TWI816770B - 複合粒子 - Google Patents

複合粒子 Download PDF

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Publication number
TWI816770B
TWI816770B TW108110658A TW108110658A TWI816770B TW I816770 B TWI816770 B TW I816770B TW 108110658 A TW108110658 A TW 108110658A TW 108110658 A TW108110658 A TW 108110658A TW I816770 B TWI816770 B TW I816770B
Authority
TW
Taiwan
Prior art keywords
coating layer
group
cyclic ether
compound
component
Prior art date
Application number
TW108110658A
Other languages
English (en)
Chinese (zh)
Other versions
TW201942232A (zh
Inventor
宮內咲奈
丸澤尚
濱田亘人
澤田英夫
Original Assignee
日商互應化學工業股份有限公司
國立大學法人弘前大學
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商互應化學工業股份有限公司, 國立大學法人弘前大學 filed Critical 日商互應化學工業股份有限公司
Publication of TW201942232A publication Critical patent/TW201942232A/zh
Application granted granted Critical
Publication of TWI816770B publication Critical patent/TWI816770B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • B01J2/30—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic using agents to prevent the granules sticking together; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/146—After-treatment of sols
    • C01B33/149—Coating
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Developing Agents For Electrophotography (AREA)
  • Glanulating (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW108110658A 2018-03-30 2019-03-27 複合粒子 TWI816770B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2018/013524 2018-03-30
PCT/JP2018/013524 WO2019186987A1 (ja) 2018-03-30 2018-03-30 複合粒子

Publications (2)

Publication Number Publication Date
TW201942232A TW201942232A (zh) 2019-11-01
TWI816770B true TWI816770B (zh) 2023-10-01

Family

ID=68059551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108110658A TWI816770B (zh) 2018-03-30 2019-03-27 複合粒子

Country Status (3)

Country Link
JP (1) JP7216375B2 (ja)
TW (1) TWI816770B (ja)
WO (1) WO2019186987A1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1813002A (zh) * 2003-06-24 2006-08-02 Ppg工业俄亥俄公司 具有纳米颗粒相的微粒的水性分散体和含有该分散体的涂料组合物
CN101098896A (zh) * 2005-01-06 2008-01-02 巴斯福股份公司 制备复合颗粒水性分散体的方法
CN101395230A (zh) * 2006-01-20 2009-03-25 Ppg工业俄亥俄公司 聚合物封装的颗粒的含水分散体、相关的涂料组合物和涂覆的基材
TW201207023A (en) * 2010-08-05 2012-02-16 Sumitomo Bakelite Co Functional particle and mixture thereof, filler, resin composition for electric component and semiconductor device using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5711540B2 (ja) * 2011-01-11 2015-05-07 互応化学工業株式会社 無機質粒子、及び無機質粒子の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1813002A (zh) * 2003-06-24 2006-08-02 Ppg工业俄亥俄公司 具有纳米颗粒相的微粒的水性分散体和含有该分散体的涂料组合物
CN101098896A (zh) * 2005-01-06 2008-01-02 巴斯福股份公司 制备复合颗粒水性分散体的方法
CN101395230A (zh) * 2006-01-20 2009-03-25 Ppg工业俄亥俄公司 聚合物封装的颗粒的含水分散体、相关的涂料组合物和涂覆的基材
TW201207023A (en) * 2010-08-05 2012-02-16 Sumitomo Bakelite Co Functional particle and mixture thereof, filler, resin composition for electric component and semiconductor device using the same

Also Published As

Publication number Publication date
JPWO2019186987A1 (ja) 2021-04-01
WO2019186987A1 (ja) 2019-10-03
TW201942232A (zh) 2019-11-01
JP7216375B2 (ja) 2023-02-01

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