TWI771408B - Printed circuit board - Google Patents
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- TWI771408B TWI771408B TW107113928A TW107113928A TWI771408B TW I771408 B TWI771408 B TW I771408B TW 107113928 A TW107113928 A TW 107113928A TW 107113928 A TW107113928 A TW 107113928A TW I771408 B TWI771408 B TW I771408B
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- insulating
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- printed circuit
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- 238000007747 plating Methods 0.000 claims abstract description 87
- 238000007772 electroless plating Methods 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000011810 insulating material Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000009713 electroplating Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 17
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000003112 inhibitor Substances 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- -1 polytetrafluoroethylene Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
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- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本發明是有關於一種印刷電路板。The present invention relates to a printed circuit board.
隨著安裝於印刷電路板上的電子部件變得具更大積集度及更薄,含有精細圖案的印刷電路板的散熱性質已變為一項重要的問題。包括電子部件的印刷電路板在某一溫度以上會遭遇故障及缺陷,且因此需要散熱結構來控制故障及缺陷。傳統上,藉由填充鍍覆製程(fill plating process)來製作通孔類型的散熱結構,然而可藉由填充鍍覆製程製作的散熱結構的面積是有限的。As electronic components mounted on printed circuit boards have become more compact and thinner, the heat dissipation properties of printed circuit boards containing fine patterns have become an important issue. Printed circuit boards including electronic components experience failures and defects above a certain temperature, and thus require heat dissipation structures to control failures and defects. Conventionally, through-hole type heat dissipation structures are fabricated through a fill plating process, but the area of the heat dissipation structures that can be fabricated through the fill plating process is limited.
在韓國專利公開案第10-2011-0029422號(2011年3月23日)中闡述了相關技術。The related art is described in Korean Patent Publication No. 10-2011-0029422 (March 23, 2011).
本發明旨在提供一種具有散熱結構的印刷電路板。The present invention aims to provide a printed circuit board with a heat dissipation structure.
本發明的態樣提供一種印刷電路板,其包括:絕緣層;第一腔,穿通所述絕緣層的一個表面而開口;絕緣柱,以所述絕緣柱的側表面(lateral surface)與所述絕緣層分隔開的方式形成於所述第一腔中;以及鍍覆層,形成於所述第一腔中除所述絕緣柱之外的區中。An aspect of the present invention provides a printed circuit board, which includes: an insulating layer; a first cavity opened through one surface of the insulating layer; An insulating layer is formed in the first cavity in a spaced manner; and a plating layer is formed in a region of the first cavity other than the insulating pillar.
本發明的另一態樣提供一種由彼此上下積層的多個絕緣層構成的印刷電路板。所述多個絕緣層中的每一者包括:腔,穿透所述絕緣層;絕緣柱,以所述絕緣柱的側表面與所述絕緣層分隔開的方式形成於所述腔中;以及鍍覆層,形成於所述腔中除所述絕緣柱之外的區中。Another aspect of the present invention provides a printed circuit board composed of a plurality of insulating layers stacked on top of each other. Each of the plurality of insulating layers includes: a cavity penetrating the insulating layer; insulating pillars formed in the cavity with side surfaces of the insulating pillars spaced from the insulating layer; and a plated layer formed in the cavity except for the insulating pillar.
提供以下詳細說明是為了幫助讀者獲得對本文所述的方法、設備及/或系統的全面理解。然而,本文所述的方法、設備及/或系統的各種變化、修改及等效形式將對此項技術中具有通常知識者顯而易見。本文所述的操作的順序僅為實例,且並非受限於本文所述的順序,而是除了必需按某一次序發生的操作以外,可如將對此項技術中具有通常知識者顯而易見般進行改變。此外,為增加清晰性及簡明性,對此項技術中具有通常知識者眾所習知的功能及構造的說明可被省略。The following detailed description is provided to assist the reader in gaining a comprehensive understanding of the methods, apparatus and/or systems described herein. However, various changes, modifications and equivalents of the methods, apparatus and/or systems described herein will be apparent to those of ordinary skill in the art. The order of operations described herein is an example only, and is not limited to the order described herein, but may be performed as would be apparent to those of ordinary skill in the art, except that operations must occur in a certain order Change. Also, descriptions of functions and constructions that are well known to those of ordinary skill in the art may be omitted for increased clarity and conciseness.
