TWI774751B - Led-oled混合自發光顯示器 - Google Patents

Led-oled混合自發光顯示器 Download PDF

Info

Publication number
TWI774751B
TWI774751B TW107112762A TW107112762A TWI774751B TW I774751 B TWI774751 B TW I774751B TW 107112762 A TW107112762 A TW 107112762A TW 107112762 A TW107112762 A TW 107112762A TW I774751 B TWI774751 B TW I774751B
Authority
TW
Taiwan
Prior art keywords
micro
led
color
leds
array
Prior art date
Application number
TW107112762A
Other languages
English (en)
Other versions
TW201842487A (zh
Inventor
磊 張
李起鳴
歐放
Original Assignee
中國大陸商上海顯耀顯示科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中國大陸商上海顯耀顯示科技有限公司 filed Critical 中國大陸商上海顯耀顯示科技有限公司
Publication of TW201842487A publication Critical patent/TW201842487A/zh
Application granted granted Critical
Publication of TWI774751B publication Critical patent/TWI774751B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/04—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions
    • G09G3/06—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources
    • G09G3/12—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources using electroluminescent elements
    • G09G3/14—Semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3258—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the voltage across the light-emitting element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/70—OLEDs integrated with inorganic light-emitting elements, e.g. with inorganic electroluminescent elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0404—Matrix technologies
    • G09G2300/0408—Integration of the drivers onto the display substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/0426—Layout of electrodes and connections
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G09G2300/0443—Pixel structures with several sub-pixels for the same colour in a pixel, not specifically used to display gradations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0439—Pixel structures
    • G09G2300/0452—Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83909—Post-treatment of the layer connector or bonding area
    • H01L2224/8393—Reshaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)

Abstract

本發明將無機及有機LED整合於一單一晶片中。在一整合式多色微型LED顯示器面板中，不同顏色微型LED之陣列與對應驅動器電路整合。一些顏色之微型LED係無機微型LED，且其他顏色係有機微型LED。可基於效率選擇無機對比有機，例如針對藍色像素使用無機微型LED且針對紅色及綠色像素使用有機微型LED。在一個方法中，首先在一支撐基板上製造一像素驅動器陣列。接著將微型LED之多個層堆疊於該基底基板之頂部上。首先製造含有無機微型LED之該等層，其中每層一個顏色。接著在該堆疊之該頂部處製造含有所有該等有機微型LED之一單一層。

