JP5782583B1 - ポリアミドイミド樹脂を用いた接着剤組成物 - Google Patents
ポリアミドイミド樹脂を用いた接着剤組成物 Download PDFInfo
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- JP5782583B1 JP5782583B1 JP2015519675A JP2015519675A JP5782583B1 JP 5782583 B1 JP5782583 B1 JP 5782583B1 JP 2015519675 A JP2015519675 A JP 2015519675A JP 2015519675 A JP2015519675 A JP 2015519675A JP 5782583 B1 JP5782583 B1 JP 5782583B1
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- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 4
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- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 3
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
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- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- UQKAOOAFEFCDGT-UHFFFAOYSA-N n,n-dimethyloctan-1-amine Chemical compound CCCCCCCCN(C)C UQKAOOAFEFCDGT-UHFFFAOYSA-N 0.000 description 1
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- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
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- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
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- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
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- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
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- 239000000454 talc Substances 0.000 description 1
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- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical group NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
(1)ポリアミドイミド樹脂及びエポキシ樹脂が配合され、かつ以下の(A)〜(C)の特徴を有する接着剤組成物:
(A)ポリアミドイミド樹脂85質量部〜60質量部に対して、エポキシ樹脂が15質量部〜40質量部が配合されていること;
(B)エポキシ樹脂としてリン含有エポキシ樹脂を使用しないか、または使用したとしても、リン含有エポキシ樹脂の配合量がポリアミドイミド樹脂100質量部に対して1質量部未満であること;
(C)ポリアミドイミド樹脂が、下記(a)〜(c)の酸成分に由来する構成単位と、芳香環を有するジイソシアネート成分又は芳香環を有するジアミン成分に由来する構成単位からなるポリアミドイミド樹脂であり、
ポリアミドイミド樹脂の全酸成分に由来する構成単位を100mol%とした場合の各酸成分に由来する構成単位の割合が、(a)1〜6mol%、(b)10〜80mol%、(c)10〜89mol%であること:
(a)カルボキシル基を両末端に有し、重量平均分子量が500〜5000であり、アクリロニトリル部位の割合が10〜50質量%範囲であるアクリロニトリル−ブタジエンゴム;
(b)炭素数が4から12である脂肪族ジカルボン酸;
(c)芳香環を有するポリカルボン酸の無水物。
(2)リン系難燃剤がさらに配合され、接着剤組成物の不揮発成分中のリン含有率が1.0〜5.0質量%であることを特徴とする(1)に記載の接着剤組成物。
