TWI778950B - 導電材料及連接構造體 - Google Patents

導電材料及連接構造體 Download PDF

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Publication number
TWI778950B
TWI778950B TW106102877A TW106102877A TWI778950B TW I778950 B TWI778950 B TW I778950B TW 106102877 A TW106102877 A TW 106102877A TW 106102877 A TW106102877 A TW 106102877A TW I778950 B TWI778950 B TW I778950B
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TW
Taiwan
Prior art keywords
solder
mentioned
conductive
conductive material
electrode
Prior art date
Application number
TW106102877A
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English (en)
Chinese (zh)
Other versions
TW201732841A (zh
Inventor
夏井宏
定永周治郎
伊藤将大
保井秀文
石澤英亮
Original Assignee
日商積水化學工業股份有限公司
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Publication of TW201732841A publication Critical patent/TW201732841A/zh
Application granted granted Critical
Publication of TWI778950B publication Critical patent/TWI778950B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/025—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
TW106102877A 2016-01-25 2017-01-25 導電材料及連接構造體 TWI778950B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP??2016-011399 2016-01-25
JP2016011399 2016-01-25

Publications (2)

Publication Number Publication Date
TW201732841A TW201732841A (zh) 2017-09-16
TWI778950B true TWI778950B (zh) 2022-10-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW106102877A TWI778950B (zh) 2016-01-25 2017-01-25 導電材料及連接構造體
TW111138634A TW202331749A (zh) 2016-01-25 2017-01-25 導電材料及連接構造體

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111138634A TW202331749A (zh) 2016-01-25 2017-01-25 導電材料及連接構造體

Country Status (5)

Country Link
JP (2) JP6966322B2 (ko)
KR (1) KR102618237B1 (ko)
CN (1) CN108028090B (ko)
TW (2) TWI778950B (ko)
WO (1) WO2017130892A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200015445A (ko) * 2017-06-01 2020-02-12 세키스이가가쿠 고교가부시키가이샤 도전 재료 및 접속 구조체
WO2020054288A1 (ja) * 2018-09-14 2020-03-19 積水化学工業株式会社 導電材料及び接続構造体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
TW201241144A (en) * 2011-01-27 2012-10-16 Hitachi Chemical Co Ltd Conductive adhesive composition, connecting body and solar battery module and fabricating method thereof
TW201447922A (zh) * 2009-10-16 2014-12-16 Dexerials Corp 光反射性導電粒子、異向性導電接著劑及發光裝置
TW201546829A (zh) * 2009-09-14 2015-12-16 Dexerials Corp 光反射性異向性導電接著劑

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JP2001219294A (ja) * 1999-12-03 2001-08-14 Tdk Corp 熱硬化性はんだ付け用フラックスおよびはんだ付け方法
JP3888573B2 (ja) * 2001-06-29 2007-03-07 富士電機ホールディングス株式会社 ハンダ組成物
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
WO2007015426A1 (ja) * 2005-08-04 2007-02-08 Nichia Corporation 発光装置及びその製造方法並びに成形体及び封止部材
KR20090045195A (ko) 2006-08-25 2009-05-07 스미토모 베이클리트 컴퍼니 리미티드 접착 테이프, 접합체 및 반도체 패키지
JP2010221260A (ja) * 2009-03-24 2010-10-07 Mitsubishi Materials Corp はんだ粉末及び該粉末を用いたはんだペースト
JP5671225B2 (ja) * 2009-05-22 2015-02-18 積水化学工業株式会社 導電性微粒子、異方性導電材料、及び、導電接続構造体
US9073153B2 (en) * 2010-02-09 2015-07-07 Nordson Corporation Flux and solder material and method of making same
JP5916376B2 (ja) * 2011-09-13 2016-05-11 株式会社タムラ製作所 接着剤組成物およびそれを用いた太陽電池セルと配線基板との接続方法
JP2013256584A (ja) 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置
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JP5735716B2 (ja) * 2013-05-23 2015-06-17 積水化学工業株式会社 導電材料及び接続構造体
JP2015216026A (ja) * 2014-05-10 2015-12-03 アルプス電気株式会社 導電性ペースト及び配線基板
KR102410173B1 (ko) * 2014-05-14 2022-06-20 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
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CN104607826B (zh) * 2014-12-09 2017-02-01 华南理工大学 一种用于铝低温软钎焊的免清洗固态助焊剂及制备方法
JP6734141B2 (ja) * 2015-08-19 2020-08-05 積水化学工業株式会社 導電材料及び接続構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004202518A (ja) * 2002-12-24 2004-07-22 Nof Corp はんだ付け用フラックス組成物、はんだペースト及びはんだ付け方法
TW201546829A (zh) * 2009-09-14 2015-12-16 Dexerials Corp 光反射性異向性導電接著劑
TW201447922A (zh) * 2009-10-16 2014-12-16 Dexerials Corp 光反射性導電粒子、異向性導電接著劑及發光裝置
TW201241144A (en) * 2011-01-27 2012-10-16 Hitachi Chemical Co Ltd Conductive adhesive composition, connecting body and solar battery module and fabricating method thereof

Also Published As

Publication number Publication date
TW202331749A (zh) 2023-08-01
WO2017130892A1 (ja) 2017-08-03
KR102618237B1 (ko) 2023-12-28
CN108028090A (zh) 2018-05-11
TW201732841A (zh) 2017-09-16
CN108028090B (zh) 2020-11-13
KR20180105110A (ko) 2018-09-27
JP6966322B2 (ja) 2021-11-17
JPWO2017130892A1 (ja) 2018-11-15
JP2021185579A (ja) 2021-12-09

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