Description

LED-OLED混合自發光顯示器
本發明大體係關於整合式多色LED顯示器晶片。
在現今之商用電子裝置中，與薄膜電晶體(TFT)技術組合之主動矩陣液晶顯示器(LCD)及有機發光二極體(OLED)顯示器正變得愈加流行。此等顯示器廣泛用於膝上型個人電腦、智慧型電話及個人數位助手。數百萬像素一起產生一顯示器上之一影像。TFT充當個別開啟及關閉各像素之開關，從而將像素呈現為亮或暗，此容許各像素及整個顯示器的方便及有效控制。
然而，習知LCD顯示器遭受低光效率，從而導致高功率消耗及有限之電池操作時間。雖然主動矩陣有機發光二極體(AMOLED)顯示器面板一般消耗低於LCD面板之功率，但一AMOLED顯示器面板仍可為電池操作裝置中之主要功率消耗者。為了延長電池壽命，期望降低顯示器面板之功率消耗。
習知無機半導體發光二極體(LED)已展現更佳之光效率，此使主動矩陣LED顯示器更為電池操作電子設備所需。驅動器電路之陣列及發光二極體用於控制數百萬個像素，從而在顯示器上呈現影像。然而，將數千個或甚至數百萬個微型LED與像素驅動器電路陣列之整合係相當具有挑戰性 的。
因此，需要更佳之顯示器面板。
本發明藉由在一單一晶片中整合無機及有機LED兩者而克服先前技術之限制。
一個實例係一整合式多色微型LED顯示器面板，其中不同顏色微型LED之陣列與對應驅動器電路整合。一些顏色之微型LED藉由無機微型LED實施，且其他顏色藉由有機微型LED實施。可基於效率選擇無機對比有機，例如針對藍色像素使用無機微型LED且針對紅色及綠色像素使用有機微型LED。
在一個方法中，首先在一支撐基板上製造一像素驅動器陣列。接著將多層微型LED堆疊於該基底基板之頂部上。首先製造含有無機微型LED之層，其中每層一個顏色。接著製造含有所有有機微型LED之一單一層作為堆疊之頂部層。
其他態樣包含組件、裝置、系統、改良、方法、程序、應用及相關於以上任一者之其他技術。
102:支撐基板
110:驅動電晶體/驅動器電路/像素驅動器
110B:像素驅動器
110G:像素驅動器
110R:像素驅動器
120:控制電晶體
130:電容器
140:LED
140B:微型LED
140G:微型LED
140R:微型LED
141B:無機微型LED
141R:無機微型LED
142G:有機微型LED
142R:有機微型LED
143:結構/互連件
146:上接觸金屬墊
147:通孔
148:下接觸金屬墊
149:通孔
150:掃描信號匯流排線/掃描線
151:底部層/層/中介層/無機層
151B:層
151R:層
152:頂部層/層/有機層
153:填充材料/填充物
154:材料/填充物
157:介面
163:通孔
164:金屬墊
165:共同電極/共同陰極觸點
167B:結構
167G:結構
167R:結構
170:資料信號匯流排線/資料線
610:多色像素
622:網格/結構
700:微型LED顯示器面板
710:資料介面
720:控制模組
732B:行
732G:行
732R:行
734:LED
736:接地墊
740:像素區
Vdd:電壓供應器
當結合附圖時，本發明之實施例具有根據以下實施方式及隨附發明申請專利範圍將更輕易瞭解之其他優勢及特徵，在圖式中：圖1係根據一項實施例之一顯示器面板之一像素之一電路圖。
圖2A及圖2B係根據各種實施例之一整合式多色LED顯示器面板之若干像素之截面視圖。
圖3係根據另一實施例之一整合式多色LED顯示器面板之若干像素之 一截面視圖。
圖4係根據又另一實施例之一整合式多色LED顯示器面板之若干像素之一截面視圖。
圖5A及圖5B係根據兩個實施例之共同電極之俯視圖。
圖6係根據一項實施例之繪示用於光學隔離之結構之一截面視圖。
圖7係根據一項實施例之具有一像素陣列之一例示性顯示器面板之一俯視圖。
圖式僅出於繪示之目的而描繪各種實施例。熟習技術者將易於自以下論述認識到，可在不背離本文中所描述原理之情況下採用本文中所繪示之結構及方法之替代實施例。
相關申請案之交叉參考
本申請案根據35 U.S.C. § 119(e)規定主張2017年4月13日申請之標題為「LED-OLED Hybrid Self-Emissive Display」之美國臨時專利申請案第62/484,979號之優先權。該案之全文以引用之方式併入本文中。
圖及下文描述係關於僅藉由繪示之較佳實施例。應注意自下文論述，本文中揭示之結構及方法之替代實施例將易於被認知為可在不脫離所主張內容之原理之情況下採用之可行替代例。
圖1係一顯示器面板之一像素之一電路圖，該顯示器面板包含一像素驅動器及LED 140(諸如微型LED)。微型LED通常具有50微米(um)或更小之一側向尺寸，且可具有小於10um且甚至僅幾um之側向尺寸。在此實例中，像素驅動器包含兩個電晶體及一個電容器130，其中一個電晶體係一控制電晶體120且另一電晶體係一驅動電晶體110。在此實例中，控制 電晶體120經組態為其之閘極經連接至一掃描信號匯流排線(亦可被稱為掃描線)150，其之一個源極/汲極經連接至一資料信號匯流排線(亦可被稱為資料線)170，且另一汲極/源極經連接至儲存電容器130及驅動電晶體110之閘極。驅動電晶體110之一個源極/汲極經連接至一電壓供應器(Vdd)，且另一汲極/源極經連接至LED 140之p電極。LED 140之n電極經連接至電容器130及接地。在此實例中，當掃描信號匯流排線150打開控制電晶體120之閘極時，資料信號匯流排線170給儲存電容器130充電且設定驅動電晶體110之閘極電壓，該閘極電壓控制通過LED 140之電流流動。儲存電容器130在此處用於維持驅動電晶體110之閘極電壓，因此在掃描信號匯流排線150正設定其他像素之時間期間維持流動通過LED 140之電流。(例如)將如在美國專利申請案第12/214,395號，「Monolithic Active or Passive Matrix LED Array Display Panels and Display Systems Having the Same」中清楚描述其他像素驅動器設計，該案以引用之方式併入本文中。
