TWI804680B - 使用了具有醯亞胺鍵之樹脂及磷化合物之黏接劑組成物、使用了該黏接劑組成物之黏接薄膜、表覆層薄膜、覆銅疊層板、及撓性印刷配線板 - Google Patents

使用了具有醯亞胺鍵之樹脂及磷化合物之黏接劑組成物、使用了該黏接劑組成物之黏接薄膜、表覆層薄膜、覆銅疊層板、及撓性印刷配線板 Download PDF

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Publication number
TWI804680B
TWI804680B TW108135022A TW108135022A TWI804680B TW I804680 B TWI804680 B TW I804680B TW 108135022 A TW108135022 A TW 108135022A TW 108135022 A TW108135022 A TW 108135022A TW I804680 B TWI804680 B TW I804680B
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TW
Taiwan
Prior art keywords
resin
adhesive composition
general formula
adhesive
film
Prior art date
Application number
TW108135022A
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English (en)
Chinese (zh)
Other versions
TW202028399A (zh
Inventor
小柳英之
神田良輔
川楠哲生
Original Assignee
日商東洋紡Ｍｃ股份有限公司
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Application filed by 日商東洋紡Ｍｃ股份有限公司 filed Critical 日商東洋紡Ｍｃ股份有限公司
Publication of TW202028399A publication Critical patent/TW202028399A/zh
Application granted granted Critical
Publication of TWI804680B publication Critical patent/TWI804680B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
TW108135022A 2018-10-04 2019-09-27 使用了具有醯亞胺鍵之樹脂及磷化合物之黏接劑組成物、使用了該黏接劑組成物之黏接薄膜、表覆層薄膜、覆銅疊層板、及撓性印刷配線板 TWI804680B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018188980 2018-10-04
JP2018-188980 2018-10-04

Publications (2)

Publication Number Publication Date
TW202028399A TW202028399A (zh) 2020-08-01
TWI804680B true TWI804680B (zh) 2023-06-11

Family

ID=70055605

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108135022A TWI804680B (zh) 2018-10-04 2019-09-27 使用了具有醯亞胺鍵之樹脂及磷化合物之黏接劑組成物、使用了該黏接劑組成物之黏接薄膜、表覆層薄膜、覆銅疊層板、及撓性印刷配線板

Country Status (5)

Country Link
JP (1) JP6733845B1 (ja)
KR (1) KR102665140B1 (ja)
CN (1) CN112534019B (ja)
TW (1) TWI804680B (ja)
WO (1) WO2020071363A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022150088A (ja) 2021-03-26 2022-10-07 日鉄ケミカル＆マテリアル株式会社 ポリイミド、樹脂組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
CN115947648B (zh) * 2022-12-28 2024-10-18 北京彤程创展科技有限公司 一种交联剂及其制备方法、光刻胶

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604239A (en) * 2004-05-28 2006-02-01 Dow Global Technologies Inc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
TW201739889A (zh) * 2016-03-15 2017-11-16 東洋紡股份有限公司 使用聚醯胺醯亞胺樹脂之接著劑組成物
TW201827508A (zh) * 2016-10-17 2018-08-01 日商松下知識產權經營股份有限公司 樹脂組成物、樹脂組成物之製造方法、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5520076Y2 (ja) 1975-12-11 1980-05-13
GB1547105A (en) * 1976-07-05 1979-06-06 Sanko Kaihatsu Kagaku Kenk Cyclic phosphinates and their use as flame-retardants
JP5672701B2 (ja) * 2008-10-01 2015-02-18 東洋紡株式会社 ポリアミドイミド樹脂、該樹脂組成物、難燃性接着剤組成物並びに該組成物からなる接着剤シート、カバーレイフィルム及びプリント配線板
KR101084507B1 (ko) * 2009-04-01 2011-11-18 아이디비켐(주) 유기 인계 난연제 및 이의 제조방법
JP2011148862A (ja) 2010-01-19 2011-08-04 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、フレキシブル配線板の保護膜の形成方法及びフレキシブル配線板
US20170002242A1 (en) * 2014-05-28 2017-01-05 Toyobo Co., Ltd. Adhesive composition using polyamide-imide resin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200604239A (en) * 2004-05-28 2006-02-01 Dow Global Technologies Inc Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
TW201739889A (zh) * 2016-03-15 2017-11-16 東洋紡股份有限公司 使用聚醯胺醯亞胺樹脂之接著劑組成物
TW201827508A (zh) * 2016-10-17 2018-08-01 日商松下知識產權經營股份有限公司 樹脂組成物、樹脂組成物之製造方法、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板

Also Published As

Publication number Publication date
JPWO2020071363A1 (ja) 2021-02-15
JP6733845B1 (ja) 2020-08-05
CN112534019A (zh) 2021-03-19
CN112534019B (zh) 2022-11-25
KR20210070950A (ko) 2021-06-15
KR102665140B1 (ko) 2024-05-09
WO2020071363A1 (ja) 2020-04-09
TW202028399A (zh) 2020-08-01

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