(3)リン系難燃剤として、エポキシと反応する官能基を有さないリン系難燃剤と、エポキシと反応する官能基を2個以上有するリン系難燃剤が併用されていることを特徴とする(2)に記載の接着剤組成物。
(4)エポキシ樹脂の全塩素量が、接着剤組成物の不揮発成分中500ppm以下であることを特徴とする(1)〜(3)のいずれかに記載の接着剤組成物。
(5)ガラス転移温度が200℃以上の樹脂がさらに配合されたことを特徴とする(1)〜(4)のいずれかに記載の接着剤組成物。
(6)(1)〜(5)のいずれかに記載の接着剤組成物からなる接着剤層を使用したことを特徴とするカバーレイフィルム。
(7)Bステージ状態におけるカバーレイフィルム中の残留溶剤量が1.5質量%未満であることを特徴とする(6)に記載のカバーレイフィルム。
(8)(1)〜(5)のいずれかに記載の接着剤組成物からなる接着剤層を使用したことを特徴とする接着フィルム。
(9)Bステージ状態における接着フィルム中の残留溶剤量が1.5質量%未満であることを特徴とする(8)に記載の接着フィルム。
(10)(1)〜(5)のいずれかに記載の接着剤組成物からなる接着剤層を使用したことを特徴とする3層銅張り積層板。
(11)(1)〜(5)のいずれかに記載の接着剤組成物、(6)〜(7)のいずれかに記載のカバーレイフイルム、(8)〜(9)のいずれかに記載の接着フィルム、または(10)に記載の3層銅張り積層板を使用したことを特徴とするフレキシブルプリント配線板。
ポリアミドイミド樹脂の全酸成分に由来する構成単位を100mol%とした場合の各酸成分に由来する構成単位の割合が、(a)1〜6mol%、(b)10〜80mol%、(c)10〜89mol%である:
(a)カルボキシル基を両末端に有し、重量平均分子量が500〜5000であり、アクリロニトリル部位の割合が10〜50質量%範囲であるアクリロニトリル−ブタジエンゴム;
(b)炭素数が4から12である脂肪族ジカルボン酸;
(c)芳香環を有するポリカルボン酸の無水物。
接着剤組成物の溶液をポリイミドフイルム(カネカ製 アピカル12.5NPI)に乾燥後の厚みが20μmとなるように塗布し、140℃で3分間熱風乾燥機で乾燥させ、Bステージ状態のサンプルを得た。このBステージサンプルの接着剤塗布面と銅箔(JX日鉱日石製 BHY 厚み18μm)の光沢面とを真空プレスラミネート機を用いて、160℃、3MPa、30秒間減圧下で熱圧着させた。その後、150℃で4時間加熱硬化させた。硬化後のサンプルを、引っ張り試験機(島津製 オートグラフAG−X plus)を用いて25℃の雰囲気下でポリイミドフイルムを90°の方向に50mm/minの速度で引き剥がし、接着強度を測定した。
接着強度が0.5N/mm以上のものを○、0.5N/mm未満のものを×とした。
接着性の評価と同様にBステージサンプルを作製し、接着剤塗布面とポリイミドフイルム(カネカ製 アピカル12.5NPI)とを真空プレスラミネート機を用いて、160℃、3MPa、30秒間減圧下で熱圧着させた。その後、150℃で4時間加熱硬化させた。硬化後のサンプルをUL−94VTM規格に準拠して、難燃性を評価した。
VTM−0相当のものを○、VTM−0を満足しないものを×とした。
接着剤組成物の溶液をPETフイルム(東洋紡製 E5101 厚み50μm)に乾燥後の厚みが20μmとなるように塗布し、140℃で3分間熱風乾燥機で乾燥させ、Bステージ状態のサンプルを得た。
サンプルを折り曲げ、接着剤の塗布・乾燥直後に接着剤層が割れたものを×、室温1週間後に接着剤層が割れたものを△、室温1週間後も接着剤層が割れなかったものを○とした。
接着性の評価と同様にBステージサンプルを作製し、L/S=50/50μmのくし型パターンに真空プレスラミネート機を用いて、160℃、3MPa、30秒間減圧下で熱圧着させた。その後、150℃で4時間加熱硬化させた。温度85℃、湿度85%の環境下、200Vの電圧を250時間印加した。
250時間後の抵抗値が1×109Ω以上でありデンドライトのないものを◎、250時間後の抵抗値が1×108Ω以上1×109Ω未満でありデンドライトのないものを○、250時間後の抵抗値が1×108Ω未満もしくはデンドライトが発生しているものを×とした。
接着性の評価と同様に加熱硬化させたサンプルを作製し、20mm角に切断し、300℃の半田浴にポリイミド面を上にしてフロートさせた。
膨れや剥がれのないものを○、膨れもしくは剥がれのあったものを×とした。
表1に示す原料の樹脂組成(mol%)で、ポリアミドイミド樹脂の重合を行った。具体的には、ポリアミドイミド樹脂1の場合は、以下のように重合を行った。
高耐熱樹脂として、芳香環を有する原料(無水トリメリット酸)のみから得られたポリアミドイミド樹脂10を前記ポリアミドイミド樹脂1と同様に重合した。得られたポリアミドイミド樹脂10の溶液を、銅箔に乾燥後の厚みが15μmとなるよう塗布し、100℃で5分間乾燥させた後、さらに250℃で1時間熱風乾燥を行った。その後、塩化第二鉄の溶液に浸漬して銅箔を除去し、ポリアミドイミド樹脂10のフィルムを得た。得られたポリアミドイミド樹脂10フィルムのガラス転移温度は、アイテイ計測制御社製動的粘弾性測定装置DVA−220を用いて、周波数110Hz、昇温速度4℃/minで動的粘弾性の測定を行い、その貯蔵弾性率の変曲点から求めたところ、280℃であった。
