KR102524704B1 - 교사 데이터 생성 방법 및 토출 상태의 판정 방법 - Google Patents

교사 데이터 생성 방법 및 토출 상태의 판정 방법 Download PDF

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Publication number
KR102524704B1
KR102524704B1 KR1020217004602A KR20217004602A KR102524704B1 KR 102524704 B1 KR102524704 B1 KR 102524704B1 KR 1020217004602 A KR1020217004602 A KR 1020217004602A KR 20217004602 A KR20217004602 A KR 20217004602A KR 102524704 B1 KR102524704 B1 KR 102524704B1
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KR
South Korea
Prior art keywords
processing liquid
image data
substrate
discharge
data
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KR1020217004602A
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English (en)
Korean (ko)
Other versions
KR20210031506A (ko
Inventor
유지 오키타
히데지 나오하라
다츠야 마스이
히로아키 가쿠마
Original Assignee
가부시키가이샤 스크린 홀딩스
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Priority claimed from PCT/JP2019/032550 external-priority patent/WO2020045176A1/ja
Publication of KR20210031506A publication Critical patent/KR20210031506A/ko
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Publication of KR102524704B1 publication Critical patent/KR102524704B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manipulator (AREA)
  • Feedback Control In General (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
KR1020217004602A 2018-08-27 2019-08-21 교사 데이터 생성 방법 및 토출 상태의 판정 방법 KR102524704B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2018-158343 2018-08-27
JP2018158343 2018-08-27
JPJP-P-2019-149428 2019-08-16
JP2019149428A JP7219190B2 (ja) 2018-08-27 2019-08-16 教師データ生成方法および吐出状態の判定方法
PCT/JP2019/032550 WO2020045176A1 (ja) 2018-08-27 2019-08-21 教師データ生成方法および吐出状態の判定方法

Publications (2)

Publication Number Publication Date
KR20210031506A KR20210031506A (ko) 2021-03-19
KR102524704B1 true KR102524704B1 (ko) 2023-04-21

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KR1020217004602A KR102524704B1 (ko) 2018-08-27 2019-08-21 교사 데이터 생성 방법 및 토출 상태의 판정 방법

Country Status (4)

Country Link
JP (1) JP7219190B2 (ja)
KR (1) KR102524704B1 (ja)
CN (1) CN112601617A (ja)
TW (1) TWI778290B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102403392B1 (ko) * 2020-06-26 2022-05-30 포항공과대학교 산학협력단 기계학습을 이용한 잉크젯 프린팅 구동 파형 조정 장치 및 방법
JP2022162709A (ja) 2021-04-13 2022-10-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理システム、及びデータ処理方法
KR20230099984A (ko) * 2021-12-28 2023-07-05 세메스 주식회사 노즐 검사 유닛 및 이를 포함하는 기판 처리 장치

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JP2017173098A (ja) * 2016-03-23 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 画像処理装置および画像処理方法

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JP6541491B2 (ja) 2015-07-29 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 流下判定方法、流下判定装置および吐出装置
JP2017056402A (ja) * 2015-09-16 2017-03-23 セイコーエプソン株式会社 液滴吐出方法、液滴吐出プログラム、液滴吐出装置
JP6553487B2 (ja) * 2015-11-10 2019-07-31 株式会社Ｓｃｒｅｅｎホールディングス 吐出判定方法および吐出装置

Patent Citations (2)

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JP2017173098A (ja) * 2016-03-23 2017-09-28 株式会社Ｓｃｒｅｅｎホールディングス 画像処理装置および画像処理方法

Also Published As

Publication number Publication date
JP2020032409A (ja) 2020-03-05
TW202012056A (zh) 2020-04-01
KR20210031506A (ko) 2021-03-19
TWI778290B (zh) 2022-09-21
JP7219190B2 (ja) 2023-02-07
CN112601617A (zh) 2021-04-02

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