TWI794259B - 校正測量器之方法及箱 - Google Patents

校正測量器之方法及箱 Download PDF

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Publication number
TWI794259B
TWI794259B TW107125983A TW107125983A TWI794259B TW I794259 B TWI794259 B TW I794259B TW 107125983 A TW107125983 A TW 107125983A TW 107125983 A TW107125983 A TW 107125983A TW I794259 B TWI794259 B TW I794259B
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TW
Taiwan
Prior art keywords
sensing electrodes
complex
box
measuring instrument
measuring device
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Application number
TW107125983A
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English (en)
Chinese (zh)
Other versions
TW201913135A (zh
Inventor
杉田吉平
南朋秀
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW201913135A publication Critical patent/TW201913135A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G01R35/005—Calibrating; Standards or reference devices, e.g. voltage or resistance standards, "golden" references
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G01D18/001—Calibrating encoders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H01J37/32183—Matching circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24564—Measurements of electric or magnetic variables, e.g. voltage, current, frequency
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Drying Of Semiconductors (AREA)
TW107125983A 2017-07-31 2018-07-27 校正測量器之方法及箱 TWI794259B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-148031 2017-07-31
JP2017148031A JP6948873B2 (ja) 2017-07-31 2017-07-31 測定器を較正する方法、及び、ケース

Publications (2)

Publication Number Publication Date
TW201913135A TW201913135A (zh) 2019-04-01
TWI794259B true TWI794259B (zh) 2023-03-01

Family

ID=65038540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107125983A TWI794259B (zh) 2017-07-31 2018-07-27 校正測量器之方法及箱

Country Status (5)

Country Link
US (1) US10837810B2 (https=)
JP (1) JP6948873B2 (https=)
KR (1) KR102636225B1 (https=)
CN (1) CN109324303B (https=)
TW (1) TWI794259B (https=)

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US11468590B2 (en) * 2018-04-24 2022-10-11 Cyberoptics Corporation Wireless substrate-like teaching sensor for semiconductor processing
US10782157B2 (en) * 2018-06-26 2020-09-22 Faurecia Automotive Seating, Llc Analog signal conditioning with diagnostics for capacitive sensor elements
JP7038621B2 (ja) * 2018-07-20 2022-03-18 東京エレクトロン株式会社 位置測定装置および位置測定方法
CN110560892B (zh) * 2019-07-09 2020-05-22 济南邦德激光股份有限公司 一种基于激光切管设备的管材识别方法及装置
CN111261565B (zh) * 2020-01-21 2023-11-14 北京北方华创微电子装备有限公司 一种半导体设备及其晶圆传输腔室和晶圆传输方法
JP7418241B2 (ja) * 2020-02-27 2024-01-19 東京エレクトロン株式会社 位置決め装置、処理システム及び位置決め方法
JP7445532B2 (ja) * 2020-06-15 2024-03-07 東京エレクトロン株式会社 実行装置及び実行方法
TWI741715B (zh) * 2020-08-03 2021-10-01 矽品精密工業股份有限公司 承載裝置
CN114613657B (zh) 2020-12-09 2025-11-07 细美事有限公司 用于晶片型传感器的充电和自动校准的控制程序、容器及半导体元件制造设备
KR102584512B1 (ko) 2020-12-31 2023-10-05 세메스 주식회사 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법
JP7630420B2 (ja) * 2021-12-27 2025-02-17 東京エレクトロン株式会社 測定器
KR102543728B1 (ko) * 2022-07-20 2023-06-14 주식회사 위트코퍼레이션 에지 영역의 특성 측정이 가능한 모니터링 기기 및 이를 제조하는 방법

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US5432457A (en) * 1994-01-28 1995-07-11 Northrop Grumman Corporation Capacitive disk probe
TW364951B (en) * 1996-11-25 1999-07-21 Nohken Co Ltd Electrostatic capacitor inspection apparatus
TW200902991A (en) * 2007-03-29 2009-01-16 Dainippon Screen Mfg Surface voltmeter
US20150001200A1 (en) * 2012-01-10 2015-01-01 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture

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JP4249448B2 (ja) * 2001-09-06 2009-04-02 東京エレクトロン株式会社 容量計の校正方法、校正用標準容量ボックス、静電容量の測定方法、容量測定用ボックス及び容量計
CN100474551C (zh) * 2006-08-23 2009-04-01 北京北方微电子基地设备工艺研究中心有限责任公司 定位校准装置及定位校准系统
JP4956328B2 (ja) 2007-08-24 2012-06-20 東京エレクトロン株式会社 搬送アームの移動位置の調整方法及び位置検出用治具
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KR102307737B1 (ko) 2015-06-11 2021-10-01 도쿄엘렉트론가부시키가이샤 정전 용량 측정용의 센서 칩 및 센서 칩을 구비한 측정기
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Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5432457A (en) * 1994-01-28 1995-07-11 Northrop Grumman Corporation Capacitive disk probe
TW364951B (en) * 1996-11-25 1999-07-21 Nohken Co Ltd Electrostatic capacitor inspection apparatus
TW200902991A (en) * 2007-03-29 2009-01-16 Dainippon Screen Mfg Surface voltmeter
US20150001200A1 (en) * 2012-01-10 2015-01-01 Hzo, Inc. Methods, apparatuses and systems for sensing exposure of electronic devices to moisture

Also Published As

Publication number Publication date
CN109324303A (zh) 2019-02-12
JP2019027944A (ja) 2019-02-21
JP6948873B2 (ja) 2021-10-13
US20190033103A1 (en) 2019-01-31
KR20190013634A (ko) 2019-02-11
CN109324303B (zh) 2021-05-28
KR102636225B1 (ko) 2024-02-13
US10837810B2 (en) 2020-11-17
TW201913135A (zh) 2019-04-01

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