LT3843934T - Permatomose medžiagose esančių pralaidumų gręžimo būdai - Google Patents

Permatomose medžiagose esančių pralaidumų gręžimo būdai

Info

Publication number
LT3843934T
LT3843934T LTEPPCT/US2019/054271T LTUS2019054271T LT3843934T LT 3843934 T LT3843934 T LT 3843934T LT US2019054271 T LTUS2019054271 T LT US2019054271T LT 3843934 T LT3843934 T LT 3843934T
Authority
LT
Lithuania
Prior art keywords
methods
transparent materials
drilling vias
vias
drilling
Prior art date
Application number
LTEPPCT/US2019/054271T
Other languages
English (en)
Lithuanian (lt)
Inventor
Hisashi Matsumoto
Jan Kleinert
Zhibin Lin
Original Assignee
Electro Scientific Industries, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries, Inc. filed Critical Electro Scientific Industries, Inc.
Publication of LT3843934T publication Critical patent/LT3843934T/lt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
LTEPPCT/US2019/054271T 2018-10-08 2019-10-02 Permatomose medžiagose esančių pralaidumų gręžimo būdai LT3843934T (lt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862742694P 2018-10-08 2018-10-08
PCT/US2019/054271 WO2020076583A1 (en) 2018-10-08 2019-10-02 Systems and methods for drilling vias in transparent materials

Publications (1)

Publication Number Publication Date
LT3843934T true LT3843934T (lt) 2024-11-25

Family

ID=70164817

Family Applications (1)

Application Number Title Priority Date Filing Date
LTEPPCT/US2019/054271T LT3843934T (lt) 2018-10-08 2019-10-02 Permatomose medžiagose esančių pralaidumų gręžimo būdai

Country Status (9)

Country Link
US (2) US12070819B2 (https=)
EP (2) EP3843934B1 (https=)
JP (3) JP2022504439A (https=)
KR (1) KR102640881B1 (https=)
CN (2) CN112714681B (https=)
LT (1) LT3843934T (https=)
SG (1) SG11202101843SA (https=)
TW (2) TWI816897B (https=)
WO (1) WO2020076583A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
CN117226254B (zh) * 2023-11-02 2024-06-21 武汉华日精密激光股份有限公司 基于超快激光-长脉冲激光复合的激光打孔装置及方法
JP2026057143A (ja) 2024-09-20 2026-04-02 新東工業株式会社 造型システム及び造型方法

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US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
FR2542327B1 (https=) 1983-03-07 1986-03-07 Bensoussan Marcel
US5293025A (en) 1991-08-01 1994-03-08 E. I. Du Pont De Nemours And Company Method for forming vias in multilayer circuits
US6417485B1 (en) * 2000-05-30 2002-07-09 Igor Troitski Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images
JP2004337901A (ja) 2003-05-14 2004-12-02 Sumitomo Heavy Ind Ltd グリーンシートの孔加工方法およびグリーンシート載置用定盤
GB0403865D0 (en) * 2004-02-20 2004-03-24 Powerlase Ltd Laser multiplexing
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
US7767595B2 (en) 2006-10-26 2010-08-03 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
JP2008288577A (ja) 2007-04-18 2008-11-27 Fujikura Ltd 基板の処理方法、貫通配線基板及びその製造方法、並びに電子部品
US8736026B2 (en) 2009-02-27 2014-05-27 Picodrill Sa Method of generating a hole or recess or well in a substrate
EP2480507A1 (en) * 2009-08-28 2012-08-01 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
JP2016508069A (ja) 2012-11-29 2016-03-17 コーニング インコーポレイテッド 基板をレーザー穿孔するための犠牲カバー層およびその方法
US9102007B2 (en) 2013-08-02 2015-08-11 Rofin-Sinar Technologies Inc. Method and apparatus for performing laser filamentation within transparent materials
US20150121960A1 (en) 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
US9517929B2 (en) 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US10144088B2 (en) 2013-12-03 2018-12-04 Rofin-Sinar Technologies Llc Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
US10293436B2 (en) * 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9938187B2 (en) * 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
JP6734202B2 (ja) 2015-01-13 2020-08-05 ロフィン−シナール テクノロジーズ エルエルシー 脆性材料をスクライブして化学エッチングする方法およびシステム
WO2016122821A2 (en) 2015-01-29 2016-08-04 Imra America, Inc. Laser-based modification of transparent materials
US10507544B2 (en) 2015-02-27 2019-12-17 Electro Scientific Industries, Inc Fast beam manipulation for cross-axis miromaching
CN104759764B (zh) * 2015-03-28 2018-02-02 大族激光科技产业集团股份有限公司 一种玻璃的激光钻孔方法
US20160368086A1 (en) 2015-06-16 2016-12-22 Electro Scientific Industries, Inc. Methods and apparatus for processing transparent materials
JP6813168B2 (ja) 2016-07-29 2021-01-13 三星ダイヤモンド工業株式会社 脆性材料基板のレーザー加工方法およびレーザー加工装置
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Also Published As

Publication number Publication date
TWI816897B (zh) 2023-10-01
US20210245303A1 (en) 2021-08-12
JP2024164063A (ja) 2024-11-26
JP7539539B2 (ja) 2024-08-23
WO2020076583A1 (en) 2020-04-16
EP3843934A4 (en) 2022-06-22
SG11202101843SA (en) 2021-03-30
CN112714681B (zh) 2023-09-22
KR102640881B1 (ko) 2024-02-27
TW202023734A (zh) 2020-07-01
JP2022504439A (ja) 2022-01-13
US20240391030A1 (en) 2024-11-28
TWI866446B (zh) 2024-12-11
JP2023175728A (ja) 2023-12-12
JP7787259B2 (ja) 2025-12-16
CN119407374A (zh) 2025-02-11
EP4474097A2 (en) 2024-12-11
EP3843934B1 (en) 2024-09-18
EP4474097A3 (en) 2025-03-19
TW202400349A (zh) 2024-01-01
CN112714681A (zh) 2021-04-27
KR20210057819A (ko) 2021-05-21
US12070819B2 (en) 2024-08-27
EP3843934A1 (en) 2021-07-07

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