下列實例主要使用一整合式微型LED顯示器晶片，其中(若干)無機及有機微型LED陣列與TFT或CMOS像素驅動器整合，但此等僅係實例且所描述之技術不限於此特定應用。無機微型LED之實例包含基於GaN之UV/藍色/綠色微型LED、基於AlInGaP之紅色/橙色微型LED及基於GaAs或InP之紅外線(IR)微型LED。有機微型LED之實例包含針對電洞傳輸材料之基於三苯胺衍生物(TPD)之材料、針對電子傳輸材料之噁二唑衍生物(PBD)、作為用於藍色發射之具有摻雜劑TBP之一主體材料之Alq3、用於綠色發射之香豆素545T或DMQA、用於黃色發射之紅螢烯及用於紅色發射之DCM或Ir(piq)3。在美國專利申請案第15/135,217號「Semiconductor Devices with Integrated Thin-Film Transistor Circuitry」、美國專利申請案第15/269,954號「Making Semiconductor Devices with Alignment Bonding and Substrate Removal」、美國專利申請案第15/269,956號「Display Panels with Integrated Micro Lens Array」、美國專利申請案第15/272,410號「Manufacturing Display Panels with Integrated Micro Lens Array」及美國專利申請案第15/701,450號「Multi-Color Micro-LED Array Light Source」中描述了無機微型LED及其他微型結構之額外實例。所有以上申請案之全部內容以引用的方式併入本文中。
圖2A係根據一項實施例之一整合式多色LED顯示器面板之若干像素之一截面視圖。在圖2A中，在支撐基板102上製造一個別驅動電路陣列。在圖2A中展示之黑色矩形表示至驅動器電路之電連接，例如，圖1中之驅動電晶體110與LED 140之間的連接。為方便起見，此等驅動電晶體110亦可被稱為驅動器電路110或像素驅動器110。驅動器電路110使用後綴R、G、B標記，此係因為其等對應於紅色、綠色及藍色像素。像素驅動器110陣列經電連接至無機微型LED 141及有機微型LED 142之一混合物。此等微型LED 141、142亦使用後綴R、G、B標記以指示其等之顏色。在此實例中，無機LED 141用於藍色像素，且有機LED 142用於紅色及綠色像素，此係因為不同類型之LED在此等波長下具有更高外部量子效率。藉由使用有機及無機微型LED之一混合物，可增大總體效率。例如，顯示器面板可經設計使得各顏色之微型LED具有至少15%之一外部量子效率(EQE)。藍色無機LED可具有50%或更大之EQE。紅色及綠色有機LED可具有15%或更大之EQE。
在此實例中，微型LED 141、142包含在經堆疊於基板及像素驅動器 之頂部上之不同層151(亦可被稱為底部層/中介層/無機層)、152(亦可被稱為頂部層/有機層)中。底部層151含有無機微型LED 141B且頂部層含有有機微型LED 142R、142G。哪一顏色在哪一層中可取決於設計而變化。為方便起見，「向上」用於意指遠離基板102，「向下」意指朝向基板，且相應地解釋其他方向術語(諸如頂部、底部、上方、下方(below、under、beneath)等)。
將最左側微型LED 141B用作一實例，無機微型LED由一磊晶結構形成。實例包含III-V族氮化物、III-V族砷化物、III-V族磷化物及III-V族銻化物磊晶結構。視需要使用穿過任何中介層之通孔147，將一上接觸金屬墊146電連接至微型LED 141之頂部且亦電連接至一共同電極165。針對微型LED 141B，通孔147透過層151之剩餘部分連接至共同電極165，此透過有機層152中之一敞開區域進行接觸。視需要使用穿過任何中介層之通孔149，將一下接觸金屬墊148電連接至微型LED 141B之底部且亦電連接至對應像素驅動器110。因為微型LED 141B處於底部層中，故不存在中介層且不使用通孔149。
針對最右側有機微型LED 142G，通孔149透過中介層151將下接觸金屬墊148電連接至對應像素驅動器110。不需要通孔來將微型LED 142G之頂部觸點連接至共同電極165。在此實例中，各微型LED 141、142經連接至一單一共同電極165，但如將在下文展示之替代性設計中瞭解，此係不需要的。
在此實例中，使用材料153填充無機LED之層151，使得相鄰層之間的介面157係平坦的。此促進下一層之製造。填充材料153之一實例係二氧化矽，其既係不導電又係透明的。此提供微型LED與通孔之間的電隔 離，而且容許由下層中之微型LED產生之光傳播通過該層。填充材料153之另一實例係氮化矽。亦可使用材料154(例如，類似於用於無機層中之該等材料或聚合物材料之介電材料)填充有機微型LED 142之頂部層152。各層之填充物153、154不必係一單一均質材料。亦可使用材料或結構之組合。不管具體結構，較佳地，各層在側向定位於下層之微型LED上方之區中係透明的，使得由下層之微型LED產生之光能夠傳播通過此等區。
更詳細言之，如下般製造驅動器電路。支撐基板102係在其上製造個別驅動器電路110陣列之基板。在一項實施例中，基板102係Si基板。在另一實施例中，支撐基板102係一透明基板，(例如)一玻璃基板。其他例示性基板包含GaAs、GaP、InP、SiC、ZnO及藍寶石基板。驅動器電路110形成用以驅動微型LED之個別像素驅動器。基板102上之電路包含至各個別像素驅動器之觸點，該等觸點突出至表面。電路亦可包含各個別像素驅動器之一共同電極觸點。各微型LED亦具有兩個觸點：一個經連接至像素驅動器且另一個經連接至接地(即，共同電極)。
