TWI780764B - 裝置診斷裝置、裝置診斷方法、電漿處理裝置及半導體裝置製造系統 - Google Patents
裝置診斷裝置、裝置診斷方法、電漿處理裝置及半導體裝置製造系統 Download PDFInfo
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- TWI780764B TWI780764B TW110121443A TW110121443A TWI780764B TW I780764 B TWI780764 B TW I780764B TW 110121443 A TW110121443 A TW 110121443A TW 110121443 A TW110121443 A TW 110121443A TW I780764 B TWI780764 B TW I780764B
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- plasma processing
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/20—Administration of product repair or maintenance
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
- G06Q10/063—Operations research, analysis or management
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
- G06Q10/063—Operations research, analysis or management
- G06Q10/0637—Strategic management or analysis, e.g. setting a goal or target of an organisation; Planning actions based on goals; Analysis or evaluation of effectiveness of goals
- G06Q10/06375—Prediction of business process outcome or impact based on a proposed change
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/3288—Maintenance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32926—Software, data control or modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/80—Management or planning
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- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Human Resources & Organizations (AREA)
- Physics & Mathematics (AREA)
- Economics (AREA)
- Strategic Management (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Entrepreneurship & Innovation (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Tourism & Hospitality (AREA)
- Marketing (AREA)
- General Business, Economics & Management (AREA)
- Quality & Reliability (AREA)
- Operations Research (AREA)
- Game Theory and Decision Science (AREA)
- Development Economics (AREA)
- Educational Administration (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Primary Health Care (AREA)
- Plasma Technology (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/023386 WO2021255784A1 (ja) | 2020-06-15 | 2020-06-15 | 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム |
| WOPCT/JP2020/023386 | 2020-06-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202201591A TW202201591A (zh) | 2022-01-01 |
| TWI780764B true TWI780764B (zh) | 2022-10-11 |
Family
ID=79178432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110121443A TWI780764B (zh) | 2020-06-15 | 2021-06-11 | 裝置診斷裝置、裝置診斷方法、電漿處理裝置及半導體裝置製造系統 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12387921B2 (https=) |
| JP (2) | JPWO2021255784A1 (https=) |
| KR (1) | KR102648654B1 (https=) |
| CN (2) | CN114096972A (https=) |
| TW (1) | TWI780764B (https=) |
| WO (1) | WO2021255784A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI895961B (zh) * | 2023-02-21 | 2025-09-01 | 日商日立全球先端科技股份有限公司 | 異常檢測裝置及異常檢測方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7311817B2 (ja) * | 2021-06-16 | 2023-07-20 | ダイキン工業株式会社 | 制御装置、及び制御システム |
| KR102800655B1 (ko) * | 2022-02-25 | 2025-04-29 | 주식회사 테크위즈 | 환경안전관리 적용 장치에 대한 고장열화 예지보전 시스템 및 그 방법 |
| US20230280736A1 (en) * | 2022-03-02 | 2023-09-07 | Applied Materials, Inc. | Comprehensive analysis module for determining processing equipment performance |
| KR20230135558A (ko) * | 2022-03-14 | 2023-09-25 | 주식회사 히타치하이테크 | 진단 장치, 반도체 제조 장치 시스템, 반도체 장치 제조 시스템 및 진단 방법 |
| JP7564334B2 (ja) * | 2022-03-24 | 2024-10-08 | 株式会社日立ハイテク | 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015148867A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社日立パワーソリューションズ | 情報処理装置、診断方法、およびプログラム |
| JP2018036939A (ja) * | 2016-09-01 | 2018-03-08 | 日立Geニュークリア・エナジー株式会社 | プラント監視装置及びプラント監視方法 |
| TW201842226A (zh) * | 2017-03-03 | 2018-12-01 | 美商蘭姆研究公司 | 遠程電漿膜沉積中之晶圓級均勻性控制 |
| TW201941328A (zh) * | 2018-03-20 | 2019-10-16 | 日商東京威力科創股份有限公司 | 結合整合式半導體處理模組的自我察知及修正異質平台及其使用方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004019396A1 (ja) * | 2002-08-13 | 2004-03-04 | Tokyo Electron Limited | プラズマ処理方法及びプラズマ処理装置 |
