CN112714681B - 用于在透明材料中的钻孔的系统和方法 - Google Patents

用于在透明材料中的钻孔的系统和方法 Download PDF

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Publication number
CN112714681B
CN112714681B CN201980060712.3A CN201980060712A CN112714681B CN 112714681 B CN112714681 B CN 112714681B CN 201980060712 A CN201980060712 A CN 201980060712A CN 112714681 B CN112714681 B CN 112714681B
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China
Prior art keywords
substrate
laser
laser pulses
focused beam
pulse
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CN201980060712.3A
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English (en)
Chinese (zh)
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CN112714681A (zh
Inventor
松本·久
杰恩·克雷能特
林智斌
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Irecto Science Industry Co ltd
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Irecto Science Industry Co ltd
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Priority to CN202311368358.5A priority Critical patent/CN119407374A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • B23K26/402Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic materials other than metals or composite materials

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201980060712.3A 2018-10-08 2019-10-02 用于在透明材料中的钻孔的系统和方法 Active CN112714681B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311368358.5A CN119407374A (zh) 2018-10-08 2019-10-02 用于在透明材料中的钻孔的系统和方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862742694P 2018-10-08 2018-10-08
US62/742,694 2018-10-08
PCT/US2019/054271 WO2020076583A1 (en) 2018-10-08 2019-10-02 Systems and methods for drilling vias in transparent materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202311368358.5A Division CN119407374A (zh) 2018-10-08 2019-10-02 用于在透明材料中的钻孔的系统和方法

Publications (2)

Publication Number Publication Date
CN112714681A CN112714681A (zh) 2021-04-27
CN112714681B true CN112714681B (zh) 2023-09-22

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CN201980060712.3A Active CN112714681B (zh) 2018-10-08 2019-10-02 用于在透明材料中的钻孔的系统和方法
CN202311368358.5A Pending CN119407374A (zh) 2018-10-08 2019-10-02 用于在透明材料中的钻孔的系统和方法

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US (2) US12070819B2 (https=)
EP (2) EP3843934B1 (https=)
JP (3) JP2022504439A (https=)
KR (1) KR102640881B1 (https=)
CN (2) CN112714681B (https=)
LT (1) LT3843934T (https=)
SG (1) SG11202101843SA (https=)
TW (2) TWI816897B (https=)
WO (1) WO2020076583A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
CN117226254B (zh) * 2023-11-02 2024-06-21 武汉华日精密激光股份有限公司 基于超快激光-长脉冲激光复合的激光打孔装置及方法
JP2026057143A (ja) 2024-09-20 2026-04-02 新東工業株式会社 造型システム及び造型方法

Citations (1)

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CN106029286A (zh) * 2013-12-17 2016-10-12 康宁股份有限公司 在玻璃中进行快速激光钻孔的方法和由其制备的产品

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JP2004337901A (ja) 2003-05-14 2004-12-02 Sumitomo Heavy Ind Ltd グリーンシートの孔加工方法およびグリーンシート載置用定盤
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Publication number Publication date
TWI816897B (zh) 2023-10-01
US20210245303A1 (en) 2021-08-12
JP2024164063A (ja) 2024-11-26
JP7539539B2 (ja) 2024-08-23
WO2020076583A1 (en) 2020-04-16
EP3843934A4 (en) 2022-06-22
SG11202101843SA (en) 2021-03-30
LT3843934T (lt) 2024-11-25
KR102640881B1 (ko) 2024-02-27
TW202023734A (zh) 2020-07-01
JP2022504439A (ja) 2022-01-13
US20240391030A1 (en) 2024-11-28
TWI866446B (zh) 2024-12-11
JP2023175728A (ja) 2023-12-12
JP7787259B2 (ja) 2025-12-16
CN119407374A (zh) 2025-02-11
EP4474097A2 (en) 2024-12-11
EP3843934B1 (en) 2024-09-18
EP4474097A3 (en) 2025-03-19
TW202400349A (zh) 2024-01-01
CN112714681A (zh) 2021-04-27
KR20210057819A (ko) 2021-05-21
US12070819B2 (en) 2024-08-27
EP3843934A1 (en) 2021-07-07

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