SA (https=)
TW (2) TWI816897B (https=)
WO (1) WO2020076583A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
CN117226254B (zh) * 2023-11-02 2024-06-21 武汉华日精密激光股份有限公司 基于超快激光-长脉冲激光复合的激光打孔装置及方法
JP2026057143A (ja) 2024-09-20 2026-04-02 新東工業株式会社 造型システム及び造型方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150246415A1 (en) * 2014-02-28 2015-09-03 Rofin-Sinar Technologies Inc. Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
TW201536462A (zh) * 2013-12-17 2015-10-01 康寧公司 在玻璃中快速雷射鑽孔孔洞的方法及由該方法所製得的產品
CN104759764B (zh) * 2015-03-28 2018-02-02 大族激光科技产业集团股份有限公司 一种玻璃的激光钻孔方法
CN108161250A (zh) * 2018-01-30 2018-06-15 苏州德龙激光股份有限公司 多焦点动态分布激光加工脆性透明材料的方法及装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
FR2542327B1 (https=) 1983-03-07 1986-03-07 Bensoussan Marcel
US5293025A (en) 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US6417485B1 (en) * 2000-05-30 2002-07-09 Igor Troitski Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images
JP2004337901A (ja) 2003-05-14 2004-12-02 Sumitomo Heavy Ind Ltd グリーンシートの孔加工方法およびグリーンシート載置用定盤
GB0403865D0 (en) * 2004-02-20 2004-03-24 Powerlase Ltd Laser multiplexing
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US7767595B2 (en) 2006-10-26 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP2008288577A (ja) 2007-04-18 2008-11-27 Fujikura Ltd 基板の処理方法、貫通配線基板及びその製造方法、並びに電子部品
US8736026B2 (en) 2009-02-27 2014-05-27 Picodrill Sa Method of generating a hole or recess or well in a substrate
EP2480507A1 (en) * 2009-08-28 2012-08-01 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
JP2016508069A (ja) 2012-11-29 2016-03-17 コーニング インコーポレイテッド 基板をレーザー穿孔するための犠牲カバー層およびその方法
US9102007B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
US20150121960A1 (en) 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US20150165560A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
JP6734202B2 (ja) 2015-01-13 2020-08-05 ロフィン−シナール テクノロジーズ エルエルシー 脆性材料をスクライブして化学エッチングする方法およびシステム
WO2016122821A2 (en) 2015-01-29 2016-08-04 Imra America, Inc. Laser-based modification of transparent materials
US10507544B2 (en) 2015-02-27 2019-12-17 Electro Scientific Industries, Inc Fast beam manipulation for cross-axis miromaching
US20160368086A1 (en) 2015-06-16 2016-12-22 Electro Scientific Industries, Inc. Methods and apparatus for processing transparent materials
JP6813168B2 (ja) 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置
US10366904B2 (en) 2016-09-08 2019-07-30 Corning Incorporated Articles having holes with morphology attributes and methods for fabricating the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201536462A (zh) * 2013-12-17 2015-10-01 康寧公司 在玻璃中快速雷射鑽孔孔洞的方法及由該方法所製得的產品
US20150246415A1 (en) * 2014-02-28 2015-09-03 Rofin-Sinar Technologies Inc. Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
CN104759764B (zh) * 2015-03-28 2018-02-02 大族激光科技产业集团股份有限公司 一种玻璃的激光钻孔方法
CN108161250A (zh) * 2018-01-30 2018-06-15 苏州德龙激光股份有限公司 多焦点动态分布激光加工脆性透明材料的方法及装置

Also Published As

Publication number Publication date
US20210245303A1 (en) 2021-08-12
JP2024164063A (ja) 2024-11-26
JP7539539B2 (ja) 2024-08-23
WO2020076583A1 (en) 2020-04-16
EP3843934A4 (en) 2022-06-22
SG11202101843SA (en) 2021-03-30
CN112714681B (zh) 2023-09-22
LT3843934T (lt) 2024-11-25
KR102640881B1 (ko) 2024-02-27
TW202023734A (zh) 2020-07-01
JP2022504439A (ja) 2022-01-13
US20240391030A1 (en) 2024-11-28
TWI866446B (zh) 2024-12-11
JP2023175728A (ja) 2023-12-12
JP7787259B2 (ja) 2025-12-16
CN119407374A (zh) 2025-02-11
EP4474097A2 (en) 2024-12-11
EP3843934B1 (en) 2024-09-18
EP4474097A3 (en) 2025-03-19
TW202400349A (zh) 2024-01-01
CN112714681A (zh) 2021-04-27
KR20210057819A (ko) 2021-05-21
US12070819B2 (en) 2024-08-27
EP3843934A1 (en) 2021-07-07

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