CN117226254A - Laser drilling device and method based on ultrafast laser-long pulse laser combination - Google Patents
Laser drilling device and method based on ultrafast laser-long pulse laser combination Download PDFInfo
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- CN117226254A CN117226254A CN202311448593.3A CN202311448593A CN117226254A CN 117226254 A CN117226254 A CN 117226254A CN 202311448593 A CN202311448593 A CN 202311448593A CN 117226254 A CN117226254 A CN 117226254A
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- 238000005553 drilling Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000007493 shaping process Methods 0.000 claims abstract description 16
- 230000001360 synchronised effect Effects 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 230000006798 recombination Effects 0.000 claims description 7
- 238000005215 recombination Methods 0.000 claims description 7
- 230000010287 polarization Effects 0.000 claims description 4
- 238000001228 spectrum Methods 0.000 claims description 4
- 238000013329 compounding Methods 0.000 claims description 3
- 230000008439 repair process Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 3
- 239000002131 composite material Substances 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Abstract
The invention provides a laser drilling method based on ultrafast laser-long pulse laser combination, which comprises the following steps: s1, spatially shaping and converting an ultrafast laser beam into a Bessel beam, and performing spiral scanning on the Bessel beam; s2, combining the long pulse laser beam and the spiral scanning Bessel beam to the same optical axis for compound output; and S3, focusing the beam which is combined and output in the step S2 to the surface of the workpiece to be perforated for micropore processing. The invention adopts the composite synchronous output of the long pulse laser and the Bessel ultrafast laser to process the micropores of the material, fully combines the high quality of the Bessel ultrafast laser processing and the high efficiency of the long pulse laser processing, simultaneously forms Bessel beams by spatial shaping through the ultrafast laser, and can effectively improve the speed of the ultrafast laser for finishing the micropore recast layer through spiral scanning, thereby solving the quality problems of taper, crack and the like of the traditional laser processing and further improving the micropore processing efficiency.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a laser drilling device and method based on ultrafast laser-long pulse laser compounding.
Background
Laser drilling technology is one of the earliest application technologies of lasers in the field of material processing. In the laser drilling process, high-energy pulse laser is focused on the surface of a workpiece to heat, melt and even vaporize the material, then under the combined action of recoil pressure of rapid expansion of metal vapor and high-pressure auxiliary gas pressure, the molten material is extruded out of a hole, and the subsequent pulse laser continuously removes the material until a blind hole or a through hole is formed. Compared with other punching methods, the laser punching has the remarkable advantages of large punching depth-diameter ratio, no contact, no tool loss, high processing speed, small surface deformation, capability of processing various materials and the like, can well meet the processing requirements of modern industrial products, and is widely applied to key parts of high-precision tip products such as aerospace, electronic instruments, medical instruments and the like.
However, the existing single-beam ultra-fast laser processing method has low processing efficiency, the single-beam long-pulse laser processing method has poor processing quality, a recast layer with a certain thickness is easily attached to the hole wall, and the generation of microcracks in the hole is easily initiated.
Disclosure of Invention
The invention aims to provide a laser drilling method based on ultrafast laser-long pulse laser combination, which at least can solve part of defects in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the laser drilling method based on ultrafast laser-long pulse laser compounding comprises the following steps:
s1, spatially shaping and converting an ultrafast laser beam into a Bessel beam, and performing spiral scanning on the Bessel beam;
s2, combining the long pulse laser beam and the spiral scanning Bessel beam to the same optical axis for compound output;
and S3, focusing the beam which is combined and output in the step S2 to the surface of the workpiece to be perforated for micropore processing.
Furthermore, the laser drilling method based on ultrafast laser-long pulse laser combination further comprises S4, when the spiral scanning Bessel beam scans to the outline of the edge of the micropore, the long pulse laser beam is turned off, and the Bessel beam continues to scan to the wall of the micropore formed by processing to repair the quality.
Further, the wavelength range of the ultrafast laser beam is 266-2000 nm.
Further, the wavelength range of the long pulse laser beam is 266-2000 nm.
Further, the ultrafast laser beam is picosecond laser or femtosecond laser.
Further, the long pulse laser beam is a continuous laser, a millisecond laser, or a microsecond laser.
Further, the combination mode of the long pulse laser beam and the spiral scanning Bessel beam is polarization combination, bicolor mirror combination, spectrum combination or space combination.
In addition, the invention also provides a laser drilling device for the laser drilling method, which comprises a first laser for generating an ultrafast laser beam, a second laser for generating a long pulse laser beam, a synchronous controller, a space shaping device, a beam scanning device, a beam combining device and a beam focusing device;
the ultrafast laser beam is incident to the space shaping device, the emergent light of the space shaping device is incident to the light beam scanning device, and the emergent light of the light beam scanning device is incident to the beam combining device; the long pulse laser beam is emitted into the beam combining device, the synchronous controller controls the output time sequence of the first laser and the second laser to realize the compound synchronous output of the ultrafast laser beam and the long pulse laser beam in the beam combining device, and the emergent light of the beam combining device is emitted to the surface of the workpiece through the beam focusing device.
