TWI771408B - 印刷電路板 - Google Patents
印刷電路板 Download PDFInfo
- Publication number
- TWI771408B TWI771408B TW107113928A TW107113928A TWI771408B TW I771408 B TWI771408 B TW I771408B TW 107113928 A TW107113928 A TW 107113928A TW 107113928 A TW107113928 A TW 107113928A TW I771408 B TWI771408 B TW I771408B
- Authority
- TW
- Taiwan
- Prior art keywords
- insulating
- cavity
- layer
- printed circuit
- circuit board
- Prior art date
Links
- 238000007747 plating Methods 0.000 claims abstract description 87
- 238000007772 electroless plating Methods 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000003112 inhibitor Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0153242 | 2017-11-16 | ||
| ??10-2017-0153242 | 2017-11-16 | ||
| KR1020170153242A KR102505443B1 (ko) | 2017-11-16 | 2017-11-16 | 인쇄회로기판 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201924494A TW201924494A (zh) | 2019-06-16 |
| TWI771408B true TWI771408B (zh) | 2022-07-21 |
Family
ID=66680238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107113928A TWI771408B (zh) | 2017-11-16 | 2018-04-25 | 印刷電路板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7059499B2 (ja) |
| KR (1) | KR102505443B1 (ja) |
| TW (1) | TWI771408B (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130010429A1 (en) * | 2009-09-09 | 2013-01-10 | Mitsubishi Materials Corporation | Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module |
| TW201630496A (zh) * | 2015-01-16 | 2016-08-16 | 臻鼎科技股份有限公司 | 具有散熱結構的電路板及其製作方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6009620A (en) * | 1998-07-15 | 2000-01-04 | International Business Machines Corporation | Method of making a printed circuit board having filled holes |
| JP2002164663A (ja) * | 2000-11-28 | 2002-06-07 | Hitachi Metals Ltd | ビルドアップコア基板、ビルドアップ配線基板、及びその製造方法 |
| JP2008140954A (ja) * | 2006-12-01 | 2008-06-19 | Matsushita Electric Ind Co Ltd | 放熱配線基板とその製造方法並びにこれを用いた発光モジュール |
| JP4962228B2 (ja) * | 2006-12-26 | 2012-06-27 | 株式会社ジェイテクト | 多層回路基板およびモータ駆動回路基板 |
| US8112884B2 (en) * | 2007-10-08 | 2012-02-14 | Honeywell International Inc. | Method for providing an efficient thermal transfer through a printed circuit board |
| KR100945953B1 (ko) * | 2007-11-23 | 2010-03-05 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
| KR101084342B1 (ko) | 2009-09-15 | 2011-11-17 | 안복만 | 방열 기판 |
| JP5940799B2 (ja) * | 2011-11-22 | 2016-06-29 | 新光電気工業株式会社 | 電子部品搭載用パッケージ及び電子部品パッケージ並びにそれらの製造方法 |
| KR20140003227A (ko) * | 2012-06-29 | 2014-01-09 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
| WO2014171004A1 (ja) * | 2013-04-19 | 2014-10-23 | 株式会社メイコー | プリント配線板及びその製造方法、並びに伝熱体 |
| JP6365106B2 (ja) * | 2014-08-18 | 2018-08-01 | 富士通株式会社 | 半導体装置及び半導体装置の製造方法 |
| KR20160073766A (ko) * | 2014-12-17 | 2016-06-27 | 삼성전기주식회사 | 연성 인쇄회로기판 및 그 제조 방법 |
| KR20170028710A (ko) * | 2015-09-04 | 2017-03-14 | 삼성전기주식회사 | 인쇄회로기판 및 인쇄회로기판의 제조방법 |
-
2017
- 2017-11-16 KR KR1020170153242A patent/KR102505443B1/ko active IP Right Grant
-
2018
- 2018-04-25 TW TW107113928A patent/TWI771408B/zh active
- 2018-05-02 JP JP2018088891A patent/JP7059499B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130010429A1 (en) * | 2009-09-09 | 2013-01-10 | Mitsubishi Materials Corporation | Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module |
| TW201630496A (zh) * | 2015-01-16 | 2016-08-16 | 臻鼎科技股份有限公司 | 具有散熱結構的電路板及其製作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201924494A (zh) | 2019-06-16 |
| JP2019091875A (ja) | 2019-06-13 |
| KR102505443B1 (ko) | 2023-03-03 |
| JP7059499B2 (ja) | 2022-04-26 |
| KR20190056126A (ko) | 2019-05-24 |
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