JP7082134B2 - イオン組成物およびそれらの関連用途 - Google Patents

イオン組成物およびそれらの関連用途 Download PDF

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JP7082134B2
JP7082134B2 JP2019547402A JP2019547402A JP7082134B2 JP 7082134 B2 JP7082134 B2 JP 7082134B2 JP 2019547402 A JP2019547402 A JP 2019547402A JP 2019547402 A JP2019547402 A JP 2019547402A JP 7082134 B2 JP7082134 B2 JP 7082134B2
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mmol
mixture
alkyl
hours
under reduced
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Japanese (ja)
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JP2020512306A5 (https=
JP2020512306A (ja
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ラシュウォル、スタニスラフ
フー、ユイフェン
チャン、ホンシー
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Nitto Denko Corp
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Nitto Denko Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/082—Compounds containing nitrogen and non-metals and optionally metals
    • C01B21/086—Compounds containing nitrogen and non-metals and optionally metals containing one or more sulfur atoms
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/58—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
JP2019547402A 2017-03-02 2018-03-02 イオン組成物およびそれらの関連用途 Active JP7082134B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762466112P 2017-03-02 2017-03-02
US62/466,112 2017-03-02
PCT/US2018/020754 WO2018161025A1 (en) 2017-03-02 2018-03-02 Ionic compositions and related uses thereof

Publications (3)

Publication Number Publication Date
JP2020512306A JP2020512306A (ja) 2020-04-23
JP2020512306A5 JP2020512306A5 (https=) 2021-01-28
JP7082134B2 true JP7082134B2 (ja) 2022-06-07

Family

ID=61832583

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JP2019547402A Active JP7082134B2 (ja) 2017-03-02 2018-03-02 イオン組成物およびそれらの関連用途

Country Status (7)

Country Link
US (1) US11970641B2 (https=)
EP (1) EP3589712B1 (https=)
JP (1) JP7082134B2 (https=)
KR (1) KR102478800B1 (https=)
CN (1) CN110603302B (https=)
TW (1) TWI791012B (https=)
WO (1) WO2018161025A1 (https=)

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TW201936854A (zh) * 2017-11-21 2019-09-16 日商日東電工股份有限公司 咪唑氟磺醯基亞胺鎓鹽離子黏著劑組合物及其選擇性脫黏
WO2020086454A1 (en) * 2018-10-23 2020-04-30 Nitto Denko Corporation Corrosion resistant electrochemically de-bondable adhesive composition for use in high and low humidity environments
HUE069138T2 (hu) * 2019-10-15 2025-02-28 Syensqo Sa Bisz(fluorszulfonil)imid sók és elõállítási eljárásaik
JP2024522538A (ja) * 2021-06-04 2024-06-21 スリーエム イノベイティブ プロパティズ カンパニー オンデマンド剥離挙動を示す接着剤組成物を含有する物品
CN116621130B (zh) * 2023-06-16 2024-04-23 兰州康鹏新能源科技有限公司 一种双氟磺酰亚胺锂盐的制备方法

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WO2008150228A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab Laminate structure utilizing electrochemically weakable adhesive
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JP2011016990A (ja) 2009-06-09 2011-01-27 Nippon Synthetic Chem Ind Co Ltd:The 粘着剤組成物および粘着剤、ならびに光学部材用粘着剤、それを用いて得られる粘着剤層付き光学部材
JP2011129400A (ja) 2009-12-18 2011-06-30 Konica Minolta Holdings Inc イオン液体を有する二次電池およびその製造方法
WO2016135341A1 (en) 2015-02-27 2016-09-01 Henkel Ag & Co. Kgaa Debondable reactive hot melt adhesives
JP6017217B2 (ja) 2012-07-27 2016-10-26 日東電工株式会社 再剥離用水分散型アクリル系粘着剤組成物、粘着シート、及び、光学部材

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WO2008150228A1 (en) 2007-06-05 2008-12-11 Stora Enso Ab Laminate structure utilizing electrochemically weakable adhesive
JP2010037355A (ja) 2008-07-31 2010-02-18 Big Technos Kk 電気剥離性粘着剤組成物、電気剥離性粘着製品及びその剥離方法
JP2011016990A (ja) 2009-06-09 2011-01-27 Nippon Synthetic Chem Ind Co Ltd:The 粘着剤組成物および粘着剤、ならびに光学部材用粘着剤、それを用いて得られる粘着剤層付き光学部材
JP2011129400A (ja) 2009-12-18 2011-06-30 Konica Minolta Holdings Inc イオン液体を有する二次電池およびその製造方法
JP6017217B2 (ja) 2012-07-27 2016-10-26 日東電工株式会社 再剥離用水分散型アクリル系粘着剤組成物、粘着シート、及び、光学部材
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JP2020512306A (ja) 2020-04-23
US11970641B2 (en) 2024-04-30
TW201902878A (zh) 2019-01-16
CN110603302B (zh) 2021-10-22
EP3589712A1 (en) 2020-01-08
KR20190126104A (ko) 2019-11-08
TWI791012B (zh) 2023-02-01
WO2018161025A1 (en) 2018-09-07
EP3589712B1 (en) 2023-08-30
US20200071581A1 (en) 2020-03-05
CN110603302A (zh) 2019-12-20
KR102478800B1 (ko) 2022-12-16

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