CN114096972A - 装置诊断装置、装置诊断方法、等离子处理装置以及半导体装置制造系统 - Google Patents

装置诊断装置、装置诊断方法、等离子处理装置以及半导体装置制造系统 Download PDF

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Publication number
CN114096972A
CN114096972A CN202080007081.1A CN202080007081A CN114096972A CN 114096972 A CN114096972 A CN 114096972A CN 202080007081 A CN202080007081 A CN 202080007081A CN 114096972 A CN114096972 A CN 114096972A
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China
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maintenance
plasma processing
processing apparatus
work
maintenance cost
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CN202080007081.1A
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English (en)
Chinese (zh)
Inventor
梅田祥太
角屋诚浩
釜地义人
玉置研二
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to CN202511740576.6A priority Critical patent/CN121563475A/zh
Publication of CN114096972A publication Critical patent/CN114096972A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/20—Administration of product repair or maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G06Q10/0637—Strategic management or analysis, e.g. setting a goal or target of an organisation; Planning actions based on goals; Analysis or evaluation of effectiveness of goals
    • G06Q10/06375—Prediction of business process outcome or impact based on a proposed change
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3288—Maintenance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

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  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Human Resources & Organizations (AREA)
  • Physics & Mathematics (AREA)
  • Economics (AREA)
  • Strategic Management (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Tourism & Hospitality (AREA)
  • Marketing (AREA)
  • General Business, Economics & Management (AREA)
  • Quality & Reliability (AREA)
  • Operations Research (AREA)
  • Game Theory and Decision Science (AREA)
  • Development Economics (AREA)
  • Educational Administration (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Primary Health Care (AREA)
  • Plasma Technology (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN202080007081.1A 2020-06-15 2020-06-15 装置诊断装置、装置诊断方法、等离子处理装置以及半导体装置制造系统 Pending CN114096972A (zh)

Priority Applications (1)

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CN202511740576.6A CN121563475A (zh) 2020-06-15 2020-06-15 装置诊断装置、装置诊断方法、等离子处理装置以及半导体装置制造系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/023386 WO2021255784A1 (ja) 2020-06-15 2020-06-15 装置診断装置、装置診断方法、プラズマ処理装置および半導体装置製造システム

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CN114096972A true CN114096972A (zh) 2022-02-25

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CN202080007081.1A Pending CN114096972A (zh) 2020-06-15 2020-06-15 装置诊断装置、装置诊断方法、等离子处理装置以及半导体装置制造系统
CN202511740576.6A Pending CN121563475A (zh) 2020-06-15 2020-06-15 装置诊断装置、装置诊断方法、等离子处理装置以及半导体装置制造系统

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Country Status (6)

Country Link
US (1) US12387921B2 (https=)
JP (2) JPWO2021255784A1 (https=)
KR (1) KR102648654B1 (https=)
CN (2) CN114096972A (https=)
TW (1) TWI780764B (https=)
WO (1) WO2021255784A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7311817B2 (ja) * 2021-06-16 2023-07-20 ダイキン工業株式会社 制御装置、及び制御システム
KR102800655B1 (ko) * 2022-02-25 2025-04-29 주식회사 테크위즈 환경안전관리 적용 장치에 대한 고장열화 예지보전 시스템 및 그 방법
US20230280736A1 (en) * 2022-03-02 2023-09-07 Applied Materials, Inc. Comprehensive analysis module for determining processing equipment performance
KR20230135558A (ko) * 2022-03-14 2023-09-25 주식회사 히타치하이테크 진단 장치, 반도체 제조 장치 시스템, 반도체 장치 제조 시스템 및 진단 방법
JP7564334B2 (ja) * 2022-03-24 2024-10-08 株式会社日立ハイテク 装置診断システム、装置診断装置、半導体装置製造システムおよび装置診断方法
KR20240131986A (ko) * 2023-02-21 2024-09-02 주식회사 히타치하이테크 이상 검출 장치 및 이상 검출 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050146709A1 (en) * 2002-08-13 2005-07-07 Tokyo Electron Limited Plasma processing method and plasma processing apparatus
US20150220847A1 (en) * 2014-02-05 2015-08-06 Hitachi Power Solutions Co., Ltd. Information Processing Apparatus, Diagnosis Method, and Program
JP2018036939A (ja) * 2016-09-01 2018-03-08 日立Ｇｅニュークリア・エナジー株式会社 プラント監視装置及びプラント監視方法
CN109019211A (zh) * 2018-08-02 2018-12-18 深圳市鑫汇达机械设计有限公司 一种电梯维修保养作业辅助装置
US20200058081A1 (en) * 2016-10-31 2020-02-20 Nec Corporation Production management apparatus, method, and non-transitory medium