本文所述的特徵可被實施為諸多不同的形式,而不應被視為僅限於本文所述的實例。更確切而言,提供本文所述的實例是為了使本揭露將透徹及完整,且將向此項技術中具有通常知識者傳達本揭露的全部範圍。The features described herein may be implemented in many different forms and should not be considered limited to the examples described herein. Rather, the examples described herein are provided so that this disclosure will be thorough and complete, and will convey the full scope of the disclosure to those of ordinary skill in the art.
除非另外定義,否則本文所使用的包括技術用語及科學用語在內的所有用語具有與本揭露所屬技術中具有通常知識者對所述用語所通常理解的含義相同的含義。在常用字典中定義的任何用語應被理解為在相關技術的上下文中具有相同的含義,且除非另外明確地定義,否則不應將其解釋為具有理想或過於正式的含義。Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this disclosure belongs. Any term defined in a common dictionary should be construed as having the same meaning in the context of the related art, and should not be construed as having an ideal or overly formal meaning unless explicitly defined otherwise.
無論圖編號如何,相同或對應的元件將被賦予相同的參考編號,且將不再重複對相同或對應的元件進行任何冗餘說明。在本揭露的說明通篇中,當確定闡述某一相關傳統技術來回避本揭露的要點時,將省略相干的詳細說明。在闡述各種元件時可使用例如「第一」及「第二」等用語,但以上元件不應侷限於以上用語。以上用語僅用於區分各個元件。在附圖中,一些元件可被誇大、省略或進行簡要說明,且元件的尺寸未必反映這些元件的實際尺寸。Identical or corresponding elements will be given the same reference numerals regardless of figure numbering, and any redundant description of identical or corresponding elements will not be repeated. Throughout the description of the present disclosure, when it is determined to describe a certain related conventional technology to avoid the gist of the present disclosure, the related detailed description will be omitted. Terms such as "first" and "second" may be used in describing various elements, but the above elements should not be limited to the above terms. The above terms are only used to distinguish each element. In the drawings, some elements may be exaggerated, omitted or briefly described, and the dimensions of the elements do not necessarily reflect the actual dimensions of the elements.
以下,將參照附圖詳細闡述本揭露的某些實施例。Hereinafter, certain embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
圖1示出根據本發明一個實施例的印刷電路板。圖2是印刷電路板的沿圖1所示A-A’線的剖視圖。圖3是印刷電路板的沿圖1所示B-B’線的剖視圖。圖4至圖10示出根據本發明一個實施例的製造印刷電路板的方法。FIG. 1 shows a printed circuit board according to one embodiment of the present invention. Fig. 2 is a cross-sectional view of the printed circuit board along the line A-A' shown in Fig. 1 . Fig. 3 is a cross-sectional view of the printed circuit board taken along the line B-B' shown in Fig. 1 . 4 to 10 illustrate a method of manufacturing a printed circuit board according to one embodiment of the present invention.
