TWI799404B - 連接器用端子材料及其製造方法 - Google Patents

連接器用端子材料及其製造方法 Download PDF

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Publication number
TWI799404B
TWI799404B TW107101682A TW107101682A TWI799404B TW I799404 B TWI799404 B TW I799404B TW 107101682 A TW107101682 A TW 107101682A TW 107101682 A TW107101682 A TW 107101682A TW I799404 B TWI799404 B TW I799404B
Authority
TW
Taiwan
Prior art keywords
connector
manufacturing
terminal material
terminal
Prior art date
Application number
TW107101682A
Other languages
English (en)
Chinese (zh)
Other versions
TW201832643A (zh
Inventor
井上雄基
牧一誠
船木真一
玉川隆士
中矢清
Original Assignee
日商三菱伸銅股份有限公司
日商三菱綜合材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱伸銅股份有限公司, 日商三菱綜合材料股份有限公司 filed Critical 日商三菱伸銅股份有限公司
Publication of TW201832643A publication Critical patent/TW201832643A/zh
Application granted granted Critical
Publication of TWI799404B publication Critical patent/TWI799404B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
TW107101682A 2017-01-17 2018-01-17 連接器用端子材料及其製造方法 TWI799404B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017006184A JP6423025B2 (ja) 2017-01-17 2017-01-17 挿抜性に優れた錫めっき付銅端子材及びその製造方法
JP2017-006184 2017-01-17

Publications (2)

Publication Number Publication Date
TW201832643A TW201832643A (zh) 2018-09-01
TWI799404B true TWI799404B (zh) 2023-04-21

Family

ID=62908690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107101682A TWI799404B (zh) 2017-01-17 2018-01-17 連接器用端子材料及其製造方法

Country Status (9)

Country Link
US (1) US10923245B2 (enExample)
EP (1) EP3572558A4 (enExample)
JP (1) JP6423025B2 (enExample)
KR (1) KR102390232B1 (enExample)
CN (1) CN110177904A (enExample)
MX (1) MX2019008513A (enExample)
MY (1) MY194439A (enExample)
TW (1) TWI799404B (enExample)
WO (1) WO2018135482A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7040224B2 (ja) * 2018-03-30 2022-03-23 三菱マテリアル株式会社 錫めっき付銅端子材及びその製造方法
JP7293829B2 (ja) 2019-04-11 2023-06-20 富士フイルムビジネスイノベーション株式会社 定着部材、定着装置、及び画像形成装置
JP7354719B2 (ja) 2019-09-24 2023-10-03 富士フイルムビジネスイノベーション株式会社 定着部材、定着装置、及び画像形成装置
JP7272224B2 (ja) 2019-09-30 2023-05-12 三菱マテリアル株式会社 コネクタ用端子材
CN110592515B (zh) * 2019-09-30 2022-06-17 凯美龙精密铜板带（河南）有限公司 一种热浸镀锡铜材及其制造方法
CN111009759B (zh) * 2019-12-23 2021-08-20 苏州威贝斯特电子科技有限公司 一种端子组合物及其插座连接器用制品
JP2023061782A (ja) * 2021-10-20 2023-05-02 Ｊｘ金属株式会社 めっき材及び電子部品
DE102021130188A1 (de) * 2021-11-18 2023-05-25 Te Connectivity Germany Gmbh Verfahren zur oberflächenbehandlung eines elektrischen kontaktlements und kontaktelement
JP7670224B1 (ja) * 2024-01-24 2025-04-30 三菱マテリアル株式会社 コネクタ用端子材及びその製造方法、並びにコネクタ
JP7579476B1 (ja) 2024-02-21 2024-11-07 有限会社 ナプラ 端子
JP2025145843A (ja) * 2024-03-22 2025-10-03 三菱マテリアル株式会社 めっき皮膜付銅端子材及びその製造方法
JP7732566B1 (ja) * 2024-10-23 2025-09-02 三菱マテリアル株式会社 コネクタ用端子材及びその製造方法
JP7736142B1 (ja) * 2024-10-23 2025-09-09 三菱マテリアル株式会社 コネクタ用端子材及びその製造方法
CN119320922B (zh) * 2024-12-13 2025-10-28 河南凯美龙新材料科技股份有限公司 一种降低铜带表面摩擦系数的热浸镀锡铜板带及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1788585B1 (en) * 2004-09-10 2015-02-18 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Conductive material for connecting part and method for fabricating the conductive material
JP4503620B2 (ja) 2007-01-25 2010-07-14 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
JP5319101B2 (ja) * 2007-10-31 2013-10-16 Ｊｘ日鉱日石金属株式会社 電子部品用Ｓｎめっき材
EP2351875B1 (en) * 2009-01-20 2016-12-07 Mitsubishi Shindoh Co., Ltd. Conductive member and method for producing the same
EP2620275B1 (en) * 2012-01-26 2019-10-02 Mitsubishi Materials Corporation Tin-plated copper-alloy material for terminal and method for producing the same
TW201413068A (zh) * 2012-07-02 2014-04-01 Mitsubishi Materials Corp 插拔性優良之鍍錫銅合金端子材料及其製造方法
JP5522300B1 (ja) 2012-07-02 2014-06-18 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材及びその製造方法
JP2015063750A (ja) * 2013-08-26 2015-04-09 三菱マテリアル株式会社 挿抜性に優れた錫めっき銅合金端子材
JP6160582B2 (ja) * 2014-09-11 2017-07-12 三菱マテリアル株式会社 錫めっき銅合金端子材及びその製造方法
JP5984980B2 (ja) * 2015-02-24 2016-09-06 Ｊｘ金属株式会社 電子部品用Ｓｎめっき材
JP6558971B2 (ja) 2015-06-17 2019-08-14 株式会社日立ハイテクノロジーズ 採血装置

Also Published As

Publication number Publication date
EP3572558A4 (en) 2020-10-28
MX2019008513A (es) 2019-12-02
KR102390232B1 (ko) 2022-04-22
CN110177904A (zh) 2019-08-27
EP3572558A1 (en) 2019-11-27
TW201832643A (zh) 2018-09-01
US10923245B2 (en) 2021-02-16
JP6423025B2 (ja) 2018-11-14
KR20190101465A (ko) 2019-08-30
JP2018115361A (ja) 2018-07-26
WO2018135482A1 (ja) 2018-07-26
US20190362865A1 (en) 2019-11-28
MY194439A (en) 2022-11-30

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