TWI791039B - 塗布處理裝置及塗布液捕集構件 - Google Patents

塗布處理裝置及塗布液捕集構件 Download PDF

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Publication number
TWI791039B
TWI791039B TW107129045A TW107129045A TWI791039B TW I791039 B TWI791039 B TW I791039B TW 107129045 A TW107129045 A TW 107129045A TW 107129045 A TW107129045 A TW 107129045A TW I791039 B TWI791039 B TW I791039B
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TW
Taiwan
Prior art keywords
solvent
coating liquid
coating
wafer
cup body
Prior art date
Application number
TW107129045A
Other languages
English (en)
Chinese (zh)
Other versions
TW201919771A (zh
Inventor
上村良一
Original Assignee
日商東京威力科創股份有限公司
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Publication of TW201919771A publication Critical patent/TW201919771A/zh
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Publication of TWI791039B publication Critical patent/TWI791039B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B05B14/30—Arrangements for collecting, re-using or eliminating excess spraying material comprising enclosures close to, or in contact with, the object to be sprayed and surrounding or confining the discharged spray or jet but not the object to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW107129045A 2017-08-29 2018-08-21 塗布處理裝置及塗布液捕集構件 TWI791039B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017164762A JP6841188B2 (ja) 2017-08-29 2017-08-29 塗布処理装置及び塗布液捕集部材
JP2017-164762 2017-08-29

Publications (2)

Publication Number Publication Date
TW201919771A TW201919771A (zh) 2019-06-01
TWI791039B true TWI791039B (zh) 2023-02-01

Family

ID=65437752

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107129045A TWI791039B (zh) 2017-08-29 2018-08-21 塗布處理裝置及塗布液捕集構件

Country Status (5)

Country Link
US (1) US10699919B2 (enExample)
JP (1) JP6841188B2 (enExample)
KR (1) KR102195652B1 (enExample)
CN (2) CN109420590B (enExample)
TW (1) TWI791039B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7462503B2 (ja) 2019-08-30 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置
JP7426808B2 (ja) * 2019-11-27 2024-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7339150B2 (ja) * 2019-12-20 2023-09-05 ラピスセミコンダクタ株式会社 基板処理装置、基板処理方法
JP7525363B2 (ja) 2020-10-08 2024-07-30 東京エレクトロン株式会社 液処理装置及び洗浄方法
JP7546461B2 (ja) * 2020-12-01 2024-09-06 東京エレクトロン株式会社 液処理方法及び液処理装置
CN113058791B (zh) * 2021-04-06 2022-04-19 黄河科技学院 一种汽车喷漆装置
CN116072565B (zh) * 2021-10-29 2025-09-23 弘塑科技股份有限公司 单晶圆湿处理设备
CN115871089B (zh) * 2022-12-07 2024-07-23 江西唯美陶瓷有限公司 一种静电喷涂设备及静电喷涂方法
CN115662937B (zh) * 2022-12-29 2023-03-17 四川晶辉半导体有限公司 一种芯片安装设备
KR102819948B1 (ko) * 2023-06-15 2025-06-13 세메스 주식회사 기판 처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151376A (ja) * 2000-11-07 2002-05-24 Tokyo Electron Ltd 現像処理方法及び現像処理装置
CN102059197A (zh) * 2009-11-13 2011-05-18 采钰科技股份有限公司 喷涂系统及方法
US20140261163A1 (en) * 2013-03-18 2014-09-18 Tokyo Electron Limited Liquid treatment apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705223A (en) * 1994-07-26 1998-01-06 International Business Machine Corp. Method and apparatus for coating a semiconductor wafer
JPH10296162A (ja) * 1997-04-24 1998-11-10 Dainippon Screen Mfg Co Ltd 回転式基板処理装置および回転式基板処理装置用カップ
JP2001176767A (ja) * 1999-12-08 2001-06-29 Lsi Logic Corp フォトレジスト塗布装置
JP2004050054A (ja) * 2002-07-19 2004-02-19 Dainippon Screen Mfg Co Ltd 基板処理装置の洗浄方法および基板処理装置
JP2006086204A (ja) * 2004-09-14 2006-03-30 Tokyo Ohka Kogyo Co Ltd 塗布装置
JP3175893U (ja) * 2012-03-15 2012-06-07 東京エレクトロン株式会社 液処理装置
JP6045357B2 (ja) 2013-01-16 2016-12-14 キヤノン株式会社 薬液層の形成方法
JP6119293B2 (ja) * 2013-02-18 2017-04-26 株式会社リコー 回転塗布装置および回転塗布装置の洗浄方法
JP6234736B2 (ja) * 2013-08-30 2017-11-22 芝浦メカトロニクス株式会社 スピン処理装置
JP6482348B2 (ja) * 2015-03-26 2019-03-13 株式会社テックインテック 回転式塗布装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151376A (ja) * 2000-11-07 2002-05-24 Tokyo Electron Ltd 現像処理方法及び現像処理装置
CN102059197A (zh) * 2009-11-13 2011-05-18 采钰科技股份有限公司 喷涂系统及方法
US20140261163A1 (en) * 2013-03-18 2014-09-18 Tokyo Electron Limited Liquid treatment apparatus

Also Published As

Publication number Publication date
CN109420590A (zh) 2019-03-05
JP2019046833A (ja) 2019-03-22
CN209020671U (zh) 2019-06-25
US20190067043A1 (en) 2019-02-28
JP6841188B2 (ja) 2021-03-10
KR20190024725A (ko) 2019-03-08
KR102195652B1 (ko) 2020-12-28
CN109420590B (zh) 2021-05-28
US10699919B2 (en) 2020-06-30
TW201919771A (zh) 2019-06-01

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