SG11202101843SA - Systems and methods for drilling vias in transparent materials - Google Patents
Systems and methods for drilling vias in transparent materialsInfo
- Publication number
- SG11202101843SA SG11202101843SA SG11202101843SA SG11202101843SA SG11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA
- Authority
- SG
- Singapore
- Prior art keywords
- systems
- methods
- transparent materials
- drilling vias
- vias
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Surface Treatment Of Glass (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862742694P | 2018-10-08 | 2018-10-08 | |
| PCT/US2019/054271 WO2020076583A1 (en) | 2018-10-08 | 2019-10-02 | Systems and methods for drilling vias in transparent materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202101843SA true SG11202101843SA (en) | 2021-03-30 |
Family
ID=70164817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202101843SA SG11202101843SA (en) | 2018-10-08 | 2019-10-02 | Systems and methods for drilling vias in transparent materials |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US12070819B2 (https=) |
| EP (2) | EP3843934B1 (https=) |
| JP (3) | JP2022504439A (https=) |
| KR (1) | KR102640881B1 (https=) |
| CN (2) | CN112714681B (https=) |
| LT (1) | LT3843934T (https=) |
| SG (1) | SG11202101843SA (https=) |
| TW (2) | TWI816897B (https=) |
| WO (1) | WO2020076583A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020201207A1 (de) * | 2020-01-31 | 2021-08-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren |
| CN117226254B (zh) * | 2023-11-02 | 2024-06-21 | 武汉华日精密激光股份有限公司 | 基于超快激光-长脉冲激光复合的激光打孔装置及方法 |
| JP2026057143A (ja) | 2024-09-20 | 2026-04-02 | 新東工業株式会社 | 造型システム及び造型方法 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4473737A (en) * | 1981-09-28 | 1984-09-25 | General Electric Company | Reverse laser drilling |
| FR2542327B1 (https=) | 1983-03-07 | 1986-03-07 | Bensoussan Marcel | |
| US5293025A (en) | 1991-08-01 | 1994-03-08 | E. I. Du Pont De Nemours And Company | Method for forming vias in multilayer circuits |
| US6417485B1 (en) * | 2000-05-30 | 2002-07-09 | Igor Troitski | Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images |
| JP2004337901A (ja) | 2003-05-14 | 2004-12-02 | Sumitomo Heavy Ind Ltd | グリーンシートの孔加工方法およびグリーンシート載置用定盤 |
| GB0403865D0 (en) * | 2004-02-20 | 2004-03-24 | Powerlase Ltd | Laser multiplexing |
| US7626138B2 (en) * | 2005-09-08 | 2009-12-01 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| US9138913B2 (en) | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| US8624157B2 (en) * | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| US7767595B2 (en) | 2006-10-26 | 2010-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of semiconductor device |
| JP2008288577A (ja) | 2007-04-18 | 2008-11-27 | Fujikura Ltd | 基板の処理方法、貫通配線基板及びその製造方法、並びに電子部品 |
| US8736026B2 (en) | 2009-02-27 | 2014-05-27 | Picodrill Sa | Method of generating a hole or recess or well in a substrate |
| EP2480507A1 (en) * | 2009-08-28 | 2012-08-01 | Corning Incorporated | Methods for laser cutting articles from chemically strengthened glass substrates |
| US10357850B2 (en) | 2012-09-24 | 2019-07-23 | Electro Scientific Industries, Inc. | Method and apparatus for machining a workpiece |
| JP2016508069A (ja) | 2012-11-29 | 2016-03-17 | コーニング インコーポレイテッド | 基板をレーザー穿孔するための犠牲カバー層およびその方法 |
