TWI778355B - 軟性金屬箔基板膜、包含軟性金屬箔基板膜之物品、及準備該膜之方法 - Google Patents
軟性金屬箔基板膜、包含軟性金屬箔基板膜之物品、及準備該膜之方法 Download PDFInfo
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- TWI778355B TWI778355B TW109113859A TW109113859A TWI778355B TW I778355 B TWI778355 B TW I778355B TW 109113859 A TW109113859 A TW 109113859A TW 109113859 A TW109113859 A TW 109113859A TW I778355 B TWI778355 B TW I778355B
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- metal foil
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- foil layer
- substrate film
- flexible
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0050988 | 2019-04-30 | ||
KR1020190050988A KR102329838B1 (ko) | 2019-04-30 | 2019-04-30 | 연성 금속박 적층 필름, 이를 포함하는 물품 및 상기 연성 금속박 적층 필름의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202043035A TW202043035A (zh) | 2020-12-01 |
TWI778355B true TWI778355B (zh) | 2022-09-21 |
Family
ID=73028967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109113859A TWI778355B (zh) | 2019-04-30 | 2020-04-24 | 軟性金屬箔基板膜、包含軟性金屬箔基板膜之物品、及準備該膜之方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7203969B2 (ko) |
KR (1) | KR102329838B1 (ko) |
CN (1) | CN113348266B (ko) |
TW (1) | TWI778355B (ko) |
WO (1) | WO2020222430A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116230686A (zh) * | 2021-12-02 | 2023-06-06 | 群创光电股份有限公司 | 电子装置的复合层电路结构的制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104960305A (zh) * | 2015-04-09 | 2015-10-07 | 柏弥兰金属化研究股份有限公司 | 制成可挠式金属积层材的方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US4603634A (en) * | 1985-02-04 | 1986-08-05 | Rockwell International Corporation | Copper and nickel layered ink metering roller |
JPH05183266A (ja) * | 1991-12-27 | 1993-07-23 | Matsushita Electric Ind Co Ltd | 電子回路用金属化フィルムの製造方法 |
JPH07243085A (ja) * | 1994-03-03 | 1995-09-19 | Sumitomo Metal Mining Co Ltd | 金属被覆ポリイミド基板の製造方法 |
JPH10200233A (ja) * | 1996-12-28 | 1998-07-31 | Sumitomo Metal Mining Co Ltd | 2層フレキシブル基板の製造方法 |
JP4160811B2 (ja) * | 2002-10-07 | 2008-10-08 | 住友電工プリントサーキット株式会社 | フレキシブル銅張回路基板 |
JP4064801B2 (ja) * | 2002-12-12 | 2008-03-19 | 新光電気工業株式会社 | 金属膜形成処理方法、半導体装置及び配線基板 |
JP2005060772A (ja) * | 2003-08-12 | 2005-03-10 | Tokai Rubber Ind Ltd | フレキシブルプリント基板の製法およびそれに用いられる回路用基材 |
JP2006332312A (ja) * | 2005-05-26 | 2006-12-07 | Three M Innovative Properties Co | 可撓性プリント回路基板用基材のビアホール形成方法 |
TW200738447A (en) * | 2006-04-07 | 2007-10-16 | Taimide Tech Inc | Surface-metaled polyimide and manufacture method of the same |
KR101277602B1 (ko) * | 2006-05-17 | 2013-06-21 | 가부시키가이샤 피아이 기쥬츠 켄큐쇼 | 금속 복합 필름 및 그 제조 방법 |
WO2009075212A1 (ja) | 2007-12-11 | 2009-06-18 | Kaneka Corporation | 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法 |
JP2009274250A (ja) * | 2008-05-13 | 2009-11-26 | Sumitomo Metal Mining Co Ltd | 金属被覆ポリイミドフィルム基板 |
TW201028287A (en) | 2008-09-18 | 2010-08-01 | Furukawa Electric Co Ltd | Metal clad body, circuit board and electronic part |
KR101102180B1 (ko) * | 2009-01-23 | 2012-01-02 | 주식회사 두산 | 신규 연성 금속박 적층판 및 그 제조방법 |
CN102031505B (zh) | 2009-09-25 | 2013-01-09 | 比亚迪股份有限公司 | 一种用于聚酰亚胺粗化活化的处理液和一种聚酰亚胺表面粗化活化的方法 |
JP2011202222A (ja) * | 2010-03-25 | 2011-10-13 | Panasonic Corp | 積層板、及び積層板の製造方法 |
JP5870550B2 (ja) * | 2010-08-25 | 2016-03-01 | 宇部興産株式会社 | フレキシブルプリント基板の製法 |
KR20130100333A (ko) * | 2010-11-12 | 2013-09-10 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 플렉시블 라미네이트 기판에 대한 회로 형성 방법 |
KR101669745B1 (ko) * | 2012-04-24 | 2016-10-27 | 스미토모 긴조쿠 고잔 가부시키가이샤 | 2층 플렉시블 배선용 기판 및 플렉시블 배선판 및 이들의 제조 방법 |
JP6191212B2 (ja) * | 2013-04-17 | 2017-09-06 | 宇部興産株式会社 | プリント配線基板の製造方法、及びプリント配線基板 |
CN105839104B (zh) * | 2016-03-30 | 2019-03-08 | 柏弥兰金属化研究股份有限公司 | 挠性金属积层材料的制造方法 |
JP6580119B2 (ja) | 2017-12-28 | 2019-09-25 | 石原ケミカル株式会社 | ポリイミド樹脂上への金属皮膜形成方法 |
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2019
- 2019-04-30 KR KR1020190050988A patent/KR102329838B1/ko active IP Right Grant
-
2020
- 2020-04-03 JP JP2021525778A patent/JP7203969B2/ja active Active
- 2020-04-03 WO PCT/KR2020/004564 patent/WO2020222430A1/ko active Application Filing
- 2020-04-03 CN CN202080006042.XA patent/CN113348266B/zh active Active
- 2020-04-24 TW TW109113859A patent/TWI778355B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104960305A (zh) * | 2015-04-09 | 2015-10-07 | 柏弥兰金属化研究股份有限公司 | 制成可挠式金属积层材的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN113348266B (zh) | 2024-05-03 |
WO2020222430A1 (ko) | 2020-11-05 |
CN113348266A (zh) | 2021-09-03 |
KR102329838B1 (ko) | 2021-11-22 |
KR20200126829A (ko) | 2020-11-09 |
JP7203969B2 (ja) | 2023-01-13 |
TW202043035A (zh) | 2020-12-01 |
JP2022507287A (ja) | 2022-01-18 |
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