參照圖1至圖3,根據實施例的印刷電路板包括絕緣層100、第一腔200、絕緣柱300及鍍覆層400。1 to 3 , a printed circuit board according to an embodiment includes an
絕緣層100由例如樹脂等絕緣材料製成,且具有板形狀。絕緣層100的樹脂可為各種樹脂(例如熱固性樹脂或熱塑性樹脂)中的任一種,且具體而言可為環氧樹脂或聚醯亞胺。此處,例如,環氧樹脂可為但不限於:萘型環氧樹脂、雙酚A型環氧樹脂、雙酚F型環氧樹脂、酚醛環氧樹脂、甲酚酚醛環氧樹脂、橡膠改性環氧樹脂、環型脂肪族環氧樹脂、矽型環氧樹脂、氮型環氧樹脂或磷型環氧樹脂。The
絕緣層100可含有加強材(stiffener),所述加強材可為玻璃布或無機填料(例如二氧化矽)。絕緣層100可為其中含有玻璃布的預浸體(Prepreg,PPG)或者其中含有無機填料的增層膜(build-up film)。增層膜的實例可為味之素增層膜(Ajinomoto Build-up Film,ABF)。The
絕緣層100可由具有低介電常數(Dk)及介電耗散因數(Df)的材料製成,例如,液晶聚合物(Liquid Crystal Polymer,LCP)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚苯醚(Polyphenylene Ether,PPE)、環烯烴聚合物(Cyclo Olefin Polymer,COP)或全氟烷氧基樹脂(Perfluoroalkoxy,PFA)。The
第一腔200穿通絕緣層100的一個表面而開口,且在絕緣層100的厚度方向上可不完全穿透絕緣層100。以下,將闡述第一腔200在絕緣層100的厚度方向上局部穿透絕緣層100的情形,但本發明不應侷限於本文所述的結構。可藉由(但不限於)電腦數值控制(Computer Numerical Control,CNC)製程、雷射製程或微影製程來形成第一腔200。腔200變為其中將接收鍍覆層400的一部分,稍後將對此進行說明。The
絕緣柱300形成於第一腔200中,且絕緣柱300的側表面與絕緣層100分隔開。亦即,如圖2中所示,絕緣柱300在第一腔200內部被形成為島形狀。絕緣柱300可被形成為多個,且所述多個絕緣柱300彼此分隔開。The
此種絕緣柱300可藉由在形成第一腔200時自絕緣層100移除除絕緣柱300之外的區來製作。在此種情形中,絕緣柱300可由與絕緣層100相同的材料形成。此外,絕緣柱300的高度可與絕緣層100的厚度實質上相同,此處,「實質上相同」是包含容差的概念。Such insulating
不過,絕緣柱300未必一定由與絕緣層100相同的材料製成,且絕緣柱300可被單獨地製作並然後附裝於第一腔200中,在此種情形中,絕緣層100及絕緣柱300可由彼此不同的材料形成。However, the
絕緣柱300呈具有上表面及下表面的柱的形狀,而下表面接觸第一腔200的底部分。此外,絕緣柱300的上表面及下表面的形狀並非僅限於任何特定形狀,而是可為包括矩形、圓形及多邊形在內的各種形狀中的任一種。如圖1中所示,絕緣柱300的橫向截面的形狀可包括頂點或尖角,且絕緣柱300的橫向截面的各側可為曲線。在其中絕緣柱300的橫向截面的各側為曲線的情形中,絕緣柱300的側表面可為朝絕緣柱300的內部凹陷的彎曲表面。The
絕緣柱300吸附含在鍍覆溶液中的鍍覆抑制劑A(示出於圖7中),且因此可抑制鍍覆。因此,可在第一腔200中於橫向方向上抑制鍍覆,但可自第一腔200的底表面於朝上方向上進行鍍覆。The
較佳地,第一腔200中被絕緣柱300佔據的面積(體積)是極小的,且此是為了將鍍覆層400的面積(體積)最大化。在其中如上所述絕緣柱300的橫向截面的各側是曲線且絕緣柱300的側表面是朝內凹陷的彎曲表面的情形中,絕緣柱300可具有尖角且具有極小面積(體積)。此外,在這些尖角處可增加鍍覆抑制劑A的吸附比例。Preferably, the area (volume) of the
鍍覆層400形成於第一腔200中,且填充於除絕緣柱300處之外的第一腔200中。鍍覆層400可由金屬(尤其具有高導熱率的金屬)製成以改良散熱性質。作為另一選擇,鍍覆層400可由與印刷電路板的電路相同的金屬製成。The