| US9102007B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US20150121960A1 (en) | 2013-11-04 | 2015-05-07 | Rofin-Sinar Technologies Inc. | Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses |
| US9517929B2 (en) | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
| US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
| US10293436B2 (en) * | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US20150165560A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9938187B2 (en) * | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
| JP6734202B2 (ja) | 2015-01-13 | 2020-08-05 | ロフィン−シナール テクノロジーズ エルエルシー | 脆性材料をスクライブして化学エッチングする方法およびシステム |
| WO2016122821A2 (en) | 2015-01-29 | 2016-08-04 | Imra America, Inc. | Laser-based modification of transparent materials |
| US10507544B2 (en) | 2015-02-27 | 2019-12-17 | Electro Scientific Industries, Inc | Fast beam manipulation for cross-axis miromaching |
| CN104759764B (zh) * | 2015-03-28 | 2018-02-02 | 大族激光科技产业集团股份有限公司 | 一种玻璃的激光钻孔方法 |
| US20160368086A1 (en) | 2015-06-16 | 2016-12-22 | Electro Scientific Industries, Inc. | Methods and apparatus for processing transparent materials |
| JP6813168B2 (ja) | 2016-07-29 | 2021-01-13 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のレーザー加工方法およびレーザー加工装置 |
| US10366904B2 (en) | 2016-09-08 | 2019-07-30 | Corning Incorporated | Articles having holes with morphology attributes and methods for fabricating the same |
| CN108161250A (zh) * | 2018-01-30 | 2018-06-15 | 苏州德龙激光股份有限公司 | 多焦点动态分布激光加工脆性透明材料的方法及装置 |
-
2019
- 2019-10-01 TW TW108135498A patent/TWI816897B/zh active
- 2019-10-01 TW TW112133781A patent/TWI866446B/zh active
- 2019-10-02 EP EP19870433.0A patent/EP3843934B1/en active Active
- 2019-10-02 JP JP2021518967A patent/JP2022504439A/ja active Pending
- 2019-10-02 LT LTEPPCT/US2019/054271T patent/LT3843934T/lt unknown
- 2019-10-02 KR KR1020217012935A patent/KR102640881B1/ko active Active
- 2019-10-02 CN CN201980060712.3A patent/CN112714681B/zh active Active
- 2019-10-02 CN CN202311368358.5A patent/CN119407374A/zh active Pending
- 2019-10-02 US US17/272,155 patent/US12070819B2/en active Active
- 2019-10-02 EP EP24199191.8A patent/EP4474097A3/en active Pending
- 2019-10-02 SG SG11202101843SA patent/SG11202101843SA/en unknown
- 2019-10-02 WO PCT/US2019/054271 patent/WO2020076583A1/en not_active Ceased
-
2023
- 2023-09-04 JP JP2023142673A patent/JP7539539B2/ja active Active
-
2024
- 2024-08-08 US US18/797,580 patent/US20240391030A1/en active Pending
- 2024-08-13 JP JP2024134762A patent/JP7787259B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI816897B (zh) | 2023-10-01 |
| US20210245303A1 (en) | 2021-08-12 |
| JP2024164063A (ja) | 2024-11-26 |
| JP7539539B2 (ja) | 2024-08-23 |
| WO2020076583A1 (en) | 2020-04-16 |
| EP3843934A4 (en) | 2022-06-22 |
| CN112714681B (zh) | 2023-09-22 |
| LT3843934T (lt) | 2024-11-25 |
| KR102640881B1 (ko) | 2024-02-27 |
| TW202023734A (zh) | 2020-07-01 |
| JP2022504439A (ja) | 2022-01-13 |
| US20240391030A1 (en) | 2024-11-28 |
| TWI866446B (zh) | 2024-12-11 |
| JP2023175728A (ja) | 2023-12-12 |
| JP7787259B2 (ja) | 2025-12-16 |
| CN119407374A (zh) | 2025-02-11 |
| EP4474097A2 (en) | 2024-12-11 |
| EP3843934B1 (en) | 2024-09-18 |
| EP4474097A3 (en) | 2025-03-19 |
| TW202400349A (zh) | 2024-01-01 |
| CN112714681A (zh) | 2021-04-27 |
| KR20210057819A (ko) | 2021-05-21 |
| US12070819B2 (en) | 2024-08-27 |
| EP3843934A1 (en) | 2021-07-07 |
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