在未展示之替代性實施例中，驅動器電路可包含除CMOS驅動器電路外之驅動器電路。作為一個實例，驅動器電路可包含薄膜電晶體(TFT)驅動器電路。如另一實例，驅動器電路可為使用III-V族化合物半導體之電路。
為清晰起見，圖2A僅展示六個微型LED及對應像素驅動器。應理解，可使用任何數目個微型LED及像素驅動器。在一完全可程式化顯示器面板中，LED及驅動器電路經配置成陣列以形成一可個別定址像素(較佳地多色像素)陣列。在替代性實施例中，顯示器面板可具有一更有限之可程式化性且像素可經配置成不同幾何結構。另外，無需驅動器電路與LED 之間的一對一對應關係。例如，可存在連接至相同像素驅動器輸出以產生冗餘之兩個或兩個以上LED，使得若LED之一者發生故障，則剩餘LED仍可點亮像素。
微型LED亦可以不同方式分佈至層中且亦可存在不同數目個層。在一個方法中，各層僅包含無機微型LED或僅包含有機微型LED，而非同時包含兩者。在一個製造方法中，首先在堆疊底部處製造含有無機微型LED之層，且此等層之後接著製造含有有機微型LED之頂部層。無機層可使用每層僅一個顏色之微型LED製造，接著製造含有所有有機微型LED之一單一頂部層。
一顏色係由無機或有機微型LED產生之選擇亦可改變。顏色可包含紫外線、藍色、綠色、橙色、紅色及紅外線。此處，術語(諸如光、光學及顏色)意在包含紫外線及紅外線兩者。在上述實例中，由無機微型LED產生藍色，且由有機LED產生紅色及綠色。在一些情況中，由無機微型LED產生較短波長，且由有機LED產生較長波長。
圖2B展示一替代性設計，其中並非每一微型LED 141、142經連接至結構之最頂部處之共同電極。實情係，各層151、152之微型LED 141、142藉由定位於該特定層之頂部上之一結構167電連接至一共同電極164。在此實例中，藉由結構167R連接紅色微型LED 142R，藉由結構167G連接綠色微型LED 142G，且藉由結構167B連接藍色微型LED 141B。將不同微型LED 141、142連接至未彼此連接之共同電極容許微型LED的分離偏壓。
圖3係根據另一實施例之一整合式多色LED顯示器面板之若干像素之一截面視圖。在先前圖2中，藉由無機微型LED產生一個顏色(藍色)，且 藉由有機微型LED產生其他兩個顏色。在圖3中，藉由無機微型LED 141產生兩個顏色(藍色及紅色)且藉由有機微型LED 142產生第三顏色(綠色)。在此實例中，在單獨層151B、151R中製造不同顏色無機LED 141B、141R，故存在三個總層151、152。無機LED 141B、141R具有上接觸金屬墊146及下接觸金屬墊148。視需要使用通孔147、149，將一個下接觸金屬墊148連接至像素驅動器110且將另一上接觸金屬墊146連接至共同電極165。有機微型LED 142G具有連接至像素驅動器110之下接觸金屬墊148。因為有機微型LED在頂部層152中，故LED之上側可直接連接至共同電極165。
圖2及圖3中展示之結構可如下般製造。首先，在基板102上製造像素驅動器110。接著製造含有無機微型LED 141之層151，其中每層一個顏色。藉由首先將未經圖案化磊晶層接合至現有結構，將磊晶層圖案化為個別微型LED且將接合金屬層圖案化為個別墊，且接著製造通孔且填充及平坦化層而製造各層。將圖3之結構用作一實例，無機藍色微型LED之層151B如下般製造。首先，將金屬接合層添加至藍色微型LED 141B之未經圖案化磊晶層及添加至接觸像素驅動器之基板。此等用於將磊晶層接合至基板，從而形成與像素驅動器之電接觸。在移除磊晶基板之後，圖案化磊晶層及金屬接合層以形成個別微型LED 141B及下接觸金屬墊148。亦添加上接觸金屬墊146。添加且平坦化填充材料153。製造通孔147、149。重複此程序以形成無機紅色微型LED之層151R。至於更多細節，見國際專利申請案第PCT/US2018/023172號，「Making Semiconductor Devices by Stacking Strata of Micro LEDS」，該案之全部內容以引用之方式併入本文中。
在製造所有無機層151之後，製造含有所有有機微型LED 142之一單一頂部層152。使用旋塗法逐層沈積包含電子注射材料、電子傳輸材料、具有不同摻雜劑之發射層、電洞傳輸材料及電洞注射材料之有機LED層以在垂直方向上形成二極體結構。接著，將有機LED層圖案化且蝕刻成個別臺面。此後，塗佈另一絕緣聚合物材料以用於平坦化。接觸窗在其中存在其他層之通孔之有機LED臺面及區域之頂部中敞開。最後，沈積頂部共同電極(亦可被稱為共同陰極觸點)165。
在一替代性方法中，可在與無機微型LED相同之層中製造有機微型LED。圖4展示此一設計。此處，首先在基板102及像素驅動器110B之頂部上製造藍色無機微型LED 141B。接著在此等之後製造紅色及綠色有機微型LED 142，其等經定位於藍色LED之間。一共同電極165經電連接至微型LED 141、142。不存在單獨之層或通過層之通孔。
在圖2至圖4中，共同電極165可為一(不透明)金屬跡線網格，如在圖5A中展示。圖5A係向下看裝置之一俯視圖。圖5A展示由大正方形表示之三個微型LED 140R、140G、140B。此等微型LED之各者具有將微型LED之頂部電連接至層堆疊之頂部之通孔及金屬墊之一結構(亦可被稱為互連件)143。此等在圖5A中藉由小正方形表示通孔/金屬墊之一結構143。藉由長矩形表示之共同電極165係充當電連接至通孔及金屬墊之一結構143之共同陰極之一金屬跡線。