鍍覆層400可包括晶種層,所述晶種層是藉由無電鍍覆而形成且厚度為2微米(um)或更小的無電鍍覆層410。此外,鍍覆層400可包括形成於無電鍍覆層410上的電鍍層420。晶種層(無電鍍覆層410)形成於第一腔200的整個側表面及底部分上以及絕緣柱300的整個側表面上,且電鍍層420是使用無電鍍覆層410作為引入線(lead-in wire)而藉由電鍍形成。The
在第一腔200中被鍍覆層400佔據的體積顯著大於被絕緣柱300佔據的體積。即使考量到橫向截面積,被鍍覆層400佔據的面積亦較被絕緣柱300佔據的面積大得多。此乃因鍍覆層400起到散熱作用,而絕緣柱300是用於幫助形成鍍覆層400的結構且因此需要極小面積。The volume occupied by the
同時,根據本發明一個實施例的印刷電路板可更包括第二腔500及電子裝置600。Meanwhile, the printed circuit board according to an embodiment of the present invention may further include the
第二腔500朝絕緣層100的另一表面而開口且被置於第一腔200的相對側上。第一腔200佔據絕緣層100的厚度的一部分,且第二腔500佔去絕緣層100的厚度的剩餘部分,而第一腔200及第二腔500被形成為彼此交疊(即,連接)。第一腔200的橫向截面積可與第二腔500的橫向截面積相同,或者第一腔200的橫向截面積可大於第二腔500的橫向截面積。當第一腔200與第二腔500彼此毗鄰時,第二腔500與鍍覆層400接觸。因此,形成於第一腔200中的鍍覆層400與安裝於第二腔500中的電子裝置600彼此接觸,且因此由電子裝置600產生的熱量可藉由鍍覆層400而耗散。The
電子裝置600是安裝於第二腔500中的裝置,且可例如包括被動裝置、主動裝置及積體電路。在其中電子裝置600是使用黏合劑安裝於第二腔500中的情形中,電子裝置600可利用電子裝置600與鍍覆層400之間的黏合劑與鍍覆層400接觸。在此種情形中,黏合劑可為具有高導熱率的傳導性黏合劑。The
以下,將參照圖4至圖10來闡述根據本發明一個實施例的製造印刷電路板的方法。Hereinafter, a method of manufacturing a printed circuit board according to an embodiment of the present invention will be explained with reference to FIGS. 4 to 10 .
參照圖4,在絕緣層100上形成第一腔200及絕緣柱300。可例如藉由電腦數值控制製程或雷射製程來形成第一腔200及絕緣柱300,且可藉由處理除絕緣柱300之外的部分來形成第一腔200。此外,在其中絕緣層100為感光性的情形中,可藉由包括曝光與顯影的微影製程來形成第一腔200。Referring to FIG. 4 , a
圖5是圖4的沿C-C’線的剖視圖。圖6至圖10示出C-C’截面。參照圖5,第一腔200在厚度方向上局部穿透絕緣層100而非完全穿透絕緣層100,並且絕緣柱300的側表面與絕緣層100分隔開,且多個絕緣柱300被設置成彼此分隔開。Fig. 5 is a cross-sectional view taken along line C-C' of Fig. 4 . Figures 6 to 10 show the C-C' section. Referring to FIG. 5 , the
參照圖6,作為晶種層來形成無電鍍覆層410。無電鍍覆層410形成於第一腔200的側表面及底部分上以及絕緣柱300的側表面以及絕緣層100的一個表面上。亦即,無電鍍覆層410形成於絕緣層100的上面形成有第一腔200及絕緣柱300的每一表面上。無電鍍覆層410可由例如銅或鈦等金屬製成。Referring to FIG. 6, an
參照圖7,在第一腔200中的無電鍍覆層410上形成電鍍層420。電鍍層420可藉由電鍍來形成,且可由例如銅等金屬製成。用於形成無電鍍覆層410的鍍覆溶液在其中含有鍍覆抑制劑A,以抑制在特定區處形成無電鍍覆層410。大部分的鍍覆抑制劑A被吸附至絕緣層100的表面及絕緣柱300的位於絕緣層100的一個表面上的表面(圖7中絕緣層100的上表面及絕緣柱300的上表面),且幾乎不被吸附至第一腔200的內部。此乃因鍍覆抑制劑A的吸附比例在絕緣層100的首先與鍍覆溶液接觸的表面上較高,且隨著鍍覆溶液更深地進入至第一腔200中而變低。Referring to FIG. 7 , a