Compared with the prior art, the invention has the beneficial effects that:
the laser drilling method based on ultrafast laser-long pulse laser combination provided by the invention adopts the synchronous output of the long pulse laser and the Bessel ultrafast laser to process the micropores of the material, fully combines the high quality of the Bessel ultrafast laser processing and the high efficiency of the long pulse laser processing, simultaneously forms Bessel beams through space shaping by ultrafast laser, and can effectively improve the speed of the ultrafast laser finishing microporous recast layer through spiral scanning, thereby solving the quality problems of taper, cracks and the like of the traditional laser processing and further improving the micropore processing efficiency.
The present invention will be described in further detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of a laser drilling apparatus of the present invention;
FIG. 2 is a schematic diagram of the time superposition of an ultrafast laser beam and a long pulse laser beam in the present invention;
FIG. 3 is a schematic diagram of the spatial superposition of ultrafast laser beam and long pulse laser beam combinations in the present invention.
Reference numerals illustrate: 1. a first laser; 2. a synchronous controller; 3. a second laser; 4. a space shaping device; 5. a light beam scanning device; 6. a beam combining device; 7. a beam focusing device; 8. a workpiece; 9. an ultrafast laser beam; 10. a long pulse laser beam; 11. micropores.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or by an abutting connection or integrally connected; the specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second" may include one or more such features, either explicitly or implicitly; in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
As shown in fig. 1, 2 and 3, the embodiment of the invention provides a laser drilling method based on ultrafast laser-long pulse laser recombination, which comprises the following steps:
s1, spatially shaping and converting an ultrafast laser beam 9 into a Bessel beam, and performing spiral scanning on the Bessel beam;
s2, combining the long pulse laser beam 10 and the spiral scanned Bessel beam to the same optical axis for compound output;
and S3, focusing the beam which is combined and output by the step S2 on the surface of the workpiece 8 to be perforated for micropore processing.
In this embodiment, the ultrafast laser beam 9 is shaped into a bessel beam, and the long pulse laser and the bessel ultrafast laser are synchronously output to perform micropore processing, so that from the time domain, the effect of the spatially shaped ultrafast laser beam (i.e. the bessel ultrafast laser) forms transient electronic activation, the laser absorption is improved, meanwhile, the ultrafast laser can prepare defects, and the multiple reflection of the hole walls of the defects can improve the absorption of materials, so that the nonlinear absorption of the target (i.e. a workpiece) by using the bessel ultrafast laser is utilized to improve the absorption of the target to the long pulse laser, and meanwhile, the sputtering removal of the target is enhanced by using plasma shock waves excited by the ultra fast laser, so that the processing efficiency and quality of micropores are further improved; from the perspective of airspace distribution, the long pulse laser and Bessel ultrafast laser which are synchronously output can ensure the effective removal of materials.
Further, the laser drilling method based on ultrafast laser-long pulse laser combination further comprises S4, when the spiral scanning Bessel beam scans to the edge outline of the micropore 11, the long pulse laser beam 10 is turned off, and at the moment, the single ultrafast laser beam 9 acts, the ultrafast laser beam 9 is still the Bessel beam of the spiral scanning, quality restoration is carried out on the hole wall of the micropore 11 formed by processing, the ultrafast laser cold processing characteristic is fully utilized, so that the problems of recasting layers, cracks, conicity and the like of the micropore 11 are improved, and the micropore processing quality is further improved.
In some embodiments, the wavelength of the ultrafast laser beam 9 ranges from 266 nm to 2000nm, and the ultrafast laser beam 9 may be, but is not limited to, a picosecond laser or a femtosecond laser.
In some embodiments, the long pulse laser beam 10 has a wavelength ranging from 266 nm to 2000nm, and the long pulse laser beam 10 may be selected from, but not limited to, a continuous laser, a millisecond laser, or a microsecond laser.
The beam combining mode of the long pulse laser beam 10 and the spiral scanning bessel beam can adopt polarization beam combining, bicolor mirror beam combining, spectrum beam combining, space beam combining and the like, so that space focusing and matching of the space spiral scanning ultrafast laser and the center output long pulse laser are realized.