或者，共同電極165可為一透明電極，諸如銦錫氧化物，如在圖5B中展示。圖5B亦係展示微型LED 140R、140G、140B及其等互連件143之一俯視圖。在此實例中，共同電極165係由邊界界定之整個矩形。覆蓋全部微型LED係可接受的，此係因為共同電極165係透明的。矩形圓環164係 連接至電路之共同陰極金屬墊。注意，共同電極165在所有層上方，而金屬墊164在所有層下方。共同電極165及金屬墊164藉由通孔163電連接。
圖6繪示提供不同像素之光學隔離之額外結構。在此實例中，紅色、綠色及藍色像素經分組成多色像素610且層中之一結構作用以光學分離相鄰像素。此可降低相鄰多色像素610之間的串擾。在圖6中，結構係一不透明(吸收性)分隔件之網格622。或者，結構622可為反射性的，其亦可作用以增大微型LED之光產生之方向性及效率。各微型LED之下接觸金屬墊亦可係反射性的。
圖7係根據一項實施例之一例示性微型LED顯示器面板700之一俯視圖。顯示器面板700包含一資料介面710、一控制模組720及一像素區740。資料介面710接收界定待顯示之影像之資料。此資料之(若干)來源及格式將取決於應用而變化。控制模組720接收傳入資料且將其轉換為適用於驅動顯示器面板中之像素之一形式。控制模組720可包含用以從所接收之格式轉換成適用於像素區740之一個格式之數位邏輯及/或狀態機、用以儲存且傳送資料之移位暫存器或其他類型之緩衝器及記憶體、數位至類比轉換器及位準移位器及包含時脈電路之掃描控制器。
像素區740包含一像素陣列。像素包含與(例如)如上文描述之像素驅動器單石整合之微型LED 734。在此實例中，顯示器面板700係一彩色RGB顯示器面板。該面板包含配置成行之紅色、綠色及藍色像素。行732R係紅色像素，行732G係綠色像素且行732B係藍色像素。在各像素內，由一像素驅動器控制一LED 734。根據先前展示之實施例，像素經由一接地墊736接觸一供應電壓(未展示)及接地，且亦接觸一控制信號。雖然未在圖7中展示，但LED之p電極及驅動電晶體之輸出經定位於LED 734 下方，且其等藉由接合金屬電連接。根據先前描述之各種實施例製作LED電流驅動信號連接(在LED之p電極與像素驅動器之輸出之間)、接地連接(在n電極與系統接地之間)、Vdd連接(在像素驅動器之源極與系統Vdd之間)及至像素驅動器之閘極之控制信號連接。
圖7僅係一代表圖。將瞭解其他設計。例如，顏色不必係紅色、綠色及藍色，且不必存在相等數目個各顏色像素。其等亦不必配置成行或條帶。一組四個顏色像素可經配置為(例如)一2x2正方形。個別像素單元亦可經配置以共用列或行定址，因此減少列或行跡線之總數。作為一個實例，除了在圖7中展示之一正方形像素矩陣之配置外，亦可使用六邊形像素矩陣之一配置來形成顯示器面板700。
在一些應用中，一完全可程式化矩形像素陣列係不必要的。亦可使用本文描述之裝置結構來形成具有各種形狀及顯示器之其他設計之顯示器面板。一類實例係特殊應用，包含標牌(signage)及汽車。例如，多個像素可經配置成一星形或一螺旋形之形狀以形成一顯示器面板，且可藉由開啟且關閉LED而產生顯示器面板上之不同圖案。另一特殊實例係汽車頭燈及智慧型照明，其中特定像素經分組在一起以形成各種照明形狀且可藉由個別像素驅動器開啟或關閉或以其他方式調整各群組之LED像素。
甚至各像素內之裝置之側向配置亦可變化。在圖2至圖4中，LED及像素驅動器經垂直配置。各LED經定位於對應像素驅動器電路之「頂部上」。其他配置係可能的。例如，像素驅動器亦可經定位於LED之「後方」、「前方」或「旁邊」。
可製造不同類型之顯示器面板。例如，一顯示器面板之解析度可通常在8x8至3840x2160之範圍中。常見顯示器解析度包含具有320x240解 析度及4：3之一縱橫比之QVGA、具有1024x768解析度及4：3之一縱橫比之XGA、具有1280x720解析度及16：9之一縱橫比之HD、具有1920x1080解析度及16：9之一縱橫比之FHD、具有3840x2160解析度及16：9之一縱橫比之UHD及具有4096x2160解析度之4K。亦可存在多種像素大小，範圍從次微米及更低至10mm及更高。總顯示器區之大小亦可大幅變化，對角線範圍從小至數十微米或更小至數百英吋或更大。
不同應用亦將具有針對光學亮度之不同要求。例示性應用包含直接觀看顯示器螢幕、家庭/辦公室投影儀之光引擎及便攜式電子設備(諸如智慧型電話、膝上型電腦、可穿戴電子設備及視網膜投影)。功率消耗可從小至針對視網膜投影儀之幾毫瓦變化至高達針對大型螢幕室外顯示器、投影儀及智慧型汽車頭燈之數千瓦。在圖框速率方面，歸因於無機LED之快速回應(奈秒)，圖框速率可高達KHz，或甚至針對小解析度之MHz。
雖然實施方式含有許多細節，但此等不應被解釋為限制本發明之範疇，而僅被解釋為繪示本發明之不同實例及態樣。應瞭解，本發明之範疇包含未在上文詳細論述之其他實施例。例如，上文描述之方法可應用於除LED外之功能裝置與除像素驅動器外之控制電路的整合。非LED裝置之實例包含垂直腔表面發射雷射(VCSEL)、光偵測器、微機電系統(MEMS)、矽光子裝置、功率電子裝置及分散式回饋雷射(DFB)。其他控制電路之實例包含電流驅動器、電壓驅動器、轉阻放大器及邏輯電路。
可在不背離如在隨附發明申請專利範圍中定義之本發明之精神及範疇之情況下對在本文中揭示之本發明之方法及設備之配置、操作及細節做出熟習此項技術者將明白之各種其他修改、改變及變化。因此，本發明之範疇應藉由隨附發明申請專利範圍及其等合法等效物判定。
102:支撐基板
110B:像素驅動器
110G:像素驅動器
110R:像素驅動器
141B:無機微型LED
141R:無機微型LED
142G:有機微型LED
142R:有機微型LED
146:上接觸金屬墊
147:通孔
148:下接觸金屬墊
149:通孔
151:底部層/層/中介層/無機層
152:頂部層/層/有機層
153:填充材料/填充物
154:材料/填充物
157:介面
165:共同電極/共同陰極觸點

