SG11202101843SA - Systems and methods for drilling vias in transparent materials - Google Patents

Systems and methods for drilling vias in transparent materials

Info

Publication number
SG11202101843SA
SG11202101843SA SG11202101843SA SG11202101843SA SG11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA SG 11202101843S A SG11202101843S A SG 11202101843SA
Authority
SG
Singapore
Prior art keywords
systems
methods
transparent materials
drilling vias
vias
Prior art date
Application number
SG11202101843SA
Inventor
Hisashi Matsumoto
Jan Kleinert
Zhibin Lin
Original Assignee
Electro Scientific Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc
Publication of SG11202101843SA publication Critical patent/SG11202101843SA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Surface Treatment Of Glass (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
SG11202101843SA 2018-10-08 2019-10-02 Systems and methods for drilling vias in transparent materials SG11202101843SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862742694P 2018-10-08 2018-10-08
PCT/US2019/054271 WO2020076583A1 (en) 2018-10-08 2019-10-02 Systems and methods for drilling vias in transparent materials

Publications (1)

Publication Number Publication Date
SG11202101843SA true SG11202101843SA (en) 2021-03-30

Family

ID=70164817

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202101843SA SG11202101843SA (en) 2018-10-08 2019-10-02 Systems and methods for drilling vias in transparent materials

Country Status (8)

Country Link
US (1) US20210245303A1 (en)
EP (1) EP3843934A4 (en)
JP (2) JP2022504439A (en)
KR (1) KR102640881B1 (en)
CN (1) CN112714681B (en)
SG (1) SG11202101843SA (en)
TW (2) TWI816897B (en)
WO (1) WO2020076583A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117226254A (en) * 2023-11-02 2023-12-15 武汉华日精密激光股份有限公司 Laser drilling device and method based on ultrafast laser-long pulse laser combination

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4473737A (en) * 1981-09-28 1984-09-25 General Electric Company Reverse laser drilling
US6417485B1 (en) * 2000-05-30 2002-07-09 Igor Troitski Method and laser system controlling breakdown process development and space structure of laser radiation for production of high quality laser-induced damage images
GB0403865D0 (en) * 2004-02-20 2004-03-24 Powerlase Ltd Laser multiplexing
US7626138B2 (en) * 2005-09-08 2009-12-01 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
US8624157B2 (en) * 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
EP2480507A1 (en) * 2009-08-28 2012-08-01 Corning Incorporated Methods for laser cutting articles from chemically strengthened glass substrates
US20150121960A1 (en) * 2013-11-04 2015-05-07 Rofin-Sinar Technologies Inc. Method and apparatus for machining diamonds and gemstones using filamentation by burst ultrafast laser pulses
US9517929B2 (en) * 2013-11-19 2016-12-13 Rofin-Sinar Technologies Inc. Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
US9517963B2 (en) * 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US20150165560A1 (en) * 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9938187B2 (en) * 2014-02-28 2018-04-10 Rofin-Sinar Technologies Llc Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses
CN104759764B (en) * 2015-03-28 2018-02-02 大族激光科技产业集团股份有限公司 A kind of method for drilling holes of glass
US20160368086A1 (en) * 2015-06-16 2016-12-22 Electro Scientific Industries, Inc. Methods and apparatus for processing transparent materials
US10366904B2 (en) 2016-09-08 2019-07-30 Corning Incorporated Articles having holes with morphology attributes and methods for fabricating the same
CN108161250A (en) * 2018-01-30 2018-06-15 苏州德龙激光股份有限公司 Multifocal DYNAMIC DISTRIBUTION laser machines the method and device of brittle transparent material

Also Published As

Publication number Publication date
US20210245303A1 (en) 2021-08-12
CN112714681A (en) 2021-04-27
TWI816897B (en) 2023-10-01
KR20210057819A (en) 2021-05-21
KR102640881B1 (en) 2024-02-27
JP2022504439A (en) 2022-01-13
CN112714681B (en) 2023-09-22
TW202023734A (en) 2020-07-01
JP2023175728A (en) 2023-12-12
EP3843934A4 (en) 2022-06-22
WO2020076583A1 (en) 2020-04-16
TW202400349A (en) 2024-01-01
EP3843934A1 (en) 2021-07-07

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