TWI775739B - 可撓性元件基板形成用組成物 - Google Patents
可撓性元件基板形成用組成物 Download PDFInfo
- Publication number
- TWI775739B TWI775739B TW106100500A TW106100500A TWI775739B TW I775739 B TWI775739 B TW I775739B TW 106100500 A TW106100500 A TW 106100500A TW 106100500 A TW106100500 A TW 106100500A TW I775739 B TWI775739 B TW I775739B
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible element
- composition
- element substrate
- forming
- polyimide
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016-002614 | 2016-01-08 | ||
JP2016002614 | 2016-01-08 | ||
JP2016-228050 | 2016-11-24 | ||
JP2016228050 | 2016-11-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201739838A TW201739838A (zh) | 2017-11-16 |
TWI775739B true TWI775739B (zh) | 2022-09-01 |
Family
ID=59274112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106100500A TWI775739B (zh) | 2016-01-08 | 2017-01-06 | 可撓性元件基板形成用組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6905213B2 (fr) |
KR (1) | KR102675766B1 (fr) |
CN (1) | CN108473764B (fr) |
TW (1) | TWI775739B (fr) |
WO (1) | WO2017119450A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI645973B (zh) * | 2017-12-15 | 2019-01-01 | 律勝科技股份有限公司 | 聚醯亞胺薄化軟性基板及其製造方法 |
JP6530125B1 (ja) | 2018-04-27 | 2019-06-12 | 住友化学株式会社 | 光学フィルム |
KR102245533B1 (ko) * | 2020-11-02 | 2021-04-28 | 주식회사 지게차코리아 | 운송수단용 림 및 이의 제조방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015152178A1 (fr) * | 2014-03-31 | 2015-10-08 | 日産化学工業株式会社 | Procédé de production de film mince de résine et composition permettant de former ledit film mince de résine |
CN105111475A (zh) * | 2015-09-16 | 2015-12-02 | 苏州华辉材料科技有限公司 | 无色透明的聚酰亚胺纳米复合材料膜及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BRPI0713159A2 (pt) * | 2006-06-15 | 2012-04-03 | Croda Int Plc | composição absorvente de uv |
JP2010037425A (ja) * | 2008-08-05 | 2010-02-18 | Jsr Corp | 樹脂組成物、光学膜及び光学用部材 |
CN101831175A (zh) * | 2010-04-01 | 2010-09-15 | 辽宁科技大学 | 一种无色透明的聚酰亚胺纳米复合材料膜及其制备方法 |
JP2014114429A (ja) | 2012-01-12 | 2014-06-26 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド樹脂 |
JP5845918B2 (ja) | 2012-01-20 | 2016-01-20 | 宇部興産株式会社 | ポリイミド前駆体及びポリイミド |
JP6172139B2 (ja) * | 2012-02-23 | 2017-08-02 | 日立化成デュポンマイクロシステムズ株式会社 | 樹脂組成物、及びこれを用いたポリイミド樹脂膜、ディスプレイ基板とその製造方法 |
KR102059703B1 (ko) * | 2012-04-27 | 2019-12-26 | 우베 고산 가부시키가이샤 | 폴리아믹산 용액 조성물, 및 폴리이미드 |
TWI495404B (zh) * | 2013-06-21 | 2015-08-01 | Chi Mei Corp | 軟性基板用組成物及軟性基板 |
SG11201408126UA (en) * | 2013-06-26 | 2015-03-30 | Toray Industries | Polyimide precursor, polyimide, flexible substrate prepared therewith, color filter and production method thereof, and flexible display device |
JP2015078254A (ja) * | 2013-10-15 | 2015-04-23 | 東レ株式会社 | 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、tft基板、表示デバイスおよびそれらの製造方法 |
WO2016147958A1 (fr) * | 2015-03-13 | 2016-09-22 | 旭化成株式会社 | Composition de résine à base de précurseur de polyimide |
CN107406675B (zh) * | 2015-03-31 | 2020-11-06 | 日产化学工业株式会社 | 剥离层形成用组合物和剥离层 |
KR102103157B1 (ko) * | 2015-04-17 | 2020-04-22 | 아사히 가세이 가부시키가이샤 | 수지 조성물, 폴리이미드 수지막, 및 그 제조 방법 |
CN105137636A (zh) * | 2015-09-10 | 2015-12-09 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法和显示面板 |
-
2017
- 2017-01-05 CN CN201780005922.3A patent/CN108473764B/zh active Active
- 2017-01-05 JP JP2017560407A patent/JP6905213B2/ja active Active
- 2017-01-05 WO PCT/JP2017/000147 patent/WO2017119450A1/fr active Application Filing
- 2017-01-05 KR KR1020187018920A patent/KR102675766B1/ko active IP Right Grant
- 2017-01-06 TW TW106100500A patent/TWI775739B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015152178A1 (fr) * | 2014-03-31 | 2015-10-08 | 日産化学工業株式会社 | Procédé de production de film mince de résine et composition permettant de former ledit film mince de résine |
CN105111475A (zh) * | 2015-09-16 | 2015-12-02 | 苏州华辉材料科技有限公司 | 无色透明的聚酰亚胺纳米复合材料膜及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6905213B2 (ja) | 2021-07-21 |
JPWO2017119450A1 (ja) | 2018-10-25 |
KR20180102081A (ko) | 2018-09-14 |
TW201739838A (zh) | 2017-11-16 |
KR102675766B1 (ko) | 2024-06-18 |
CN108473764A (zh) | 2018-08-31 |
CN108473764B (zh) | 2021-09-28 |
WO2017119450A1 (fr) | 2017-07-13 |
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