因此,如圖7中所示,鍍覆抑制劑A被吸附至絕緣層100的一個表面及絕緣柱300的除其(大部分)側表面之外的表面,在此製程期間,鍍覆抑制劑A中的一些可被吸附至絕緣層100的上表面以及第一腔200的側表面及絕緣柱300的與絕緣柱300的上表面非常靠近的側表面。由於此種鍍覆抑制劑A,無電鍍覆層410的橫向方向生長受到抑制,且無電鍍覆層410的受鍍覆抑制劑A影響很小的朝上方向生長得以維持。因此,無電鍍覆層410自第一腔200的底表面朝上生長,且由於鍍覆層400的橫向方向生長受到抑制,因此在鍍覆層400中不會出現凹痕,且鍍覆層400是以相對均勻的厚度生長。藉由如本文所述般來形成鍍覆層400,可在非常大的面積中均勻地生長鍍覆層400,且亦可形成大規模(體積)的鍍覆層400。Therefore, as shown in FIG. 7 , the plating inhibitor A is adsorbed to one surface of the insulating
參照圖8,完成無電鍍覆層410的生長。無電鍍覆層410可藉由朝上方向生長而一直生長至絕緣層100的所述一個表面。8, the growth of the
參照圖9,移除無電鍍覆層410。例如藉由閃速蝕刻(flash etching)來移除無電鍍覆層410,在此製程期間,鍍覆抑制劑A亦被移除,且由於電鍍層420的最上部分被局部移除,因此鍍覆層400的厚度偏差得以減小。9, the
參照圖10,形成第二腔500,且安裝電子裝置600。第二腔500是以鍍覆層400藉由第二腔500暴露出的方式形成,且電子裝置600被安裝成與鍍覆層400接觸。因此,由電子裝置600產生的熱量被傳遞至鍍覆層400。儘管如此,電子裝置600可藉由黏合劑安裝於第二腔500中,在此種情形中,電子裝置600可利用夾置於電子裝置600與鍍覆層400之間的黏合劑與鍍覆層400接觸,而非與鍍覆層400直接接觸。在此種情形中,可使用傳導性黏合劑,以使得黏合劑可有助於熱量傳遞。無論如何,由電子裝置600產生的熱量皆被傳遞至鍍覆層400。Referring to FIG. 10 , the
同時,第二腔500未必一定是在鍍覆層400被形成之後形成。鍍覆層400可在第一腔200及第二腔500被首先形成之後形成,且在必要時,可在第一腔200與第二腔500之間局部保留絕緣層100。在此種情形中,較佳地,局部保留的絕緣層100具有極小厚度以便不影響熱量傳遞。Meanwhile, the
圖11示出根據本發明另一實施例的印刷電路板。圖12是印刷電路板的沿圖11所示D-D’線的剖視圖,且圖13是印刷電路板的沿圖11所示F-F’線的剖視圖。參照圖1至圖10所提供的相同說明可適用於圖11至圖13所示的印刷電路板。因此,將簡化或省略參照圖1至圖10進行的任何冗餘說明,但此並非意指此種已省略或簡化的說明被排除於本實施例之外。FIG. 11 shows a printed circuit board according to another embodiment of the present invention. Fig. 12 is a cross-sectional view of the printed circuit board taken along the line D-D' shown in Fig. 11, and Fig. 13 is a cross-sectional view of the printed circuit board taken along the line F-F' shown in Fig. 11. The same descriptions provided with reference to FIGS. 1 to 10 can be applied to the printed circuit boards shown in FIGS. 11 to 13 . Therefore, any redundant description with reference to FIGS. 1 to 10 will be simplified or omitted, but this does not mean that such omitted or simplified description is excluded from the present embodiment.
