KR102648654B1 - 장치 진단 장치, 장치 진단 방법, 플라스마 처리 장치 및 반도체 장치 제조 시스템 - Google Patents

장치 진단 장치, 장치 진단 방법, 플라스마 처리 장치 및 반도체 장치 제조 시스템 Download PDF

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KR102648654B1
KR102648654B1 KR1020217016709A KR20217016709A KR102648654B1 KR 102648654 B1 KR102648654 B1 KR 102648654B1 KR 1020217016709 A KR1020217016709 A KR 1020217016709A KR 20217016709 A KR20217016709 A KR 20217016709A KR 102648654 B1 KR102648654 B1 KR 102648654B1
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maintenance
work
cost
plasma processing
repair
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KR20210157392A (ko
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쇼타 우메다
마사히로 스미야
요시토 가마지
겐지 다마키
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주식회사 히타치하이테크
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G06Q10/0637—Strategic management or analysis, e.g. setting a goal or target of an organisation; Planning actions based on goals; Analysis or evaluation of effectiveness of goals
    • G06Q10/06375—Prediction of business process outcome or impact based on a proposed change
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/20—Administration of product repair or maintenance
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

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  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Human Resources & Organizations (AREA)
  • Physics & Mathematics (AREA)
  • Economics (AREA)
  • Strategic Management (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Tourism & Hospitality (AREA)
  • Marketing (AREA)
  • General Business, Economics & Management (AREA)
  • Quality & Reliability (AREA)
  • Operations Research (AREA)
  • Game Theory and Decision Science (AREA)
  • Development Economics (AREA)
  • Educational Administration (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Primary Health Care (AREA)
  • Plasma Technology (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020217016709A 2020-06-15 2020-06-15 장치 진단 장치, 장치 진단 방법, 플라스마 처리 장치 및 반도체 장치 제조 시스템 Active KR102648654B1 (ko)

Applications Claiming Priority (1)

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PCT/JP2020/023386 WO2021255784A1 (ja) 2020-06-15 2020-06-15 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム

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KR20210157392A KR20210157392A (ko) 2021-12-28
KR102648654B1 true KR102648654B1 (ko) 2024-03-19

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US (1) US12387921B2 (https=)
JP (2) JPWO2021255784A1 (https=)
KR (1) KR102648654B1 (https=)
CN (2) CN114096972A (https=)
TW (1) TWI780764B (https=)
WO (1) WO2021255784A1 (https=)

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JP7311817B2 (ja) * 2021-06-16 2023-07-20 ダイキン工業株式会社 制御装置、及び制御システム
KR102800655B1 (ko) * 2022-02-25 2025-04-29 주식회사 테크위즈 환경안전관리 적용 장치에 대한 고장열화 예지보전 시스템 및 그 방법
US20230280736A1 (en) * 2022-03-02 2023-09-07 Applied Materials, Inc. Comprehensive analysis module for determining processing equipment performance
KR20230135558A (ko) * 2022-03-14 2023-09-25 주식회사 히타치하이테크 진단 장치, 반도체 제조 장치 시스템, 반도체 장치 제조 시스템 및 진단 방법
JP7564334B2 (ja) * 2022-03-24 2024-10-08 株式会社日立ハイテク 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法
KR20240131986A (ko) * 2023-02-21 2024-09-02 주식회사 히타치하이테크 이상 검출 장치 및 이상 검출 방법

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JP2009217718A (ja) * 2008-03-12 2009-09-24 Toshiba Corp 保守計画支援システム
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JP2018036939A (ja) * 2016-09-01 2018-03-08 日立Ｇｅニュークリア・エナジー株式会社 プラント監視装置及びプラント監視方法

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JP2004334457A (ja) 2003-05-07 2004-11-25 Mitsubishi Electric Corp 点検計画作成装置及び点検計画作成方法
JP2005286206A (ja) * 2004-03-30 2005-10-13 Hitachi High-Technologies Corp 半導体製造装置およびその監視・解析支援方法
US7152011B2 (en) * 2004-08-25 2006-12-19 Lam Research Corporation Smart component-based management techniques in a substrate processing system
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US7586100B2 (en) * 2008-02-12 2009-09-08 Varian Semiconductor Equipment Associates, Inc. Closed loop control and process optimization in plasma doping processes using a time of flight ion detector
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JP6394208B2 (ja) * 2014-09-08 2018-09-26 新日鐵住金株式会社 製鋼工場における操業スケジュール作成方法および作成装置
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WO2016125248A1 (ja) 2015-02-03 2016-08-11 株式会社日立製作所 保守支援システム、保守支援方法、及び、保守支援プログラム
JP6723669B2 (ja) * 2016-09-27 2020-07-15 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置
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Publication number Priority date Publication date Assignee Title
JP2009003517A (ja) * 2007-06-19 2009-01-08 Hitachi Ltd 保守管理支援装置およびその表示方法
JP2009217718A (ja) * 2008-03-12 2009-09-24 Toshiba Corp 保守計画支援システム
JP2015148867A (ja) * 2014-02-05 2015-08-20 株式会社日立パワーソリューションズ 情報処理装置、診断方法、およびプログラム
JP2018036939A (ja) * 2016-09-01 2018-03-08 日立Ｇｅニュークリア・エナジー株式会社 プラント監視装置及びプラント監視方法

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Publication number Publication date
JPWO2021255784A1 (https=) 2021-12-23
CN121563475A (zh) 2026-02-24
JP7716442B2 (ja) 2025-07-31
KR20210157392A (ko) 2021-12-28
JP2023105229A (ja) 2023-07-28
TW202201591A (zh) 2022-01-01
TWI780764B (zh) 2022-10-11
US20220399182A1 (en) 2022-12-15
US12387921B2 (en) 2025-08-12
CN114096972A (zh) 2022-02-25
WO2021255784A1 (ja) 2021-12-23

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