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004334457A (ja) 2003-05-07 2004-11-25 Mitsubishi Electric Corp 点検計画作成装置及び点検計画作成方法
JP2005286206A (ja) * 2004-03-30 2005-10-13 Hitachi High-Technologies Corp 半導体製造装置およびその監視・解析支援方法
US7152011B2 (en) * 2004-08-25 2006-12-19 Lam Research Corporation Smart component-based management techniques in a substrate processing system
JP4776590B2 (ja) 2007-06-19 2011-09-21 株式会社日立製作所 保守管理支援装置およびその表示方法、保守管理支援システム
JP2009124677A (ja) * 2007-11-15 2009-06-04 Toshiba Corp 保守計画システム、および保守計画方法
US20090132321A1 (en) 2007-11-15 2009-05-21 Kabushiki Kaisha Toshiba Maintenance planning system and maintenance planning method
US7586100B2 (en) * 2008-02-12 2009-09-08 Varian Semiconductor Equipment Associates, Inc. Closed loop control and process optimization in plasma doping processes using a time of flight ion detector
US8099310B2 (en) 2008-02-19 2012-01-17 Kabushiki Kaisha Toshiba Maintenance scheduling system, maintenance scheduling method, and image forming apparatus
US8022718B2 (en) * 2008-02-29 2011-09-20 Lam Research Corporation Method for inspecting electrostatic chucks with Kelvin probe analysis
JP4977064B2 (ja) * 2008-03-12 2012-07-18 株式会社東芝 保守計画支援システム
US9831111B2 (en) * 2014-02-12 2017-11-28 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
JP6418791B2 (ja) 2014-05-29 2018-11-07 株式会社日立製作所 冷却装置の異常検知システム
JP6394208B2 (ja) * 2014-09-08 2018-09-26 新日鐵住金株式会社 製鋼工場における操業スケジュール作成方法および作成装置
JP2016057736A (ja) * 2014-09-08 2016-04-21 富士ゼロックス株式会社 情報処理装置、及びプログラム。
WO2016125248A1 (ja) 2015-02-03 2016-08-11 株式会社日立製作所 保守支援システム、保守支援方法、及び、保守支援プログラム
JP6723669B2 (ja) * 2016-09-27 2020-07-15 東京エレクトロン株式会社 異常検知プログラム、異常検知方法および異常検知装置
US11702748B2 (en) * 2017-03-03 2023-07-18 Lam Research Corporation Wafer level uniformity control in remote plasma film deposition
JP6926008B2 (ja) * 2018-01-31 2021-08-25 株式会社日立製作所 保守計画装置、及び保守計画方法
SG11202009105YA (en) 2018-03-20 2020-10-29 Tokyo Electron Ltd Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same
JP2020034585A (ja) * 2018-08-27 2020-03-05 コニカミノルタ株式会社 画像形成装置、画像形成システム、およびメンテナンス支援システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050146709A1 (en) * 2002-08-13 2005-07-07 Tokyo Electron Limited Plasma processing method and plasma processing apparatus
US20150220847A1 (en) * 2014-02-05 2015-08-06 Hitachi Power Solutions Co., Ltd. Information Processing Apparatus, Diagnosis Method, and Program
JP2018036939A (ja) * 2016-09-01 2018-03-08 日立Ｇｅニュークリア・エナジー株式会社 プラント監視装置及びプラント監視方法
US20200058081A1 (en) * 2016-10-31 2020-02-20 Nec Corporation Production management apparatus, method, and non-transitory medium
CN109019211A (zh) * 2018-08-02 2018-12-18 深圳市鑫汇达机械设计有限公司 一种电梯维修保养作业辅助装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
谭永令主编: "《工业企业销售管理》", vol. 1, 28 February 1994, 山西人民出版社, pages: 179 - 180 *

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Publication number Publication date
JPWO2021255784A1 (https=) 2021-12-23
CN121563475A (zh) 2026-02-24
KR102648654B1 (ko) 2024-03-19
JP7716442B2 (ja) 2025-07-31
KR20210157392A (ko) 2021-12-28
JP2023105229A (ja) 2023-07-28
TW202201591A (zh) 2022-01-01
TWI780764B (zh) 2022-10-11
US20220399182A1 (en) 2022-12-15
US12387921B2 (en) 2025-08-12
WO2021255784A1 (ja) 2021-12-23

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