TWI778290B - 教師資料產生方法以及吐出狀態的判斷方法 - Google Patents
教師資料產生方法以及吐出狀態的判斷方法 Download PDFInfo
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- TWI778290B TWI778290B TW108130516A TW108130516A TWI778290B TW I778290 B TWI778290 B TW I778290B TW 108130516 A TW108130516 A TW 108130516A TW 108130516 A TW108130516 A TW 108130516A TW I778290 B TWI778290 B TW I778290B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Ink Jet (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Manipulator (AREA)
- Feedback Control In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018158343 | 2018-08-27 | ||
JP2018-158343 | 2018-08-27 | ||
JP2019149428A JP7219190B2 (ja) | 2018-08-27 | 2019-08-16 | 教師データ生成方法および吐出状態の判定方法 |
JP2019-149428 | 2019-08-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202012056A TW202012056A (zh) | 2020-04-01 |
TWI778290B true TWI778290B (zh) | 2022-09-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108130516A TWI778290B (zh) | 2018-08-27 | 2019-08-27 | 教師資料產生方法以及吐出狀態的判斷方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7219190B2 (ja) |
KR (1) | KR102524704B1 (ja) |
CN (1) | CN112601617A (ja) |
TW (1) | TWI778290B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102403392B1 (ko) * | 2020-06-26 | 2022-05-30 | 포항공과대학교 산학협력단 | 기계학습을 이용한 잉크젯 프린팅 구동 파형 조정 장치 및 방법 |
JP2022162709A (ja) | 2021-04-13 | 2022-10-25 | 株式会社Screenホールディングス | 基板処理装置、基板処理システム、及びデータ処理方法 |
KR20230099984A (ko) * | 2021-12-28 | 2023-07-05 | 세메스 주식회사 | 노즐 검사 유닛 및 이를 포함하는 기판 처리 장치 |
Citations (7)
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TW200745771A (en) * | 2006-02-17 | 2007-12-16 | Nikon Corp | Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium |
US20090085960A1 (en) * | 2007-09-28 | 2009-04-02 | Yasuko Yahiro | Image forming method and inkjet recording apparatus |
CN102529409A (zh) * | 2010-12-21 | 2012-07-04 | 富士胶片株式会社 | 不良记录元件检测设备及检测方法和图像形成设备 |
CN102729621A (zh) * | 2011-03-29 | 2012-10-17 | 富士胶片株式会社 | 记录位置误差测量设备和方法以及图像形成设备和方法 |
TW201413239A (zh) * | 2012-09-28 | 2014-04-01 | Dainippon Screen Mfg | 指導資料驗證裝置、指導資料製作裝置、圖像分類裝置、指導資料驗證方法、指導資料製作方法及圖像分類方法 |
US20170158900A1 (en) * | 2014-09-03 | 2017-06-08 | Océ-Technologies B.V. | Method of printing |
TW201722565A (zh) * | 2015-11-10 | 2017-07-01 | 斯庫林集團股份有限公司 | 吐出判定方法及吐出裝置 |
Family Cites Families (13)
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JPH11176734A (ja) * | 1997-12-16 | 1999-07-02 | Sony Corp | レジスト塗布装置 |
JP4132762B2 (ja) * | 2001-09-27 | 2008-08-13 | 東京エレクトロン株式会社 | 基板の処理方法及び基板の処理装置 |
JP4435044B2 (ja) * | 2005-07-29 | 2010-03-17 | Tdk株式会社 | 液体材料吐出装置及び方法 |
JP5470371B2 (ja) * | 2009-03-19 | 2014-04-16 | タツモ株式会社 | 基板用塗布装置 |
JP5960156B2 (ja) * | 2011-11-07 | 2016-08-02 | 株式会社アルバック | インクジェット装置及び液滴測定方法 |
KR102340465B1 (ko) * | 2014-03-11 | 2021-12-16 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 처리 방법 |
JP6278759B2 (ja) * | 2014-03-11 | 2018-02-14 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6430228B2 (ja) * | 2014-12-15 | 2018-11-28 | 株式会社Screenホールディングス | 画像分類装置および画像分類方法 |
JP2016122681A (ja) * | 2014-12-24 | 2016-07-07 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6332095B2 (ja) * | 2015-03-20 | 2018-05-30 | 東京エレクトロン株式会社 | 薬液供給装置の調整方法、記憶媒体及び薬液供給装置 |
JP6541491B2 (ja) | 2015-07-29 | 2019-07-10 | 株式会社Screenホールディングス | 流下判定方法、流下判定装置および吐出装置 |
JP2017056402A (ja) * | 2015-09-16 | 2017-03-23 | セイコーエプソン株式会社 | 液滴吐出方法、液滴吐出プログラム、液滴吐出装置 |
JP6597972B2 (ja) * | 2016-03-23 | 2019-10-30 | 株式会社Screenホールディングス | 画像処理装置および画像処理方法 |
-
2019
- 2019-08-16 JP JP2019149428A patent/JP7219190B2/ja active Active
- 2019-08-21 KR KR1020217004602A patent/KR102524704B1/ko active IP Right Grant
- 2019-08-21 CN CN201980055179.1A patent/CN112601617A/zh active Pending
- 2019-08-27 TW TW108130516A patent/TWI778290B/zh active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200745771A (en) * | 2006-02-17 | 2007-12-16 | Nikon Corp | Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium |
US20090085960A1 (en) * | 2007-09-28 | 2009-04-02 | Yasuko Yahiro | Image forming method and inkjet recording apparatus |
CN102529409A (zh) * | 2010-12-21 | 2012-07-04 | 富士胶片株式会社 | 不良记录元件检测设备及检测方法和图像形成设备 |
CN102729621A (zh) * | 2011-03-29 | 2012-10-17 | 富士胶片株式会社 | 记录位置误差测量设备和方法以及图像形成设备和方法 |
TW201413239A (zh) * | 2012-09-28 | 2014-04-01 | Dainippon Screen Mfg | 指導資料驗證裝置、指導資料製作裝置、圖像分類裝置、指導資料驗證方法、指導資料製作方法及圖像分類方法 |
US20170158900A1 (en) * | 2014-09-03 | 2017-06-08 | Océ-Technologies B.V. | Method of printing |
TW201722565A (zh) * | 2015-11-10 | 2017-07-01 | 斯庫林集團股份有限公司 | 吐出判定方法及吐出裝置 |
Also Published As
Publication number | Publication date |
---|---|
JP7219190B2 (ja) | 2023-02-07 |
CN112601617A (zh) | 2021-04-02 |
KR20210031506A (ko) | 2021-03-19 |
TW202012056A (zh) | 2020-04-01 |
JP2020032409A (ja) | 2020-03-05 |
KR102524704B1 (ko) | 2023-04-21 |
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