Claims (16)

  1. 一種整合式多色微型LED顯示器晶片，其包括：一基板；一像素驅動器陣列，其由該基板支撐；及複數個不同顏色微型LED陣列，其等由該基板支撐且經電連接至該像素驅動器陣列，其中該複數個不同顏色微型LED陣列之至少一者包括一第一顏色之有機微型LED且該複數個不同顏色微型LED陣列之另一者包括一不同顏色之無機微型LED，其中該複數個不同顏色微型LED陣列經配置成堆疊於該基板及該像素驅動器陣列之頂部上之兩個或兩個以上層，其中一平坦介面在相鄰層之間，且一相同顏色之所有微型LED包含在該等層之一者中，其中含有無機微型LED之各層包括：下接觸金屬墊，其等經電連接至該複數個不同顏色微型LED陣列之一底部；及上接觸金屬墊，其等經電連接至該複數個不同顏色微型LED陣列之一頂部；其中該等下接觸金屬墊亦經電連接至該像素驅動器陣列且該等上接觸金屬墊亦經電連接至一共同電極；及其中該共同電極包含所有該等層之頂部上之一頂部層，各上接觸金屬墊藉由穿過任何中介層之通孔電連接至該頂部層。
  2. 一種整合式多色微型LED顯示器晶片，其包括： 一基板；一像素驅動器陣列，其由該基板支撐；及複數個不同顏色微型LED陣列，其等由該基板支撐且經電連接至該像素驅動器陣列，其中該複數個不同顏色微型LED陣列之至少一者包括一第一顏色之有機微型LED且該複數個不同顏色微型LED陣列之另一者包括一不同顏色之無機微型LED，其中該複數個不同顏色微型LED陣列經配置成堆疊於該基板及該像素驅動器陣列之頂部上之兩個或兩個以上層，其中一平坦介面在相鄰層之間，且一相同顏色之所有微型LED包含在該等層之一者中，其中含有無機微型LED之各層包括：下接觸金屬墊，其等經電連接至該複數個不同顏色微型LED陣列之一底部；及上接觸金屬墊，其等經電連接至該複數個不同顏色微型LED陣列之一頂部；其中該等下接觸金屬墊亦經電連接至該像素驅動器陣列且該等上接觸金屬墊亦經電連接至一共同電極；及其中該共同電極包括定位在該各層之頂部上之針對該層之一單獨共同電極結構，該各層之各上接觸金屬墊經電連接至該層之該共同電極結構。
  3. 一種整合式多色微型LED顯示器晶片，其包括：一基板；一像素驅動器陣列，其由該基板支撐；及 複數個不同顏色微型LED陣列，其等由該基板支撐且經電連接至該像素驅動器陣列，其中該複數個不同顏色微型LED陣列之至少一者包括一第一顏色之有機微型LED且該複數個不同顏色微型LED陣列之另一者包括一不同顏色之無機微型LED，其中該複數個不同顏色微型LED陣列經配置成堆疊於該基板及該像素驅動器陣列之頂部上之兩個或兩個以上層，其中一平坦介面在相鄰層之間，且一相同顏色之所有微型LED包含在該等層之一者中；及其中不同層之該等微型LED經分組成多色像素，且該微型LED顯示器晶片進一步包括：該等層中之一結構，其光學分離相鄰之多色像素。
  4. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中該複數個不同顏色微型LED陣列包括一紅色微型LED陣列、一綠色微型LED陣列及一藍色微型LED陣列。
  5. 如請求項4之整合式多色微型LED顯示器晶片，其中該藍色微型LED陣列係一無機微型LED陣列，且該紅色微型LED陣列及該綠色微型LED陣列係有機微型LED陣列。
  6. 如請求項5之整合式多色微型LED顯示器晶片，其中該藍色微型LED陣列係一基於GaN之無機微型LED陣列。
  7. 如請求項4之整合式多色微型LED顯示器晶片，其中該藍色微型LED 陣列及該紅色微型LED陣列係無機微型LED陣列，且該綠色微型LED陣列係一有機微型LED陣列。
  8. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中該複數個不同顏色微型LED陣列係紫外線、藍色、綠色、橙色、紅色或紅外線微型LED陣列。
  9. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中各層僅含有無機微型LED或僅含有有機微型LED，而非同時含有兩者。
  10. 如請求項9之整合式多色微型LED顯示器晶片，其中含有無機微型LED之該(等)層在該堆疊之一底部處，且含有有機微型LED之該(等)層在該堆疊之一頂部處。
  11. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中含有無機微型LED之各(諸)層含有僅一單一顏色之無機微型LED。
  12. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中所有有機微型LED包含在一單一層中。
  13. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中所有該複數個不同顏色微型LED陣列經垂直定位於該基板及該像素驅動器陣列上方之一單一層中。
  14. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中該等有機LED微型LED和該等無機LED微型LED在任何側向尺寸上不大於50微米。
  15. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中各顏色之該複數個不同顏色微型LED陣列具有至少15%之一外部量子效率。
  16. 如請求項1至3中任一項之整合式多色微型LED顯示器晶片，其中該像素驅動器陣列包括薄膜電晶體像素驅動器或矽CMOS像素驅動器。
TW107112762A 2017-04-13 2018-04-13 Led-oled混合自發光顯示器 TWI774751B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762484979P 2017-04-13 2017-04-13
US62/484,979 2017-04-13

