TWI794358B - 搬運車系統中的搬運車的部署方法 - Google Patents

搬運車系統中的搬運車的部署方法 Download PDF

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Publication number
TWI794358B
TWI794358B TW107144257A TW107144257A TWI794358B TW I794358 B TWI794358 B TW I794358B TW 107144257 A TW107144257 A TW 107144257A TW 107144257 A TW107144257 A TW 107144257A TW I794358 B TWI794358 B TW I794358B
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TW
Taiwan
Prior art keywords
reciprocating
track
transport vehicle
transport
aforementioned
Prior art date
Application number
TW107144257A
Other languages
English (en)
Chinese (zh)
Other versions
TW201927655A (zh
Inventor
今村雄一
Original Assignee
日商村田機械股份有限公司
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Filing date
Publication date
Application filed by 日商村田機械股份有限公司 filed Critical 日商村田機械股份有限公司
Publication of TW201927655A publication Critical patent/TW201927655A/zh
Application granted granted Critical
Publication of TWI794358B publication Critical patent/TWI794358B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/06—Storage devices mechanical with means for presenting articles for removal at predetermined position or level
    • B65G1/065—Storage devices mechanical with means for presenting articles for removal at predetermined position or level with self propelled cars
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Position, Course, Altitude, Or Attitude Of Moving Bodies (AREA)
  • Warehouses Or Storage Devices (AREA)
TW107144257A 2017-12-12 2018-12-10 搬運車系統中的搬運車的部署方法 TWI794358B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017237456A JP6928312B2 (ja) 2017-12-12 2017-12-12 搬送車システム及び搬送車システムでの搬送車の配備方法
JP2017-237456 2017-12-12

Publications (2)

Publication Number Publication Date
TW201927655A TW201927655A (zh) 2019-07-16
TWI794358B true TWI794358B (zh) 2023-03-01

Family

ID=66735136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107144257A TWI794358B (zh) 2017-12-12 2018-12-10 搬運車系統中的搬運車的部署方法

Country Status (4)

Country Link
US (1) US11053074B2 (ja)
JP (1) JP6928312B2 (ja)
CN (1) CN109911530B (ja)
TW (1) TWI794358B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6928312B2 (ja) * 2017-12-12 2021-09-01 村田機械株式会社 搬送車システム及び搬送車システムでの搬送車の配備方法
WO2021177135A1 (ja) * 2020-03-02 2021-09-10 村田機械株式会社 自動倉庫システム、及び、自動倉庫システムの制御方法
JP7318589B2 (ja) * 2020-05-25 2023-08-01 株式会社ダイフク 物品搬送設備
CN111776582A (zh) * 2020-05-28 2020-10-16 北京京东乾石科技有限公司 分拣装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201543384A (zh) * 2014-05-14 2015-11-16 Murata Machinery Ltd 頂棚保管系統及在頂棚空間的貨物之保管方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08211937A (ja) 1995-01-31 1996-08-20 Tsubakimoto Chain Co 移動体の運行管理方法
JPH09330123A (ja) * 1996-06-07 1997-12-22 Mitsubishi Heavy Ind Ltd 走行制御システム
JP3212029B2 (ja) * 1997-11-07 2001-09-25 村田機械株式会社 無人搬送車システム
DK199800837A (da) * 1998-06-29 1999-12-30 Ecco Sko A S Anlæg til behandling af emner
JP2002060006A (ja) * 2000-08-11 2002-02-26 Murata Mach Ltd 有軌道台車システム
US7138596B2 (en) * 2001-08-01 2006-11-21 Pippin James M Apparatus and method for mail sorting
US7871232B2 (en) * 2005-05-12 2011-01-18 Lutz David W Line feed system with indexing cart
JP2007191235A (ja) * 2006-01-17 2007-08-02 Murata Mach Ltd 天井走行車システム
US9096375B2 (en) * 2009-04-10 2015-08-04 Symbotic, LLC Storage and retrieval system
JP2013035670A (ja) * 2011-08-09 2013-02-21 Murata Machinery Ltd 搬送車システム
US9139363B2 (en) * 2013-03-15 2015-09-22 John Lert Automated system for transporting payloads
US10196214B2 (en) * 2015-08-14 2019-02-05 Murata Machinery, Ltd. Conveyor car system
JP6928312B2 (ja) * 2017-12-12 2021-09-01 村田機械株式会社 搬送車システム及び搬送車システムでの搬送車の配備方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201543384A (zh) * 2014-05-14 2015-11-16 Murata Machinery Ltd 頂棚保管系統及在頂棚空間的貨物之保管方法

Also Published As

Publication number Publication date
JP2019104581A (ja) 2019-06-27
JP6928312B2 (ja) 2021-09-01
CN109911530A (zh) 2019-06-21
CN109911530B (zh) 2022-11-15
US11053074B2 (en) 2021-07-06
TW201927655A (zh) 2019-07-16
US20190177087A1 (en) 2019-06-13

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