JP2022504439A - 透過性を有する材料にビアを穿孔するためのシステム及び方法 - Google Patents

透過性を有する材料にビアを穿孔するためのシステム及び方法 Download PDF

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Publication number
JP2022504439A
JP2022504439A JP2021518967A JP2021518967A JP2022504439A JP 2022504439 A JP2022504439 A JP 2022504439A JP 2021518967 A JP2021518967 A JP 2021518967A JP 2021518967 A JP2021518967 A JP 2021518967A JP 2022504439 A JP2022504439 A JP 2022504439A
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Prior art keywords
substrate
laser pulse
focused laser
pulse
laser
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Pending
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JP2021518967A
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English (en)
Japanese (ja)
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JP2022504439A5 (https=
Inventor
久 松本
クライネルト，ヤン
リン，ジィビン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Publication of JP2022504439A publication Critical patent/JP2022504439A/ja
Publication of JP2022504439A5 publication Critical patent/JP2022504439A5/ja
Priority to JP2023142673A priority Critical patent/JP7539539B2/ja
Priority to JP2024134762A priority patent/JP7787259B2/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2021518967A 2018-10-08 2019-10-02 透過性を有する材料にビアを穿孔するためのシステム及び方法 Pending JP2022504439A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2023142673A JP7539539B2 (ja) 2018-10-08 2023-09-04 透過性を有する材料にビアを穿孔するためのシステム及び方法
JP2024134762A JP7787259B2 (ja) 2018-10-08 2024-08-13 透過性を有する材料にビアを穿孔するためのシステム及び方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862742694P 2018-10-08 2018-10-08
US62/742,694 2018-10-08
PCT/US2019/054271 WO2020076583A1 (en) 2018-10-08 2019-10-02 Systems and methods for drilling vias in transparent materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023142673A Division JP7539539B2 (ja) 2018-10-08 2023-09-04 透過性を有する材料にビアを穿孔するためのシステム及び方法

Publications (2)

Publication Number Publication Date
JP2022504439A true JP2022504439A (ja) 2022-01-13
JP2022504439A5 JP2022504439A5 (https=) 2022-09-27

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JP2021518967A Pending JP2022504439A (ja) 2018-10-08 2019-10-02 透過性を有する材料にビアを穿孔するためのシステム及び方法
JP2023142673A Active JP7539539B2 (ja) 2018-10-08 2023-09-04 透過性を有する材料にビアを穿孔するためのシステム及び方法
JP2024134762A Active JP7787259B2 (ja) 2018-10-08 2024-08-13 透過性を有する材料にビアを穿孔するためのシステム及び方法

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JP2023142673A Active JP7539539B2 (ja) 2018-10-08 2023-09-04 透過性を有する材料にビアを穿孔するためのシステム及び方法
JP2024134762A Active JP7787259B2 (ja) 2018-10-08 2024-08-13 透過性を有する材料にビアを穿孔するためのシステム及び方法

Country Status (9)

Country Link
US (2) US12070819B2 (https=)
EP (2) EP3843934B1 (https=)
JP (3) JP2022504439A (https=)
KR (1) KR102640881B1 (https=)
CN (2) CN112714681B (https=)
LT (1) LT3843934T (https=)
SG (1) SG11202101843SA (https=)
TW (2) TWI816897B (https=)
WO (1) WO2020076583A1 (https=)

Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
CN117226254B (zh) * 2023-11-02 2024-06-21 武汉华日精密激光股份有限公司 基于超快激光-长脉冲激光复合的激光打孔装置及方法
JP2026057143A (ja) 2024-09-20 2026-04-02 新東工業株式会社 造型システム及び造型方法

Citations (1)

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US6417485B1 (en) * 2000-05-30 2002-07-09 Igor Troitski Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images
JP2004337901A (ja) 2003-05-14 2004-12-02 Sumitomo Heavy Ind Ltd グリーンシートの孔加工方法およびグリーンシート載置用定盤
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Publication number Publication date
TWI816897B (zh) 2023-10-01
US20210245303A1 (en) 2021-08-12
JP2024164063A (ja) 2024-11-26
JP7539539B2 (ja) 2024-08-23
WO2020076583A1 (en) 2020-04-16
EP3843934A4 (en) 2022-06-22
SG11202101843SA (en) 2021-03-30
CN112714681B (zh) 2023-09-22
LT3843934T (lt) 2024-11-25
KR102640881B1 (ko) 2024-02-27
TW202023734A (zh) 2020-07-01
US20240391030A1 (en) 2024-11-28
TWI866446B (zh) 2024-12-11
JP2023175728A (ja) 2023-12-12
JP7787259B2 (ja) 2025-12-16
CN119407374A (zh) 2025-02-11
EP4474097A2 (en) 2024-12-11
EP3843934B1 (en) 2024-09-18
EP4474097A3 (en) 2025-03-19
TW202400349A (zh) 2024-01-01
CN112714681A (zh) 2021-04-27
KR20210057819A (ko) 2021-05-21
US12070819B2 (en) 2024-08-27
EP3843934A1 (en) 2021-07-07

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