Publications (2)

Publication Number Publication Date
TW201842487A TW201842487A (zh) 2018-12-01
TWI774751B true TWI774751B (zh) 2022-08-21

Family

ID=63793662

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107112762A TWI774751B (zh) 2017-04-13 2018-04-13 Led-oled混合自發光顯示器

Country Status (10)

Country Link
US (1) US11380738B2 (zh)
EP (1) EP3610476B1 (zh)
JP (1) JP7154227B2 (zh)
KR (1) KR102318335B1 (zh)
CN (1) CN111133499B (zh)
AU (1) AU2018250698B2 (zh)
MY (1) MY201336A (zh)
SG (1) SG11201909518YA (zh)
TW (1) TWI774751B (zh)
WO (1) WO2018191551A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020057749A (ja) * 2018-09-26 2020-04-09 ナイトライド・セミコンダクター株式会社 Ｕｖ−ｌｅｄ及びディスプレイ
CN109461386A (zh) * 2019-01-04 2019-03-12 京东方科技集团股份有限公司 显示装置
TWI685829B (zh) * 2019-02-21 2020-02-21 友達光電股份有限公司 顯示裝置
US11552163B2 (en) * 2019-02-22 2023-01-10 Vuereal Inc. Staggered and tile stacked microdevice integration and driving
TWI793318B (zh) * 2019-05-03 2023-02-21 優顯科技股份有限公司 微半導體堆疊結構、及其電子裝置
US11610874B2 (en) * 2019-06-27 2023-03-21 Intel Corporation Micro light-emitting diode displays having hybrid inorganic-organic pixel structures
CN110828379A (zh) * 2019-10-15 2020-02-21 深圳大学 一种薄膜晶体管的制造方法、薄膜晶体管及显示面板
EP4078567A1 (en) * 2019-12-20 2022-10-26 Lumileds LLC Failure detection and correction for led arrays
EP3968373A1 (en) * 2020-09-09 2022-03-16 Lumileds LLC Low z-height led array package having tsv support structure
US20220140217A1 (en) * 2020-10-30 2022-05-05 Raysolve Optoelectronics (Suzhou) Company Limited Light emitting diode structure and method for manufacturing the same
WO2022094718A1 (en) * 2020-11-05 2022-05-12 Vuereal Inc. Dual microdevice driving
CN112670324A (zh) * 2020-12-22 2021-04-16 南昌大学 一种发光二极管显示装置的器件结构
CN113053254A (zh) * 2021-03-05 2021-06-29 武汉华星光电技术有限公司 显示面板及其制作方法、显示装置
US20240170625A1 (en) * 2021-04-07 2024-05-23 Apple Inc. Display Systems Having Vertical Light-Emitting Diodes
US11900859B2 (en) 2021-05-21 2024-02-13 Lumileds Llc Active matrix hybrid microLED display
CN114023269B (zh) * 2021-10-14 2023-04-14 厦门中莘光电科技有限公司 单片集成光信号接收模块的Mini/Micro-LED驱动芯片
CN114779471B (zh) * 2022-03-24 2024-05-28 闽都创新实验室 基于纳米像元阵列的眼机接口及其工作方法
CN114822378B (zh) * 2022-03-28 2023-11-14 南昌大学 一种全彩led器件控制方法
CN114843317A (zh) * 2022-04-11 2022-08-02 湖南大学 一种无机-有机led混合彩色显示器件及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102630349A (zh) * 2009-09-18 2012-08-08 天空公司 功率发光二极管及利用电流密度操作的方法
US20160064363A1 (en) * 2014-08-26 2016-03-03 X-Celeprint Limited Micro assembled hybrid displays and lighting elements
US20160163940A1 (en) * 2014-12-05 2016-06-09 Industrial Technology Research Institute Package structure for light emitting device
US20170064291A1 (en) * 2015-08-31 2017-03-02 Samsung Display Co., Ltd. Display apparatus, head-mounted display apparatus, image display method, and image display system
CN106549034A (zh) * 2015-09-18 2017-03-29 环球展览公司 混合型显示器

