TWI791012B - 離子組合物及其相關用途 - Google Patents
離子組合物及其相關用途 Download PDFInfo
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- TWI791012B TWI791012B TW107107145A TW107107145A TWI791012B TW I791012 B TWI791012 B TW I791012B TW 107107145 A TW107107145 A TW 107107145A TW 107107145 A TW107107145 A TW 107107145A TW I791012 B TWI791012 B TW I791012B
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- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
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- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/082—Compounds containing nitrogen and non-metals and optionally metals
- C01B21/086—Compounds containing nitrogen and non-metals and optionally metals containing one or more sulfur atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
- C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
- C07D233/58—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Plural Heterocyclic Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
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| TW (1) | TWI791012B (https=) |
| WO (1) | WO2018161025A1 (https=) |
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| TW201936854A (zh) * | 2017-11-21 | 2019-09-16 | 日商日東電工股份有限公司 | 咪唑氟磺醯基亞胺鎓鹽離子黏著劑組合物及其選擇性脫黏 |
| WO2020086454A1 (en) * | 2018-10-23 | 2020-04-30 | Nitto Denko Corporation | Corrosion resistant electrochemically de-bondable adhesive composition for use in high and low humidity environments |
| HUE069138T2 (hu) * | 2019-10-15 | 2025-02-28 | Syensqo Sa | Bisz(fluorszulfonil)imid sók és elõállítási eljárásaik |
| JP2024522538A (ja) * | 2021-06-04 | 2024-06-21 | スリーエム イノベイティブ プロパティズ カンパニー | オンデマンド剥離挙動を示す接着剤組成物を含有する物品 |
| CN116621130B (zh) * | 2023-06-16 | 2024-04-23 | 兰州康鹏新能源科技有限公司 | 一种双氟磺酰亚胺锂盐的制备方法 |
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| US4483835A (en) * | 1983-11-14 | 1984-11-20 | Chevron Research Company | Process for preparing molecular sieves using imidazole template |
| TW201006897A (en) * | 2008-04-01 | 2010-02-16 | Evonik Roehm Gmbh | Process for the synthesis of improved binders and modified tacticity |
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| TW201641652A (zh) * | 2015-02-27 | 2016-12-01 | 漢高股份有限及兩合公司 | 可剝離反應性熱熔黏著劑 |
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| CA2283670C (fr) | 1998-02-03 | 2011-06-07 | Acep Inc. | Materiaux utiles en tant que solutes electrolytiques |
| US7332218B1 (en) | 1999-07-14 | 2008-02-19 | Eic Laboratories, Inc. | Electrically disbonding materials |
| US6471939B1 (en) | 2001-05-29 | 2002-10-29 | Exxonmobil Research And Engineering Company | Synthetic porous crystalline material ITQ-12, its synthesis and use |
| EP2243539A3 (en) | 2002-04-05 | 2011-06-01 | University Of South Alabama | Functionalized ionic liquids, and methods of use thereof |
| AU2003298364A1 (en) | 2002-12-17 | 2004-07-09 | Shell Internationale Research Maatschappij B.V. | Hydroformylation process for the conversion of an ethylenically unsaturated compound to an alcohol |
| SE531351C2 (sv) * | 2007-06-05 | 2009-03-03 | Stora Enso Ab | Laminatstruktur innefattande elektrokemiskt försvagningsbart lim |
| JP5384005B2 (ja) * | 2007-12-27 | 2014-01-08 | サイデン化学株式会社 | 粘着剤組成物、粘着剤物品、光学用粘着剤組成物及び粘着方法 |
| US8134027B2 (en) | 2008-03-31 | 2012-03-13 | Nippon Shokubai Co., Ltd. | Sulfonylimide salt and method for producing the same |
| JP5296446B2 (ja) | 2008-07-31 | 2013-09-25 | ビッグテクノス株式会社 | 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法 |
| KR20100067171A (ko) * | 2008-12-11 | 2010-06-21 | 동우 화인켐 주식회사 | 대전방지성 편광판 및 이것이 구비된 액정표시장치 |
| DE102009019483A1 (de) | 2009-05-04 | 2010-11-11 | Eads Deutschland Gmbh | Klebstoff-Zusammensetzung für lösbare Klebeverbindungen und Modifikation der Verkapselungsmaterialien für gezielte Energieeinbringung |
| WO2010143643A1 (ja) * | 2009-06-09 | 2010-12-16 | 日本合成化学工業株式会社 | 粘着剤組成物および粘着剤、ならびに光学部材用粘着剤、それを用いて得られる粘着剤層付き光学部材 |
| JP5503926B2 (ja) | 2009-08-31 | 2014-05-28 | ビッグテクノス株式会社 | 電気剥離性粘着製品及びその剥離方法 |
| JP2011129400A (ja) * | 2009-12-18 | 2011-06-30 | Konica Minolta Holdings Inc | イオン液体を有する二次電池およびその製造方法 |
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| US4483835A (en) * | 1983-11-14 | 1984-11-20 | Chevron Research Company | Process for preparing molecular sieves using imidazole template |
| TW201006897A (en) * | 2008-04-01 | 2010-02-16 | Evonik Roehm Gmbh | Process for the synthesis of improved binders and modified tacticity |
| JP2010037355A (ja) * | 2008-07-31 | 2010-02-18 | Big Technos Kk | 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法 |
| TW201641652A (zh) * | 2015-02-27 | 2016-12-01 | 漢高股份有限及兩合公司 | 可剝離反應性熱熔黏著劑 |
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| JP2020512306A (ja) | 2020-04-23 |
| US11970641B2 (en) | 2024-04-30 |
| TW201902878A (zh) | 2019-01-16 |
| JP7082134B2 (ja) | 2022-06-07 |
| CN110603302B (zh) | 2021-10-22 |
| EP3589712A1 (en) | 2020-01-08 |
| KR20190126104A (ko) | 2019-11-08 |
| WO2018161025A1 (en) | 2018-09-07 |
| EP3589712B1 (en) | 2023-08-30 |
| US20200071581A1 (en) | 2020-03-05 |
| CN110603302A (zh) | 2019-12-20 |
| KR102478800B1 (ko) | 2022-12-16 |
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