| JP2004334457A (ja) | 2003-05-07 | 2004-11-25 | Mitsubishi Electric Corp | 点検計画作成装置及び点検計画作成方法 |
| JP2005286206A (ja) * | 2004-03-30 | 2005-10-13 | Hitachi High-Technologies Corp | 半導体製造装置およびその監視・解析支援方法 |
| US7152011B2 (en) * | 2004-08-25 | 2006-12-19 | Lam Research Corporation | Smart component-based management techniques in a substrate processing system |
| JP4776590B2 (ja) | 2007-06-19 | 2011-09-21 | 株式会社日立製作所 | 保守管理支援装置およびその表示方法、保守管理支援システム |
| JP2009124677A (ja) * | 2007-11-15 | 2009-06-04 | Toshiba Corp | 保守計画システム、および保守計画方法 |
| US20090132321A1 (en) | 2007-11-15 | 2009-05-21 | Kabushiki Kaisha Toshiba | Maintenance planning system and maintenance planning method |
| US7586100B2 (en) * | 2008-02-12 | 2009-09-08 | Varian Semiconductor Equipment Associates, Inc. | Closed loop control and process optimization in plasma doping processes using a time of flight ion detector |
| US8099310B2 (en) | 2008-02-19 | 2012-01-17 | Kabushiki Kaisha Toshiba | Maintenance scheduling system, maintenance scheduling method, and image forming apparatus |
| US8022718B2 (en) * | 2008-02-29 | 2011-09-20 | Lam Research Corporation | Method for inspecting electrostatic chucks with Kelvin probe analysis |
| JP4977064B2 (ja) * | 2008-03-12 | 2012-07-18 | 株式会社東芝 | 保守計画支援システム |
| US9831111B2 (en) * | 2014-02-12 | 2017-11-28 | Applied Materials, Inc. | Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck |
| JP6418791B2 (ja) | 2014-05-29 | 2018-11-07 | 株式会社日立製作所 | 冷却装置の異常検知システム |
| JP6394208B2 (ja) * | 2014-09-08 | 2018-09-26 | 新日鐵住金株式会社 | 製鋼工場における操業スケジュール作成方法および作成装置 |
| JP2016057736A (ja) * | 2014-09-08 | 2016-04-21 | 富士ゼロックス株式会社 | 情報処理装置、及びプログラム。 |
| WO2016125248A1 (ja) | 2015-02-03 | 2016-08-11 | 株式会社日立製作所 | 保守支援システム、保守支援方法、及び、保守支援プログラム |
| JP6723669B2 (ja) * | 2016-09-27 | 2020-07-15 | 東京エレクトロン株式会社 | 異常検知プログラム、異常検知方法および異常検知装置 |
| WO2018079778A1 (ja) * | 2016-10-31 | 2018-05-03 | 日本電気株式会社 | 生産管理装置、方法、プログラム |
| JP6926008B2 (ja) * | 2018-01-31 | 2021-08-25 | 株式会社日立製作所 | 保守計画装置、及び保守計画方法 |
| CN109019211B (zh) * | 2018-08-02 | 2020-10-20 | 深圳爱梯物联网控股有限公司 | 一种电梯维修保养作业辅助装置 |
| JP2020034585A (ja) * | 2018-08-27 | 2020-03-05 | コニカミノルタ株式会社 | 画像形成装置、画像形成システム、およびメンテナンス支援システム |
-
2020
- 2020-06-15 JP JP2021526327A patent/JPWO2021255784A1/ja active Pending
- 2020-06-15 CN CN202080007081.1A patent/CN114096972A/zh active Pending
- 2020-06-15 KR KR1020217016709A patent/KR102648654B1/ko active Active
- 2020-06-15 CN CN202511740576.6A patent/CN121563475A/zh active Pending
- 2020-06-15 WO PCT/JP2020/023386 patent/WO2021255784A1/ja not_active Ceased
- 2020-06-15 US US17/431,516 patent/US12387921B2/en active Active
-
2021
- 2021-06-11 TW TW110121443A patent/TWI780764B/zh active
-
2023
- 2023-06-09 JP JP2023095156A patent/JP7716442B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015148867A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社日立パワーソリューションズ | 情報処理装置、診断方法、およびプログラム |
| JP2018036939A (ja) * | 2016-09-01 | 2018-03-08 | 日立Geニュークリア・エナジー株式会社 | プラント監視装置及びプラント監視方法 |
| TW201842226A (zh) * | 2017-03-03 | 2018-12-01 | 美商蘭姆研究公司 | 遠程電漿膜沉積中之晶圓級均勻性控制 |
| TW201941328A (zh) * | 2018-03-20 | 2019-10-16 | 日商東京威力科創股份有限公司 | 結合整合式半導體處理模組的自我察知及修正異質平台及其使用方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI895961B (zh) * | 2023-02-21 | 2025-09-01 | 日商日立全球先端科技股份有限公司 | 異常檢測裝置及異常檢測方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021255784A1 (https=) | 2021-12-23 |
| CN121563475A (zh) | 2026-02-24 |
| KR102648654B1 (ko) | 2024-03-19 |
| JP7716442B2 (ja) | 2025-07-31 |
| KR20210157392A (ko) | 2021-12-28 |
| JP2023105229A (ja) | 2023-07-28 |
| TW202201591A (zh) | 2022-01-01 |
| US20220399182A1 (en) | 2022-12-15 |
| US12387921B2 (en) | 2025-08-12 |
| CN114096972A (zh) | 2022-02-25 |
| WO2021255784A1 (ja) | 2021-12-23 |
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