TWI773753B - 用於半導體處理期間之微波空腔中均勻熱分布的方法及設備 - Google Patents

用於半導體處理期間之微波空腔中均勻熱分布的方法及設備 Download PDF

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TWI773753B
TWI773753B TW107114980A TW107114980A TWI773753B TW I773753 B TWI773753 B TW I773753B TW 107114980 A TW107114980 A TW 107114980A TW 107114980 A TW107114980 A TW 107114980A TW I773753 B TWI773753 B TW I773753B
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Taiwan
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microwave
cavity
phase shifter
signals
microwave signal
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TW107114980A
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Chinese (zh)
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TW201907506A (zh
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皮瑞森 羅
丹尼斯 伊凡諾夫
安恩克斯納 朱普迪
岳生 歐
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美商應用材料股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/6402—Aspects relating to the microwave cavity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/66—Circuits
    • H05B6/664—Aspects related to the power supply of the microwave heating apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/705—Feed lines using microwave tuning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/70—Feed lines
    • H05B6/707—Feed lines using waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/64—Heating using microwaves
    • H05B6/80—Apparatus for specific applications
    • H05B6/806—Apparatus for specific applications for laboratory use

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Clinical Laboratory Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Control Of High-Frequency Heating Circuits (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW107114980A 2017-05-03 2018-05-03 用於半導體處理期間之微波空腔中均勻熱分布的方法及設備 TWI773753B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762500609P 2017-05-03 2017-05-03
US62/500,609 2017-05-03
US15/966,211 US20180323091A1 (en) 2017-05-03 2018-04-30 Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing
US15/966,211 2018-04-30

Publications (2)

Publication Number Publication Date
TW201907506A TW201907506A (zh) 2019-02-16
TWI773753B true TWI773753B (zh) 2022-08-11

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TW107114980A TWI773753B (zh) 2017-05-03 2018-05-03 用於半導體處理期間之微波空腔中均勻熱分布的方法及設備

Country Status (6)

Country Link
US (1) US20180323091A1 (enExample)
JP (1) JP7289267B2 (enExample)
KR (1) KR102540168B1 (enExample)
CN (1) CN110663108B (enExample)
TW (1) TWI773753B (enExample)
WO (1) WO2018204576A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112235003B (zh) * 2020-10-13 2022-01-14 大连海事大学 一种用于改变场分布的双路宽带信号装置
TWI834016B (zh) 2020-12-16 2024-03-01 財團法人工業技術研究院 頻率可重組相位陣列系統及其執行的材料處理方法
TWI820537B (zh) * 2021-04-26 2023-11-01 財團法人工業技術研究院 微波加熱方法與微波加熱裝置
TWI786015B (zh) * 2022-04-22 2022-12-01 宏碩系統股份有限公司 單源微波加熱裝置
DE102022127931A1 (de) * 2022-10-21 2024-05-02 TRUMPF Hüttinger GmbH + Co. KG Werkstückbehandlungsvorrichtung zur Behandlung eines Werkstücks mit einer Mikrowelle und Verfahren zur Behandlung des Werkstücks mit der Mikrowelle
JP2024099858A (ja) * 2023-01-13 2024-07-26 株式会社Kokusai Electric 基板処理装置、基板処理方法、半導体装置の製造方法およびプログラム
US20250027202A1 (en) * 2023-07-21 2025-01-23 Applied Materials, Inc. Methods of adjusting uniformity, and related apparatus and systems, for semiconductor manufacturing

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US20130008896A1 (en) * 2010-03-19 2013-01-10 Panasonic Corporation Microwave heating apparatus
US20140042152A1 (en) * 2012-08-08 2014-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Variable frequency microwave device and method for rectifying wafer warpage
CN104620354A (zh) * 2012-06-27 2015-05-13 新意技术股份有限公司 基板加热装置及处理腔室
US20150156827A1 (en) * 2012-07-02 2015-06-04 Goji Limited Rf energy application based on electromagnetic feedback
EP3151636A1 (en) * 2014-05-28 2017-04-05 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Semiconductor microwave oven and semiconductor microwave source thereof

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CA1053760A (en) * 1976-12-30 1979-05-01 Thomas E. Hester Power controller for microwave magnetron
JPS5830687B2 (ja) * 1977-03-16 1983-06-30 松下電器産業株式会社 調理器
JP3957135B2 (ja) * 2000-10-13 2007-08-15 東京エレクトロン株式会社 プラズマ処理装置
JP3839395B2 (ja) * 2002-11-22 2006-11-01 株式会社エーイーティー マイクロ波プラズマ発生装置
JP5064924B2 (ja) * 2006-08-08 2012-10-31 パナソニック株式会社 マイクロ波処理装置
JP2008060016A (ja) 2006-09-04 2008-03-13 Matsushita Electric Ind Co Ltd マイクロ波利用装置
JP5167678B2 (ja) * 2007-04-16 2013-03-21 パナソニック株式会社 マイクロ波処理装置
JP2010073383A (ja) 2008-09-17 2010-04-02 Panasonic Corp マイクロ波加熱装置
CN103533690A (zh) * 2012-07-05 2014-01-22 Nxp股份有限公司 自动调整工作频率的微波功率源和方法
JP2014032744A (ja) * 2012-08-01 2014-02-20 Panasonic Corp マイクロ波加熱装置
CN105120549B (zh) * 2015-09-02 2018-05-01 广东美的厨房电器制造有限公司 微波加热系统及其半导体功率源和加热控制方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130008896A1 (en) * 2010-03-19 2013-01-10 Panasonic Corporation Microwave heating apparatus
CN104620354A (zh) * 2012-06-27 2015-05-13 新意技术股份有限公司 基板加热装置及处理腔室
US20150156827A1 (en) * 2012-07-02 2015-06-04 Goji Limited Rf energy application based on electromagnetic feedback
US20140042152A1 (en) * 2012-08-08 2014-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Variable frequency microwave device and method for rectifying wafer warpage
EP3151636A1 (en) * 2014-05-28 2017-04-05 Guangdong Midea Kitchen Appliances Manufacturing Co., Ltd. Semiconductor microwave oven and semiconductor microwave source thereof

Also Published As

Publication number Publication date
KR102540168B1 (ko) 2023-06-02
WO2018204576A1 (en) 2018-11-08
TW201907506A (zh) 2019-02-16
US20180323091A1 (en) 2018-11-08
CN110663108B (zh) 2024-03-12
JP2020521275A (ja) 2020-07-16
CN110663108A (zh) 2020-01-07
JP7289267B2 (ja) 2023-06-09
KR20190138317A (ko) 2019-12-12

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