In addition, the embodiment of the invention also provides a laser drilling device for the laser drilling method, as shown in fig. 1, which comprises a first laser 1, a second laser 3, a synchronous controller 2, a space shaping device 4, a beam scanning device 5, a beam combining device 6 and a beam focusing device 7. The first laser 1 is used for generating an ultrafast laser beam 9, the second laser 3 is used for generating a long pulse laser beam 10, the synchronous controller 2 completes time domain modulation of the long pulse laser beam 10 to realize pulse output with adjustable duty ratio and repetition frequency, the pulse output can be realized by controlling the laser through a digital signal generator or regulating and controlling laser transmission through an acousto-optic modulator, and meanwhile, the synchronous controller 2 also controls continuous output of the ultrafast laser beam 9; the ultrafast laser beam 9 generated by the first laser 1 is shaped into a Bessel beam by the space shaping device 4, and is emitted into the beam combining device 6 after being spirally scanned by the beam scanning device 5; meanwhile, the long pulse laser beam 10 generated by the second laser 3 is injected into the beam combining device 6, the synchronous controller 2 controls the output time sequence of the first laser 1 and the second laser 3 to realize the compound synchronous output of the ultrafast laser beam 9 and the long pulse laser beam 10 in the beam combining device 6, and the compound light beam output by the beam combining device 6 is injected into the surface of the workpiece 8 through the light beam focusing device 7, so that the micro-hole processing of the workpiece 8 is realized.
Wherein the space shaping device 4 can be selected from but not limited to axicon lenses for converting the ultrafast laser beam into a bessel beam; the beam scanning device 5 may be, but is not limited to, a scanning galvanometer; the beam combining device 6 can select but not limited to a beam combining lens, and can specifically adopt modes of polarization beam combining, bicolor lens beam combining, spectrum beam combining, space beam combining and the like; the beam focusing device 7 may be, but is not limited to, a focusing lens.
The foregoing examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention, and all designs that are the same or similar to the present invention are within the scope of the present invention.
Claims (8)
1. The laser drilling method based on ultrafast laser-long pulse laser compounding is characterized by comprising the following steps of:
s1, spatially shaping and converting an ultrafast laser beam into a Bessel beam, and performing spiral scanning on the Bessel beam;
s2, combining the long pulse laser beam and the spiral scanning Bessel beam to the same optical axis for compound output;
and S3, focusing the beam which is combined and output in the step S2 to the surface of the workpiece to be perforated for micropore processing.
2. The laser drilling method based on ultrafast laser-long pulse laser recombination as recited in claim 1, wherein: and S4, when the spiral scanning Bessel beam scans to the edge outline of the micropore, turning off the long pulse laser beam, and continuously scanning the Bessel beam to the wall of the micropore formed by processing to repair the quality.
3. The laser drilling method based on ultrafast laser-long pulse laser recombination as recited in claim 1, wherein: the wavelength range of the ultrafast laser beam is 266-2000 nm.
4. The laser drilling method based on ultrafast laser-long pulse laser recombination as recited in claim 1, wherein: the wavelength range of the long pulse laser beam is 266-2000 nm.
5. The laser drilling method based on ultrafast laser-long pulse laser recombination as recited in claim 1, wherein: the ultrafast laser beam is picosecond laser or femtosecond laser.
6. The laser drilling method based on ultrafast laser-long pulse laser recombination as recited in claim 1, wherein: the long pulse laser beam is a continuous laser, a millisecond laser, or a microsecond laser.
7. The laser drilling method based on ultrafast laser-long pulse laser recombination as recited in claim 1, wherein: the beam combination mode of the long pulse laser beam and the spiral scanning Bessel beam is polarization beam combination, bicolor mirror beam combination, spectrum beam combination or space beam combination.
8. A laser drilling apparatus for use in the laser drilling method according to any one of claims 1 to 7, characterized in that: the device comprises a first laser for generating an ultrafast laser beam, a second laser for generating a long pulse laser beam, a synchronous controller, a space shaping device, a beam scanning device, a beam combining device and a beam focusing device;
the ultrafast laser beam is incident to the space shaping device, the emergent light of the space shaping device is incident to the light beam scanning device, and the emergent light of the light beam scanning device is incident to the beam combining device; the long pulse laser beam is emitted into the beam combining device, the synchronous controller controls the output time sequence of the first laser and the second laser to realize the compound synchronous output of the ultrafast laser beam and the long pulse laser beam in the beam combining device, and the emergent light of the beam combining device is emitted to the surface of the workpiece through the beam focusing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311448593.3A CN117226254B (en) | 2023-11-02 | Laser drilling device and method based on ultrafast laser-long pulse laser combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311448593.3A CN117226254B (en) | 2023-11-02 | Laser drilling device and method based on ultrafast laser-long pulse laser combination |
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| Publication Number | Publication Date |
|---|---|
| CN117226254A true CN117226254A (en) | 2023-12-15 |
| CN117226254B CN117226254B (en) | 2024-06-21 |
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