參照圖11,根據本實施例的印刷電路板包括絕緣層100、第一腔200、絕緣柱300及鍍覆層400,且可更包括金屬結構700。11 , the printed circuit board according to the present embodiment includes an insulating
絕緣層100由例如樹脂等絕緣材料製成,且具有板形狀。以上參照圖1至圖10闡述了絕緣層100的樹脂。The insulating
第一腔200穿通絕緣層100的一個表面而開口,且在絕緣層100的厚度方向上可不完全穿透絕緣層100。在必要時,第一腔200可完全穿透絕緣層100。以下,將闡述第一腔200在絕緣層100的厚度方向上局部穿透絕緣層100的情形,但本發明不應侷限於本文所述的結構。可藉由(但不限於)電腦數值控制製程、雷射製程或微影製程來形成第一腔200。The
絕緣柱300形成於第一腔200中,且絕緣柱300的側表面與絕緣層100分隔開。亦即,如圖12中所示,絕緣柱300在第一腔200內部被形成為島形狀。絕緣柱300可被形成為多個,且所述多個絕緣柱300彼此分隔開。The insulating
絕緣柱300可由與絕緣層100相同的材料形成。此外,絕緣柱300的高度可與絕緣層100的厚度實質上相同。絕緣柱300不必一定由與絕緣層100相同的材料製成,且絕緣層100及絕緣柱300可由彼此不同的材料形成。The insulating
絕緣柱300呈具有上表面及下表面的柱的形狀,而下表面接觸第一腔200的底部分。此外,絕緣柱300的上表面及下表面的形狀並非僅限於任何特定形狀,而是可為包括矩形、圓形及多邊形在內的各種形狀中的任一種。絕緣柱300的橫向截面的形狀可包括頂點或尖角,且絕緣柱300的橫向截面的各側可為曲線。在其中絕緣柱300的橫向截面的各側為曲線的情形中,絕緣柱300的側表面可為朝絕緣柱300的內部凹陷的彎曲表面。The insulating
鍍覆層400形成於第一腔200中,且填充於除絕緣柱300處之外的第一腔200中。鍍覆層400可由金屬(尤其具有高導熱率的金屬)製成以改良散熱性質。作為另一選擇,鍍覆層400可由與印刷電路板的電路相同的金屬製成。The
鍍覆層400可包括晶種層,所述晶種層是藉由無電鍍覆而形成且厚度為2微米或更小的無電鍍覆層410。此外,鍍覆層400可包括形成於無電鍍覆層410上的電鍍層420。晶種層(無電鍍覆層410)形成於第一腔200的整個側表面及底部分上以及絕緣柱300的整個側表面上,且電鍍層420是使用無電鍍覆層410作為引入線而藉由電鍍形成。The
金屬結構700是形成於鍍覆層400上的部分,以增加在印刷電路板的散熱中所涉及的物件的表面積。金屬結構700與鍍覆層400接觸,且不覆蓋絕緣柱300。在其中絕緣柱300被形成為多個的情形中,金屬結構700可形成於所述多個絕緣柱300之間。The
雖然金屬結構700在圖11及圖12中被示出為細長立方體形狀,然而金屬結構700未必侷限於本文所示的形狀。金屬結構700亦可如同鍍覆層400一樣藉由鍍覆製程來形成,且可包括無電鍍覆層410及電鍍層400。此外,金屬結構700可由與鍍覆層400相同的材料製成。舉例而言,鍍覆層400及金屬結構700皆可由銅製成。Although the
根據本實施例的印刷電路板可更包括第二腔500及電子裝置600。The printed circuit board according to this embodiment may further include the
第二腔500朝絕緣層100的另一表面而開口且被置於第一腔200的相對側上。第一腔200佔據絕緣層100的厚度的一部分,且第二腔500佔去絕緣層100的厚度的剩餘部分,而第一腔200及第二腔500被形成為彼此交疊(即,連接)。第一腔200的橫向截面積可與第二腔500的橫向截面積相同,或者第一腔200的橫向截面積可大於第二腔500的橫向截面積。當第一腔200與第二腔500彼此毗鄰時,第二腔500與鍍覆層400接觸。因此,形成於第一腔200中的鍍覆層400與安裝於第二腔500中的電子裝置600彼此接觸,且因此由電子裝置600產生的熱量可藉由鍍覆層400而耗散。The
電子裝置600是安裝於第二腔500中的裝置,且可例如包括被動裝置、主動裝置及積體電路。在其中電子裝置600是使用黏合劑安裝於第二腔500中的情形中,電子裝置600可利用電子裝置600與鍍覆層400之間的黏合劑與鍍覆層400接觸。在此種情形中,黏合劑可為具有高導熱率的傳導性黏合劑。The
