TWI771786B - 低介電質之聚醯亞胺薄膜及其製造方法 - Google Patents

低介電質之聚醯亞胺薄膜及其製造方法 Download PDF

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Publication number
TWI771786B
TWI771786B TW109137740A TW109137740A TWI771786B TW I771786 B TWI771786 B TW I771786B TW 109137740 A TW109137740 A TW 109137740A TW 109137740 A TW109137740 A TW 109137740A TW I771786 B TWI771786 B TW I771786B
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TW
Taiwan
Prior art keywords
mol
polyimide film
aforementioned
content
dianhydride
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TW109137740A
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English (en)
Chinese (zh)
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TW202118815A (zh
Inventor
趙珉相
白承烈
田珍碩
李吉男
Original Assignee
南韓商聚酰亞胺先端材料有限公司
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Publication of TW202118815A publication Critical patent/TW202118815A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
TW109137740A 2019-11-07 2020-10-30 低介電質之聚醯亞胺薄膜及其製造方法 TWI771786B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190141453A KR102347589B1 (ko) 2019-11-07 2019-11-07 저유전 폴리이미드 필름 및 그 제조방법
KR10-2019-0141453 2019-11-07

Publications (2)

Publication Number Publication Date
TW202118815A TW202118815A (zh) 2021-05-16
TWI771786B true TWI771786B (zh) 2022-07-21

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TW109137740A TWI771786B (zh) 2019-11-07 2020-10-30 低介電質之聚醯亞胺薄膜及其製造方法

Country Status (4)

Country Link
KR (1) KR102347589B1 (fr)
CN (1) CN114616269B (fr)
TW (1) TWI771786B (fr)
WO (1) WO2021091012A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102693903B1 (ko) 2021-11-25 2024-08-09 피아이첨단소재 주식회사 저유전 폴리아믹산 및 폴리이미드 필름
KR20230153791A (ko) * 2022-04-29 2023-11-07 피아이첨단소재 주식회사 저유전 및 고내열 특성을 가지는 폴리이미드 필름 및 그 제조방법
KR20240080791A (ko) * 2022-11-30 2024-06-07 피아이첨단소재 주식회사 폴리이미드 필름 및 그 제조방법
KR20240080595A (ko) 2022-11-30 2024-06-07 피아이첨단소재 주식회사 블렌딩된 폴리이미드 필름 및 이의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
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TW537967B (en) * 2001-03-29 2003-06-21 Ube Industries Surface treatment of polyimide film and polyimide film having a thin metal layer
TWI433813B (zh) * 2010-08-25 2014-04-11 Kaneka Corp 石墨膜及石墨膜之製造方法
TWI658069B (zh) * 2013-11-27 2019-05-01 日商宇部興產股份有限公司 聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板

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JP3676099B2 (ja) * 1998-12-01 2005-07-27 株式会社カネカ ポリイミドフィルムおよびその製造方法
JP4734837B2 (ja) * 2004-03-23 2011-07-27 宇部興産株式会社 接着性の改良されたポリイミドフィルム、その製造方法および積層体
CN1288194C (zh) * 2005-01-31 2006-12-06 南京工业大学 一种挠性印刷线路板用聚酰亚胺薄膜的制备方法
WO2006112523A1 (fr) * 2005-04-19 2006-10-26 Ube Industries, Ltd. Pellicule laminee polyimide
WO2008056808A1 (fr) * 2006-11-10 2008-05-15 Ube Industries, Ltd. Polyimide, composé diamine et leur procédé de production
CN101563395A (zh) * 2006-11-10 2009-10-21 宇部兴产株式会社 聚酰亚胺、二胺化合物及其制备方法
KR20090058851A (ko) * 2007-12-05 2009-06-10 주식회사 코오롱 폴리이미드 필름
JP5870396B2 (ja) * 2011-07-14 2016-03-01 東レ・デュポン株式会社 ポリイミドフィルム
KR101506611B1 (ko) 2013-03-19 2015-03-27 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
KR101375276B1 (ko) 2013-03-27 2014-03-19 주식회사 이녹스 슬립성이 우수한 열가소성 폴리이미드 접착 필름을 이용한 적층판 제조 방법
JP6627510B2 (ja) * 2013-11-27 2020-01-08 宇部興産株式会社 ポリイミド前駆体組成物、ポリイミドの製造方法、ポリイミド、ポリイミドフィルム、及び基板
JP6568121B2 (ja) 2014-06-30 2019-08-28 コーロン インダストリーズ インク 表面改質複合シリカ粒子及びこれを含むポリイミドフィルム
US20160208097A1 (en) * 2015-01-15 2016-07-21 Rohm And Haas Electronic Materials Llc Polyimide compositions and methods
WO2019004677A1 (fr) * 2017-06-30 2019-01-03 에스케이씨코오롱피아이 주식회사 Composition de précurseur de polyimide, procédé de préparation associé et substrat de polyimide fabriqué à partir de celle-ci
KR101999926B1 (ko) * 2018-10-11 2019-07-12 에스케이씨코오롱피아이 주식회사 접착력이 우수한 폴리이미드 수지를 제조하기 위한 폴리아믹산 조성물 및 이로부터 제조된 폴리이미드 수지

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
TW537967B (en) * 2001-03-29 2003-06-21 Ube Industries Surface treatment of polyimide film and polyimide film having a thin metal layer
TWI433813B (zh) * 2010-08-25 2014-04-11 Kaneka Corp 石墨膜及石墨膜之製造方法
TWI658069B (zh) * 2013-11-27 2019-05-01 日商宇部興產股份有限公司 聚醯亞胺前驅體組成物、聚醯亞胺之製造方法、聚醯亞胺、聚醯亞胺膜及基板

Also Published As

Publication number Publication date
TW202118815A (zh) 2021-05-16
CN114616269A (zh) 2022-06-10
KR102347589B1 (ko) 2022-01-10
WO2021091012A1 (fr) 2021-05-14
KR20210055230A (ko) 2021-05-17
CN114616269B (zh) 2024-02-13

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