表2に示す接着剤配合(固形分(質量%))に従って実施例1〜11及び比較例1〜7の接着剤組成物のジメチルアセトアミド溶液を作製し、上記の特性の評価を行った。
Claims (11)
- ポリアミドイミド樹脂及びエポキシ樹脂が配合され、かつ以下の(A)〜(C)の特徴を有する接着剤組成物:
(A)ポリアミドイミド樹脂85質量部〜60質量部に対して、エポキシ樹脂が15質量部〜40質量部が配合されていること;
(B)エポキシ樹脂としてリン含有エポキシ樹脂を使用しないか、または使用したとしても、リン含有エポキシ樹脂の配合量がポリアミドイミド樹脂100質量部に対して1質量部未満であること;
(C)ポリアミドイミド樹脂が、下記(a)〜(c)の酸成分に由来する構成単位と、芳香環を有するジイソシアネート成分又は芳香環を有するジアミン成分に由来する構成単位からなるポリアミドイミド樹脂であり、
ポリアミドイミド樹脂の全酸成分に由来する構成単位を100mol%とした場合の各酸成分に由来する構成単位の割合が、(a)1〜6mol%、(b)10〜80mol%、(c)10〜89mol%であること:
(a)カルボキシル基を両末端に有し、重量平均分子量が500〜5000であり、アクリロニトリル部位の割合が10〜50質量%範囲であるアクリロニトリル−ブタジエンゴム;
(b)炭素数が4から12である脂肪族ジカルボン酸;
(c)芳香環を有するポリカルボン酸の無水物。 - リン系難燃剤がさらに配合され、接着剤組成物の不揮発成分中のリン含有率が1.0〜5.0質量%であることを特徴とする請求項1に記載の接着剤組成物。
- リン系難燃剤として、エポキシと反応する官能基を有さないリン系難燃剤と、エポキシと反応する官能基を2個以上有するリン系難燃剤が併用されていることを特徴とする請求項2に記載の接着剤組成物。
- エポキシ樹脂の全塩素量が、接着剤組成物の不揮発成分中500ppm以下であることを特徴とする請求項1〜3のいずれかに記載の接着剤組成物。
- ガラス転移温度が200℃以上の樹脂がさらに配合されたことを特徴とする請求項1〜4のいずれかに記載の接着剤組成物。
- 請求項1〜5のいずれかに記載の接着剤組成物からなる接着剤層を使用したことを特徴とするカバーレイフィルム。
- Bステージ状態におけるカバーレイフィルム中の残留溶剤量が1.5質量%未満であることを特徴とする請求項6に記載のカバーレイフィルム。
- 請求項1〜5のいずれかに記載の接着剤組成物からなる接着剤層を使用したことを特徴とする接着フィルム。
- Bステージ状態における接着フィルム中の残留溶剤量が1.5質量%未満であることを特徴とする請求項8に記載の接着フィルム。
- 請求項1〜5のいずれかに記載の接着剤組成物からなる接着剤層を使用したことを特徴とする3層銅張り積層板。
- 請求項1〜5のいずれかに記載の接着剤組成物、請求項6〜7のいずれかに記載のカバーレイフイルム、請求項8〜9のいずれかに記載の接着フィルム、または請求項10に記載の3層銅張り積層板を使用したことを特徴とするフレキシブルプリント配線板。
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WO2017158917A1 (ja) * | 2016-03-15 | 2017-09-21 | 東洋紡株式会社 | ポリアミドイミド樹脂を用いた接着剤組成物 |
KR101830826B1 (ko) * | 2016-03-22 | 2018-04-04 | 한국화학연구원 | 식물유 유래 다이머산 알킬 에스테르를 사용한 폴리아미드 수지 조성물, 이의 제조방법 및 이를 함유하는 접착제 |
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WO2017158917A1 (ja) * | 2016-03-15 | 2017-09-21 | 東洋紡株式会社 | ポリアミドイミド樹脂を用いた接着剤組成物 |
KR20180087415A (ko) | 2016-03-15 | 2018-08-01 | 도요보 가부시키가이샤 | 폴리아미드이미드 수지를 이용한 접착제 조성물 |
US10913249B2 (en) | 2016-03-15 | 2021-02-09 | Toyobo Co., Ltd. | Adhesive composition using polyamide-imide resin |
KR101830826B1 (ko) * | 2016-03-22 | 2018-04-04 | 한국화학연구원 | 식물유 유래 다이머산 알킬 에스테르를 사용한 폴리아미드 수지 조성물, 이의 제조방법 및 이를 함유하는 접착제 |
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