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5703436A (en) * 1994-12-13 1997-12-30 The Trustees Of Princeton University Transparent contacts for organic devices
JP4210609B2 (ja) * 2003-02-20 2009-01-21 バルコ・ナムローゼ・フエンノートシャップ マルチカラーｏｌｅｄ画素構造、画素構造のアレイ、およびマルチカラーｏｌｅｄ画素構造製造方法
US20050100657A1 (en) * 2003-11-10 2005-05-12 Macpherson Charles D. Organic material with a region including a guest material and organic electronic devices incorporating the same
US7268006B2 (en) * 2004-12-30 2007-09-11 E.I. Du Pont De Nemours And Company Electronic device including a guest material within a layer and a process for forming the same
JP4600257B2 (ja) * 2005-11-25 2010-12-15 ソニー株式会社 導光板、バックライト装置とその製造方法及び液晶表示装置
US20080238297A1 (en) * 2007-03-29 2008-10-02 Masuyuki Oota Organic el display and method of manufacturing the same
US7623560B2 (en) * 2007-09-27 2009-11-24 Ostendo Technologies, Inc. Quantum photonic imagers and methods of fabrication thereof
US9048404B2 (en) * 2009-07-06 2015-06-02 Zhuo Sun Thin flat solid state light source module
JP2011118139A (ja) * 2009-12-03 2011-06-16 Toppan Printing Co Ltd カラーフィルタ基板および液晶表示装置
US8642363B2 (en) 2009-12-09 2014-02-04 Nano And Advanced Materials Institute Limited Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
GB2496183A (en) 2011-11-05 2013-05-08 Optovate Ltd Illumination apparatus
EP2626901A1 (en) * 2012-02-10 2013-08-14 Oki Data Corporation Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus
US9726887B2 (en) * 2012-02-15 2017-08-08 Microsoft Technology Licensing, Llc Imaging structure color conversion
US9443833B2 (en) 2013-01-31 2016-09-13 Nthdegree Technologies Worldwide Inc. Transparent overlapping LED die layers
US8970131B2 (en) * 2013-02-15 2015-03-03 Cree, Inc. Solid state lighting apparatuses and related methods
US8987765B2 (en) * 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) * 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US10062738B2 (en) * 2013-11-27 2018-08-28 The Regents Of The University Of Michigan Devices combining thin film inorganic LEDs with organic LEDs and fabrication thereof
EP3084338A4 (en) 2013-12-18 2017-07-26 Leupold & Stevens, Inc. Micro-pixelated led reticle display for optical aiming devices
US9450147B2 (en) * 2013-12-27 2016-09-20 Apple Inc. LED with internally confined current injection area
JP2015195244A (ja) * 2014-03-31 2015-11-05 ソニー株式会社 半導体ユニット、半導体素子、発光装置、表示装置、半導体素子の製造方法
CN110010750B (zh) 2014-06-18 2021-11-09 艾克斯展示公司技术有限公司 微组装led显示器
JP6773453B2 (ja) * 2015-05-26 2020-10-21 株式会社半導体エネルギー研究所 記憶装置及び電子機器
TWI665800B (zh) * 2015-06-16 2019-07-11 友達光電股份有限公司 發光二極體顯示器及其製造方法
TW201703248A (zh) * 2015-07-06 2017-01-16 友達光電股份有限公司 畫素結構及其製造方法
US10380930B2 (en) * 2015-08-24 2019-08-13 X-Celeprint Limited Heterogeneous light emitter display system
GB2544728B (en) * 2015-11-17 2020-08-19 Facebook Tech Llc Redundancy in inorganic light emitting diode displays
US9368549B1 (en) 2015-09-02 2016-06-14 Nthdegree Technologies Worldwide Inc. Printed mesh defining pixel areas for printed inorganic LED dies
US10304811B2 (en) * 2015-09-04 2019-05-28 Hong Kong Beida Jade Bird Display Limited Light-emitting diode display panel with micro lens array
US10032757B2 (en) * 2015-09-04 2018-07-24 Hong Kong Beida Jade Bird Display Limited Projection display system
US10665578B2 (en) * 2015-09-24 2020-05-26 Apple Inc. Display with embedded pixel driver chips
US10230048B2 (en) 2015-09-29 2019-03-12 X-Celeprint Limited OLEDs for micro transfer printing
KR20170059068A (ko) * 2015-11-19 2017-05-30 삼성전자주식회사 광원 모듈, 디스플레이 패널 및 이를 구비한 디스플레이 장치
US10079264B2 (en) * 2015-12-21 2018-09-18 Hong Kong Beida Jade Bird Display Limited Semiconductor devices with integrated thin-film transistor circuitry
US10068888B2 (en) * 2015-12-21 2018-09-04 Hong Kong Beida Jade Bird Display Limited Making semiconductor devices with alignment bonding and substrate removal
KR102476137B1 (ko) * 2016-02-25 2022-12-12 삼성전자주식회사 발광소자 패키지의 제조 방법
JP2017162942A (ja) * 2016-03-08 2017-09-14 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
CN105742307B (zh) * 2016-04-26 2018-03-27 张希娟 一种彩色微显示器件及制备方法
US20170323871A1 (en) * 2016-05-05 2017-11-09 Everlight Electronics Co., Ltd. Light-emitting diode display apparatus
US9997501B2 (en) * 2016-06-01 2018-06-12 X-Celeprint Limited Micro-transfer-printed light-emitting diode device
US20180033768A1 (en) * 2016-07-26 2018-02-01 Ananda H. Kumar Flat panel display formed by self aligned assembly
CN205944093U (zh) 2016-08-19 2017-02-08 京东方科技集团股份有限公司 阵列基板及显示装置
US9980341B2 (en) * 2016-09-22 2018-05-22 X-Celeprint Limited Multi-LED components
US10304375B2 (en) * 2016-09-23 2019-05-28 Hong Kong Beida Jade Bird Display Limited Micro display panels with integrated micro-reflectors
WO2018064805A1 (en) * 2016-10-08 2018-04-12 Goertek. Inc Display device and electronics apparatus
US10714363B2 (en) * 2016-12-06 2020-07-14 Facebook Technologies, Llc Picking up and placing of micro light emitting diodes using polygon tool
US10325893B2 (en) * 2016-12-13 2019-06-18 Hong Kong Beida Jade Bird Display Limited Mass transfer of micro structures using adhesives
US10445048B2 (en) * 2016-12-30 2019-10-15 Shaoher Pan Larger displays formed by multiple integrated LED array micro-displays
US10483434B2 (en) * 2017-01-03 2019-11-19 Innolux Corporation Display devices and methods for forming display devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102630349A (zh) * 2009-09-18 2012-08-08 天空公司 功率发光二极管及利用电流密度操作的方法
US20160064363A1 (en) * 2014-08-26 2016-03-03 X-Celeprint Limited Micro assembled hybrid displays and lighting elements
TW201611257A (zh) * 2014-08-26 2016-03-16 艾克斯瑟樂普林特有限公司 微組合複合式顯示裝置及發光元件
US20160163940A1 (en) * 2014-12-05 2016-06-09 Industrial Technology Research Institute Package structure for light emitting device
US20170064291A1 (en) * 2015-08-31 2017-03-02 Samsung Display Co., Ltd. Display apparatus, head-mounted display apparatus, image display method, and image display system
CN106549034A (zh) * 2015-09-18 2017-03-29 环球展览公司 混合型显示器

Also Published As

Publication number Publication date
KR102318335B1 (ko) 2021-10-28
TW201842487A (zh) 2018-12-01
CN111133499B (zh) 2023-08-01
SG11201909518YA (en) 2019-11-28
EP3610476B1 (en) 2022-10-12
MY201336A (en) 2024-02-17
WO2018191551A1 (en) 2018-10-18
AU2018250698B2 (en) 2022-05-26
KR20200015474A (ko) 2020-02-12
JP2020516947A (ja) 2020-06-11
JP7154227B2 (ja) 2022-10-17
US11380738B2 (en) 2022-07-05
EP3610476A1 (en) 2020-02-19
AU2018250698A1 (en) 2019-10-31
EP3610476A4 (en) 2020-11-11
US20210202616A1 (en) 2021-07-01
CN111133499A (zh) 2020-05-08

Similar Documents

Publication Publication Date Title
TWI774751B (zh) Led-oled混合自發光顯示器
JP7209634B2 (ja) マイクロｌｅｄの階層を積み重ねることによる半導体デバイスの作製
EP3394892B1 (en) Making an integrated led display with alignment bonding and substrate removal
KR102295569B1 (ko) 접착제를 사용하는 마이크로 구조의 물질 이동
TWI702585B (zh) 具有積體薄膜電晶體電路之半導體裝置
TWI603466B (zh) 帶有基結線之主動矩陣顯示面板
TW202145601A (zh) 具有堆疊接合結構之多彩發光二極體(led)之系統及方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent