TWI771408B - Printed circuit board - Google Patents

Abstract

A printed circuit board in accordance with an aspect of the present invention includes: insulating layer; first cavity that is open through one surface of the insulating layer; insulation column formed in the first cavity in such a way that lateral surface thereof is separated from the insulating layer; and plating layer formed in regions excluding the insulation column in the first cavity.

Description

A printed circuit board

The present invention relates to a printed circuit board.

As electronic components mounted on printed circuit boards have become more compact and thinner, the heat dissipation properties of printed circuit boards containing fine patterns have become an important issue. Printed circuit boards including electronic components experience failures and defects above a certain temperature, and thus require heat dissipation structures to control failures and defects. Conventionally, through-hole type heat dissipation structures are fabricated through a fill plating process, but the area of the heat dissipation structures that can be fabricated through the fill plating process is limited.

The related art is described in Korean Patent Publication No. 10-2011-0029422 (March 23, 2011).

The present invention aims to provide a printed circuit board with a heat dissipation structure.

An aspect of the present invention provides a printed circuit board, which includes: an insulating layer; a first cavity opened through one surface of the insulating layer; An insulating layer is formed in the first cavity in a spaced manner; and a plating layer is formed in a region of the first cavity other than the insulating pillar.

Another aspect of the present invention provides a printed circuit board composed of a plurality of insulating layers stacked on top of each other. Each of the plurality of insulating layers includes: a cavity penetrating the insulating layer; insulating pillars formed in the cavity with side surfaces of the insulating pillars spaced from the insulating layer; and a plated layer formed in the cavity except for the insulating pillar.

The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatus and/or systems described herein. However, various changes, modifications and equivalents of the methods, apparatus and/or systems described herein will be apparent to those of ordinary skill in the art. The order of operations described herein is an example only, and is not limited to the order described herein, but may be performed as would be apparent to those of ordinary skill in the art, except that operations must occur in a certain order Change. Also, descriptions of functions and constructions that are well known to those of ordinary skill in the art may be omitted for increased clarity and conciseness.

The features described herein may be implemented in many different forms and should not be considered limited to the examples described herein. Rather, the examples described herein are provided so that this disclosure will be thorough and complete, and will convey the full scope of the disclosure to those of ordinary skill in the art.

Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. Any term defined in a common dictionary should be construed as having the same meaning in the context of the related art, and should not be construed as having an ideal or overly formal meaning unless explicitly defined otherwise.

Identical or corresponding elements will be given the same reference numerals regardless of figure numbering, and any redundant description of identical or corresponding elements will not be repeated. Throughout the description of the present disclosure, when it is determined to describe a certain related conventional technology to avoid the gist of the present disclosure, the related detailed description will be omitted. Terms such as "first" and "second" may be used in describing various elements, but the above elements should not be limited to the above terms. The above terms are only used to distinguish each element. In the drawings, some elements may be exaggerated, omitted or briefly described, and the dimensions of the elements do not necessarily reflect the actual dimensions of the elements.

Hereinafter, certain embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

FIG. 1 shows a printed circuit board according to one embodiment of the present invention. Fig. 2 is a cross-sectional view of the printed circuit board along the line A-A' shown in Fig. 1 . Fig. 3 is a cross-sectional view of the printed circuit board taken along the line B-B' shown in Fig. 1 . 4 to 10 illustrate a method of manufacturing a printed circuit board according to one embodiment of the present invention.

1 to 3 , a printed circuit board according to an embodiment includes an insulating layer 100 , a first cavity 200 , an insulating pillar 300 and a plating layer 400 .

The insulating layer 100 is made of an insulating material such as resin, and has a plate shape. The resin of the insulating layer 100 may be any of various resins (eg, thermosetting resin or thermoplastic resin), and specifically may be epoxy resin or polyimide. Here, for example, the epoxy resin may be, but not limited to: naphthalene type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, cresol novolac epoxy resin, rubber modified epoxy resin epoxy resin, cycloaliphatic epoxy resin, silicon type epoxy resin, nitrogen type epoxy resin or phosphorus type epoxy resin.

The insulating layer 100 may contain a stiffener, and the stiffener may be glass cloth or an inorganic filler (eg, silicon dioxide). The insulating layer 100 may be a prepreg (PPG) containing glass cloth therein or a build-up film (build-up film) containing an inorganic filler therein. An example of a build-up film may be Ajinomoto Build-up Film (ABF).

The insulating layer 100 may be made of materials with low dielectric constant (Dk) and dielectric dissipation factor (Df), such as liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polytetrafluoroethylene ( Phenyl ether (Polyphenylene Ether, PPE), Cyclo Olefin Polymer (Cyclo Olefin Polymer, COP) or perfluoroalkoxy resin (Perfluoroalkoxy, PFA).

The first cavity 200 is opened through one surface of the insulating layer 100 , and may not completely penetrate the insulating layer 100 in the thickness direction of the insulating layer 100 . Hereinafter, the case where the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 will be described, but the present invention should not be limited to the structure described herein. The first cavity 200 may be formed by (but not limited to) a computer numerical control (CNC) process, a laser process or a lithography process. The cavity 200 becomes the part in which the plating layer 400 will be received, as will be described later.

The insulating pillars 300 are formed in the first cavity 200 , and the side surfaces of the insulating pillars 300 are separated from the insulating layer 100 . That is, as shown in FIG. 2 , the insulating pillar 300 is formed in an island shape inside the first cavity 200 . The insulating pillars 300 may be formed in a plurality, and the plurality of insulating pillars 300 are spaced apart from each other.

Such insulating pillars 300 may be fabricated by removing regions other than the insulating pillars 300 from the insulating layer 100 when the first cavity 200 is formed. In this case, the insulating pillar 300 may be formed of the same material as the insulating layer 100 . In addition, the height of the insulating pillar 300 may be substantially the same as the thickness of the insulating layer 100 . Here, “substantially the same” is a concept including tolerance.

However, the insulating pillars 300 are not necessarily made of the same material as the insulating layer 100, and the insulating pillars 300 may be separately fabricated and then attached in the first cavity 200, in which case the insulating layer 100 and the insulating pillars 300 may be formed of different materials from each other.

The insulating pillar 300 is in the shape of a pillar having an upper surface and a lower surface, and the lower surface contacts the bottom portion of the first cavity 200 . In addition, the shapes of the upper and lower surfaces of the insulating pillar 300 are not limited to any specific shape, but may be any of various shapes including a rectangle, a circle, and a polygon. As shown in FIG. 1 , the shape of the lateral section of the insulating pillar 300 may include a vertex or a sharp corner, and each side of the lateral section of the insulating pillar 300 may be a curve. In the case where each side of the lateral cross-section of the insulating pillar 300 is curved, the side surface of the insulating pillar 300 may be a curved surface that is recessed toward the inside of the insulating pillar 300 .

The insulating column 300 adsorbs the plating inhibitor A (shown in FIG. 7 ) contained in the plating solution, and thus can suppress plating. Therefore, plating can be suppressed in the lateral direction in the first cavity 200 , but plating can be performed in the upward direction from the bottom surface of the first cavity 200 .

Preferably, the area (volume) of the first cavity 200 occupied by the insulating pillars 300 is extremely small, and this is to maximize the area (volume) of the plating layer 400 . In the case where each side of the lateral cross-section of the insulating pillar 300 is curved and the side surface of the insulating pillar 300 is a curved surface concave inward as described above, the insulating pillar 300 may have sharp corners and have an extremely small area (volume). In addition, the adsorption ratio of the plating inhibitor A can be increased at these sharp corners.

The plating layer 400 is formed in the first cavity 200 and filled in the first cavity 200 except at the insulating pillars 300 . The plating layer 400 may be made of metal, especially a metal with high thermal conductivity, to improve heat dissipation properties. Alternatively, the plating layer 400 may be made of the same metal as the circuitry of the printed circuit board.

The plating layer 400 may include a seed layer formed by electroless plating and having a thickness of 2 micrometers (um) or less in the electroless plating layer 410 . In addition, the plating layer 400 may include a plating layer 420 formed on the electroless plating layer 410 . A seed layer (electroless plating layer 410 ) is formed on the entire side surface and bottom portion of the first cavity 200 and on the entire side surface of the insulating pillar 300 , and the plating layer 420 is formed using the electroless plating layer 410 as a lead. -in wire) and formed by electroplating.

The volume occupied by the plating layer 400 in the first cavity 200 is significantly larger than the volume occupied by the insulating pillars 300 . Even considering the lateral cross-sectional area, the area occupied by the plating layer 400 is much larger than the area occupied by the insulating pillars 300 . This is because the plating layer 400 plays a role of heat dissipation, and the insulating pillar 300 is a structure for helping to form the plating layer 400 and thus requires an extremely small area.

Meanwhile, the printed circuit board according to an embodiment of the present invention may further include the second cavity 500 and the electronic device 600 .

The second cavity 500 opens toward the other surface of the insulating layer 100 and is placed on the opposite side of the first cavity 200 . The first cavity 200 occupies a portion of the thickness of the insulating layer 100, and the second cavity 500 occupies the remaining portion of the thickness of the insulating layer 100, and the first cavity 200 and the second cavity 500 are formed to overlap (ie, connect) each other . The lateral cross-sectional area of the first cavity 200 may be the same as the lateral cross-sectional area of the second cavity 500 , or the lateral cross-sectional area of the first cavity 200 may be larger than that of the second cavity 500 . When the first cavity 200 and the second cavity 500 are adjacent to each other, the second cavity 500 is in contact with the plating layer 400 . Therefore, the plating layer 400 formed in the first cavity 200 and the electronic device 600 mounted in the second cavity 500 are in contact with each other, and thus the heat generated by the electronic device 600 can be dissipated by the plating layer 400 .

The electronic device 600 is a device installed in the second cavity 500, and may, for example, include passive devices, active devices, and integrated circuits. In the case where the electronic device 600 is mounted in the second cavity 500 using an adhesive, the electronic device 600 may be in contact with the plated layer 400 using the adhesive between the electronic device 600 and the plated layer 400 . In this case, the adhesive may be a conductive adhesive with high thermal conductivity.

Hereinafter, a method of manufacturing a printed circuit board according to an embodiment of the present invention will be explained with reference to FIGS. 4 to 10 .

Referring to FIG. 4 , a first cavity 200 and an insulating pillar 300 are formed on the insulating layer 100 . The first cavity 200 and the insulating pillar 300 can be formed by, for example, a computer numerical control process or a laser process, and the first cavity 200 can be formed by processing a portion other than the insulating pillar 300 . Furthermore, in the case where the insulating layer 100 is photosensitive, the first cavity 200 may be formed by a lithography process including exposure and development.

Fig. 5 is a cross-sectional view taken along line C-C' of Fig. 4 . Figures 6 to 10 show the C-C' section. Referring to FIG. 5 , the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction rather than completely penetrates the insulating layer 100 , and the side surfaces of the insulating pillars 300 are separated from the insulating layer 100 , and a plurality of insulating pillars 300 are disposed separated from each other.

Referring to FIG. 6, an electroless plating layer 410 is formed as a seed layer. The electroless plating layer 410 is formed on the side surfaces and the bottom portion of the first cavity 200 and the side surfaces of the insulating pillar 300 and one surface of the insulating layer 100 . That is, the electroless plating layer 410 is formed on each surface of the insulating layer 100 on which the first cavity 200 and the insulating pillar 300 are formed. Electroless plating layer 410 may be made of metal such as copper or titanium.

Referring to FIG. 7 , a plating layer 420 is formed on the electroless plating layer 410 in the first cavity 200 . The plating layer 420 may be formed by electroplating, and may be made of metal such as copper. The plating solution for forming the electroless plating layer 410 contains a plating inhibitor A therein to suppress the formation of the electroless plating layer 410 at a specific area. Most of the plating inhibitor A is adsorbed to the surface of the insulating layer 100 and the surface of the insulating pillar 300 located on one surface of the insulating layer 100 (the upper surface of the insulating layer 100 and the upper surface of the insulating pillar 300 in FIG. 7 ), And it is hardly adsorbed to the inside of the first cavity 200 . This is because the adsorption ratio of the plating inhibitor A is higher on the surface of the insulating layer 100 that first comes into contact with the plating solution, and becomes lower as the plating solution enters deeper into the first cavity 200 .

Therefore, as shown in FIG. 7 , the plating inhibitor A is adsorbed to one surface of the insulating layer 100 and the surface of the insulating pillar 300 except for its (most) side surfaces, during this process, the plating inhibitor Some of A may be adsorbed to the upper surface of the insulating layer 100 and the side surfaces of the first cavity 200 and the side surfaces of the insulating pillar 300 which are very close to the upper surface of the insulating pillar 300 . Due to this plating inhibitor A, the lateral direction growth of the electroless plating layer 410 is suppressed, and the upward direction growth of the electroless plating layer 410, which is less affected by the plating inhibitor A, is maintained. Therefore, the electroless plating layer 410 grows upward from the bottom surface of the first cavity 200 , and since the growth in the lateral direction of the plating layer 400 is suppressed, dents do not appear in the plating layer 400 , and the plating layer 400 is grown at a relatively uniform thickness. By forming the plated layer 400 as described herein, the plated layer 400 can be grown uniformly in a very large area, and a large scale (volume) of the plated layer 400 can also be formed.

8, the growth of the electroless plating layer 410 is completed. The electroless plating layer 410 may be grown up to the one surface of the insulating layer 100 by growing in an upward direction.

9, the electroless plating layer 410 is removed. The electroless plating layer 410 is removed, for example, by flash etching. During this process, the plating inhibitor A is also removed, and since the uppermost portion of the plating layer 420 is partially removed, the plating Thickness variations of layer 400 are reduced.

Referring to FIG. 10 , the second cavity 500 is formed, and the electronic device 600 is mounted. The second cavity 500 is formed in such a manner that the plating layer 400 is exposed through the second cavity 500 , and the electronic device 600 is mounted in contact with the plating layer 400 . Therefore, the heat generated by the electronic device 600 is transferred to the plating layer 400 . Nevertheless, the electronic device 600 may be mounted in the second cavity 500 by an adhesive, in which case, the electronic device 600 may utilize the adhesive and the plated layer sandwiched between the electronic device 600 and the plated layer 400 400 , rather than directly contacting the plating layer 400 . In such a case, a conductive adhesive can be used so that the adhesive can aid in heat transfer. Regardless, the heat generated by the electronic device 600 is transferred to the plating layer 400 .

Meanwhile, the second cavity 500 is not necessarily formed after the plating layer 400 is formed. The plating layer 400 may be formed after the first cavity 200 and the second cavity 500 are first formed, and if necessary, the insulating layer 100 may be partially left between the first cavity 200 and the second cavity 500 . In this case, preferably, the locally remaining insulating layer 100 has a very small thickness so as not to affect heat transfer.

FIG. 11 shows a printed circuit board according to another embodiment of the present invention. Fig. 12 is a cross-sectional view of the printed circuit board taken along the line D-D' shown in Fig. 11, and Fig. 13 is a cross-sectional view of the printed circuit board taken along the line F-F' shown in Fig. 11. The same descriptions provided with reference to FIGS. 1 to 10 can be applied to the printed circuit boards shown in FIGS. 11 to 13 . Therefore, any redundant description with reference to FIGS. 1 to 10 will be simplified or omitted, but this does not mean that such omitted or simplified description is excluded from the present embodiment.

11 , the printed circuit board according to the present embodiment includes an insulating layer 100 , a first cavity 200 , an insulating column 300 and a plating layer 400 , and may further include a metal structure 700 .

The insulating layer 100 is made of an insulating material such as resin, and has a plate shape. The resin of the insulating layer 100 is explained above with reference to FIGS. 1 to 10 .

The first cavity 200 is opened through one surface of the insulating layer 100 , and may not completely penetrate the insulating layer 100 in the thickness direction of the insulating layer 100 . When necessary, the first cavity 200 may completely penetrate the insulating layer 100 . Hereinafter, the case where the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 will be described, but the present invention should not be limited to the structure described herein. The first cavity 200 may be formed by, but not limited to, a computer numerical control process, a laser process, or a lithography process.

The insulating pillars 300 are formed in the first cavity 200 , and the side surfaces of the insulating pillars 300 are separated from the insulating layer 100 . That is, as shown in FIG. 12 , the insulating pillar 300 is formed in an island shape inside the first cavity 200 . The insulating pillars 300 may be formed in a plurality, and the plurality of insulating pillars 300 are spaced apart from each other.

The insulating pillar 300 may be formed of the same material as the insulating layer 100 . In addition, the height of the insulating pillar 300 may be substantially the same as the thickness of the insulating layer 100 . The insulating pillar 300 is not necessarily made of the same material as the insulating layer 100 , and the insulating layer 100 and the insulating pillar 300 may be formed of different materials from each other.

The insulating pillar 300 is in the shape of a pillar having an upper surface and a lower surface, and the lower surface contacts the bottom portion of the first cavity 200 . In addition, the shapes of the upper and lower surfaces of the insulating pillar 300 are not limited to any specific shape, but may be any of various shapes including a rectangle, a circle, and a polygon. The shape of the lateral section of the insulating pillar 300 may include a vertex or a sharp corner, and each side of the lateral section of the insulating pillar 300 may be a curve. In the case where each side of the lateral cross-section of the insulating pillar 300 is curved, the side surface of the insulating pillar 300 may be a curved surface that is recessed toward the inside of the insulating pillar 300 .

The plating layer 400 is formed in the first cavity 200 and filled in the first cavity 200 except at the insulating pillars 300 . The plating layer 400 may be made of metal, especially a metal with high thermal conductivity, to improve heat dissipation properties. Alternatively, the plating layer 400 may be made of the same metal as the circuitry of the printed circuit board.

The plating layer 400 may include a seed layer formed by electroless plating and having a thickness of the electroless plating layer 410 of 2 microns or less. In addition, the plating layer 400 may include a plating layer 420 formed on the electroless plating layer 410 . The seed layer (electroless plated layer 410) is formed on the entire side surface and bottom portion of the first cavity 200 and on the entire side surface of the insulating pillar 300, and the plated layer 420 is obtained by using the electroless plated layer 410 as a lead-in. Formed by electroplating.

The metal structure 700 is the part formed on the plated layer 400 to increase the surface area of the objects involved in the heat dissipation of the printed circuit board. The metal structure 700 is in contact with the plated layer 400 and does not cover the insulating pillar 300 . In the case where the insulating pillars 300 are formed in a plurality, the metal structure 700 may be formed between the plurality of insulating pillars 300 .

Although the metal structure 700 is shown in FIGS. 11 and 12 as an elongated cube shape, the metal structure 700 is not necessarily limited to the shape shown herein. The metal structure 700 can also be formed by a plating process like the plating layer 400 , and can include the electroless plating layer 410 and the plating layer 400 . In addition, the metal structure 700 may be made of the same material as the plating layer 400 . For example, both the plating layer 400 and the metal structure 700 may be made of copper.

The printed circuit board according to this embodiment may further include the second cavity 500 and the electronic device 600 .

The second cavity 500 opens toward the other surface of the insulating layer 100 and is placed on the opposite side of the first cavity 200 . The first cavity 200 occupies a portion of the thickness of the insulating layer 100, and the second cavity 500 occupies the remaining portion of the thickness of the insulating layer 100, and the first cavity 200 and the second cavity 500 are formed to overlap (ie, connect) each other . The lateral cross-sectional area of the first cavity 200 may be the same as the lateral cross-sectional area of the second cavity 500 , or the lateral cross-sectional area of the first cavity 200 may be larger than that of the second cavity 500 . When the first cavity 200 and the second cavity 500 are adjacent to each other, the second cavity 500 is in contact with the plating layer 400 . Therefore, the plating layer 400 formed in the first cavity 200 and the electronic device 600 mounted in the second cavity 500 are in contact with each other, and thus the heat generated by the electronic device 600 can be dissipated by the plating layer 400 .

The electronic device 600 is a device installed in the second cavity 500, and may, for example, include passive devices, active devices, and integrated circuits. In the case where the electronic device 600 is mounted in the second cavity 500 using an adhesive, the electronic device 600 may be in contact with the plated layer 400 using the adhesive between the electronic device 600 and the plated layer 400 . In this case, the adhesive may be a conductive adhesive with high thermal conductivity.

14 and 15 illustrate printed circuit boards according to other embodiments of the present invention. In the printed circuit board described with reference to FIGS. 14 and 15 , the first cavity completely penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 , and thus the second cavity does not exist. Hereinafter, the first cavity will be simply referred to as "cavity", and any description that is redundant with respect to the above description will be omitted, and differences with respect to the above description will be mainly explained.

14 , the cavity 200 completely penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 , and the thickness of the plating layer 400 is substantially the same as that of the insulating layer 100 . The insulating pillars 300 are embedded within the plating layer 400 . The upper and lower surfaces of the insulating pillars 300 may be exposed through the cavity 200 .

Electronic device 610 may be mounted on insulating layer 100 , and electronic device 610 may be: (i) mounted in insulating material 110 on insulating layer 100 , or (ii) mounted on insulating material 110 . FIG. 14 shows the situation of (ii), where the electronic device 610 is mounted on the insulating material 110 . In both cases, the electronic device 610 and the plated layer 400 may be connected to each other through the thermal vias 800 .

The heat dissipation via 800 is a via hole penetrating the insulating material 110 for connecting the electronic device 610 and the plated layer 400 and in contact with the electronic device 610 and the plated layer 400 . The thermal vias 800 play a greater role in transferring the heat generated by the electronic device 610 to the plating layer 400 than in transferring electrical signals. Therefore, the thermal via 800 may have a larger volume than a typical via formed in the circuit region. Heat dissipation vias 800 may be formed in multiples and connected to a single pad, and in the case where insulating material 100 is formed in multiples, heat dissipation may be formed for each insulating material 110 The through-holes 800 and the heat-dissipating through-holes 800 respectively formed at different insulating materials 110 may overlap each other to form a stacked structure.

Referring to FIG. 15 , the cavity 200 completely penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 , and the thickness of the plating layer 400 is substantially the same as that of the insulating layer 100 . The insulating pillars 300 are embedded within the plating layer 400 . The upper and lower surfaces of the insulating pillars 300 may be exposed through the cavity 200 . In addition, the electronic device 620 is not mounted in the insulating layer 100 , but is mounted on the insulating layer 100 and is disposed in contact with the plating layer 400 .

Specifically, the printed wiring board is composed of a plurality of insulating layers 100 stacked on top of each other. Each of the plurality of insulating layers 100 includes: a cavity 200 penetrating the insulating layer 100; an insulating pillar 300 formed in the cavity 200 in such a manner that side surfaces of the insulating pillar 300 are separated from the insulating layer 100; and The plating layer 400 is formed in the area of the cavity 200 except for the insulating pillars 300 .

In this case, the electronic device 620 may be mounted on and in contact with the plating layer 400 of the insulating layer 100 disposed at the outermost layer (uppermost or lowermost) of the plurality of insulating layers 100 400, and the plating layers 400 respectively formed on different insulating layers 100 can be stacked on each other to facilitate heat transfer. Although it is shown in FIG. 15 that the insulating pillars 300 respectively formed on different insulating layers 100 are also stacked, the present invention is not limited to the structure shown in FIG. 15 .

Although this disclosure includes specific examples, it will be apparent to those skilled in the art that these examples can be made in various forms without departing from the spirit and scope of the claims and their equivalents and changes in details. The examples described herein should be considered in an illustrative sense only and not in a limiting sense. Descriptions of features or aspects in each example should be considered applicable to similar features or aspects in other examples. If the techniques described are performed in a different order and/or if components of the described systems, architectures, devices, or circuits are combined in different ways and/or are substituted for other components or their equivalents or by way of other components or its equivalent form, suitable results can be achieved. Therefore, the scope of the present disclosure is defined not by the detailed description but by the scope of the patent application and its equivalents, and all modifications within the scope of the patent application and its equivalents should be construed as being included in the present disclosure revealing.

100‧‧‧Insulating layer 110‧‧‧Insulating material 200‧‧‧First cavity 300‧‧‧Insulating column 400‧‧‧Plating layer 410‧‧‧Electroless plating layer 420‧‧‧Plating layer 500‧‧‧ Second cavity 600, 610, 620‧‧‧Electronic device 700‧‧‧Metal structure 800‧‧‧Heat dissipation through hole A‧‧‧Plating inhibitor A-A', B-B', C-C', D -D', F-F'‧‧‧lines

FIG. 1 shows a printed circuit board according to one embodiment of the present invention.

Fig. 2 is a cross-sectional view of the printed circuit board along the line A-A' shown in Fig. 1 .

Fig. 3 is a cross-sectional view of the printed circuit board taken along the line B-B' shown in Fig. 1 .

4 to 10 illustrate a method of manufacturing a printed circuit board according to one embodiment of the present invention.

FIG. 11 shows a printed circuit board according to another embodiment of the present invention.

Fig. 12 is a cross-sectional view of the printed circuit board taken along the line D-D' shown in Fig. 11 .

Fig. 13 is a cross-sectional view of the printed circuit board taken along the line F-F' shown in Fig. 11 .

Figure 14 shows a printed circuit board according to yet another embodiment of the present invention.

FIG. 15 shows a printed circuit board according to yet another embodiment of the present invention.

100‧‧‧Insulating layer

200‧‧‧First cavity

300‧‧‧Insulation Column

400‧‧‧Coating

A-A’, B-B’‧‧‧lines

Claims (15)

A printed circuit board comprising: an insulating layer; an insulating pillar including a first cavity, wherein a side surface of the insulating pillar is spaced apart from the insulating layer, and the insulating pillar exposes a surface of the insulating layer; and a plating layer formed in the first cavity of the insulating pillar in a region other than the insulating pillar, wherein the plating layer includes an electroless plating layer covering the inner surface of the first cavity and An electroplating layer that fills the interior of the first cavity and is exposed to the surface of the insulating layer. The printed circuit board of claim 1, wherein the insulating pillar is made of the same material as the insulating layer. The printed circuit board of claim 1, comprising a plurality of the insulating pillars, and wherein the insulating pillars are disposed to be spaced apart from each other. The printed circuit board according to claim 1, further comprising: a second cavity, which is opened through the other surface of the insulating layer; and an electronic device installed in the second cavity. The printed circuit board of claim 4, wherein the second cavity is in contact with the plated layer. The printed circuit board of claim 1, wherein a volume of the insulating post is smaller than a volume of the plated layer. A printed circuit board, comprising: an insulating layer; a first cavity opened through one surface of the insulating layer; and insulating pillars formed on the insulating layer in a manner that the side surfaces of the insulating pillars are separated from the insulating layer a first cavity; and a plating layer formed in a region of the first cavity other than the insulating pillar, wherein a side surface of the insulating pillar is a curved surface recessed toward the interior of the insulating pillar. The printed circuit board according to claim 7, further comprising a metal structure formed on the plated layer. The printed circuit board of claim 8, comprising a plurality of the insulating pillars, wherein the metal structure is formed between the plurality of insulating pillars. The printed circuit board of claim 8, wherein the metal structure is made of the same metal as the metal constituting the plated layer. The printed circuit board as described in item 7 of the claimed scope, further comprising: an insulating material laminated on one surface of the insulating layer; an electronic device mounted in the insulating material or on the insulating material; and The heat dissipation through hole connects the electronic device and the plated layer to each other by penetrating the insulating material. The printed circuit board of claim 11, wherein the first cavity is opened through one surface or the other surface of the insulating layer, and The thickness of the plating layer is the same as the thickness of the insulating layer. A printed circuit board is composed of a plurality of insulating layers laminated on top of each other, wherein each of the insulating layers includes: a cavity penetrating the insulating layer; the insulating layer is formed in the cavity in a spaced manner; and a plating layer is formed in a region of the cavity other than the insulating post, wherein the plating layer includes an inner layer covering the cavity Electroless plating of the walls and plating filling the interior of the cavity and exposing the surface of the insulating layer. The printed circuit board of claim 13, further comprising an electronic device mounted on the plated layer of the insulating layer disposed at the outermost of the plurality of insulating layers and contact the plated layer. The printed circuit board according to claim 13, wherein the plating layers respectively formed on the different insulating layers are in contact with each other.

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