TWI784097B - 曝光裝置及曝光方法 - Google Patents

曝光裝置及曝光方法 Download PDF

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Publication number
TWI784097B
TWI784097B TW107142861A TW107142861A TWI784097B TW I784097 B TWI784097 B TW I784097B TW 107142861 A TW107142861 A TW 107142861A TW 107142861 A TW107142861 A TW 107142861A TW I784097 B TWI784097 B TW I784097B
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TW
Taiwan
Prior art keywords
substrate
exposure
aforementioned
exposed
scanning direction
Prior art date
Application number
TW107142861A
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English (en)
Chinese (zh)
Other versions
TW201925926A (zh
Inventor
新井敏成
竹下𤥨郎
Original Assignee
日商Ｖ科技股份有限公司
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Application filed by 日商Ｖ科技股份有限公司 filed Critical 日商Ｖ科技股份有限公司
Publication of TW201925926A publication Critical patent/TW201925926A/zh
Application granted granted Critical
Publication of TWI784097B publication Critical patent/TWI784097B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107142861A 2017-12-08 2018-11-30 曝光裝置及曝光方法 TWI784097B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-236490 2017-12-08
JP2017236490A JP6940873B2 (ja) 2017-12-08 2017-12-08 露光装置および露光方法

Publications (2)

Publication Number Publication Date
TW201925926A TW201925926A (zh) 2019-07-01
TWI784097B true TWI784097B (zh) 2022-11-21

Family

ID=66750211

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107142861A TWI784097B (zh) 2017-12-08 2018-11-30 曝光裝置及曝光方法

Country Status (4)

Country Link
JP (1) JP6940873B2 (ja)
CN (1) CN111279270B (ja)
TW (1) TWI784097B (ja)
WO (1) WO2019111732A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112328513B (zh) * 2020-10-14 2024-02-02 合肥芯碁微电子装备股份有限公司 扫描式曝光系统及其数据缓存及调度方法和装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144598A (ja) * 1996-11-06 1998-05-29 Canon Inc 走査型露光装置及びそれを用いたデバイスの製造方法
JP2005300804A (ja) * 2004-04-09 2005-10-27 Pentax Corp 描画装置
TW201207570A (en) * 2009-12-24 2012-02-16 Toppan Printing Co Ltd Exposure method and exposure equipment

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4255997B2 (ja) * 1998-06-27 2009-04-22 株式会社安川電機 半導体ウエハの外観検査装置
JP2006017895A (ja) * 2004-06-30 2006-01-19 Integrated Solutions:Kk 露光装置
JP5145530B2 (ja) * 2005-10-07 2013-02-20 株式会社ブイ・テクノロジー フォトマスク及びそれを用いた露光方法
JP5133239B2 (ja) * 2006-04-05 2013-01-30 シャープ株式会社 露光方法および露光装置
JP2008076709A (ja) * 2006-09-21 2008-04-03 V Technology Co Ltd 露光装置
JP5098041B2 (ja) * 2007-08-31 2012-12-12 株式会社ブイ・テクノロジー 露光方法
JP5282941B2 (ja) * 2008-07-23 2013-09-04 株式会社ブイ・テクノロジー 近接露光装置
JP5382412B2 (ja) * 2008-10-24 2014-01-08 株式会社ブイ・テクノロジー 露光装置及びフォトマスク
JP5633021B2 (ja) * 2009-06-29 2014-12-03 株式会社ブイ・テクノロジー アライメント方法、アライメント装置及び露光装置
JP2012173337A (ja) * 2011-02-17 2012-09-10 Nsk Technology Co Ltd マスク、近接スキャン露光装置及び近接スキャン露光方法
JP5804511B2 (ja) * 2011-10-12 2015-11-04 株式会社ブイ・テクノロジー 露光装置
JP6312454B2 (ja) * 2014-02-07 2018-04-18 株式会社ブイ・テクノロジー 偏光光照射装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144598A (ja) * 1996-11-06 1998-05-29 Canon Inc 走査型露光装置及びそれを用いたデバイスの製造方法
JP2005300804A (ja) * 2004-04-09 2005-10-27 Pentax Corp 描画装置
TW201207570A (en) * 2009-12-24 2012-02-16 Toppan Printing Co Ltd Exposure method and exposure equipment

Also Published As

Publication number Publication date
WO2019111732A1 (ja) 2019-06-13
JP6940873B2 (ja) 2021-09-29
JP2019105675A (ja) 2019-06-27
CN111279270B (zh) 2023-04-04
CN111279270A (zh) 2020-06-12
TW201925926A (zh) 2019-07-01

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