圖14及圖15示出根據本發明其他實施例的印刷電路板。在參照圖14及圖15所述的印刷電路板中,第一腔在絕緣層100的厚度方向上完全穿透絕緣層100,且因此不存在第二腔。以下,第一腔將被簡稱為「腔」,並且將省略相對於以上說明而言為冗餘的任何說明,且將主要闡述相對於以上說明的差異。14 and 15 illustrate printed circuit boards according to other embodiments of the present invention. In the printed circuit board described with reference to FIGS. 14 and 15 , the first cavity completely penetrates the insulating
參照圖14,腔200在絕緣層100的厚度方向上完全穿透絕緣層100,且鍍覆層400的厚度與絕緣層100的厚度實質上相同。絕緣柱300嵌置於鍍覆層400之內。絕緣柱300的上表面及下表面可藉由腔200暴露出。14 , the
絕緣層100上可安裝有電子裝置610,且電子裝置610可:(i)安裝於絕緣層100上的絕緣材料110中,或(ii)安裝於絕緣材料110上。圖14示出(ii)的情形,其中電子裝置610安裝於絕緣材料110上。在兩種情形中,電子裝置610及鍍覆層400可藉由散熱通孔800彼此連接。
散熱通孔800是穿透絕緣材料110的通孔,以連接電子裝置610與鍍覆層400且與電子裝置610及鍍覆層400接觸。散熱通孔800在將由電子裝置610產生的熱量傳遞至鍍覆層400方面較在傳遞電性訊號方面具有更大的作用。因此,散熱通孔800可具有較形成於電路區中的一般通孔大的體積。散熱通孔800可被形成為多個,且所述多個散熱通孔800連接至單個接墊,且在其中絕緣材料100被形成為多個的情形中,可針對每一絕緣材料110形成散熱通孔800,且分別形成於不同的絕緣材料110處的散熱通孔800可彼此交疊以形成堆疊式結構。The heat dissipation via 800 is a via hole penetrating the insulating
參照圖15,腔200在絕緣層100的厚度方向上完全穿透絕緣層100,且鍍覆層400的厚度與絕緣層100的厚度實質上相同。絕緣柱300嵌置於鍍覆層400之內。絕緣柱300的上表面及下表面可藉由腔200暴露出。此外,電子裝置620並非安裝於絕緣層100中,而是安裝於絕緣層100上且被設置成與鍍覆層400接觸。Referring to FIG. 15 , the
具體而言,印刷電路板由彼此上下積層的多個絕緣層100構成。所述多個絕緣層100中的每一者包括:腔200,穿透絕緣層100;絕緣柱300,以絕緣柱300的側表面與絕緣層100分隔開的方式形成於腔200中;以及鍍覆層400,形成於腔200中除絕緣柱300之外的區中。Specifically, the printed wiring board is composed of a plurality of insulating
在此種情形中,電子裝置620可安裝於被置於所述多個絕緣層100中最外層(最上層或最下層)處的絕緣層100的鍍覆層400上並接觸所述鍍覆層400,且分別形成於不同的絕緣層100上的鍍覆層400可彼此堆疊以易於進行熱量傳遞。雖然圖15中示出分別形成於不同的絕緣層100上的絕緣柱300亦被堆疊,然而本發明並非侷限於圖15所示的結構。In this case, the
儘管本揭露包括具體實例,然而對於此項技術中具有通常知識者而言將顯而易見的是,在不背離申請專利範圍及其等效範圍的精神及範圍的條件下,可對這些實例作出各種形式及細節上的變化。本文所述的實例應被視為僅具有說明性意義而非用於限制。每一實例中的特徵或態樣的說明應被視為可適用於其他實例中的相似的特徵或態樣。若所述的技術以不同次序來執行及/或若所述系統、架構、裝置或電路中的部件以不同的方式進行組合及/或被替換為其他部件或其等效形式或者藉由其他部件或其等效形式來補充,則可達成合適的結果。因此,本揭露的範圍並非由詳細說明來界定,而是由申請專利範圍及其等效範圍來界定,且處於申請專利範圍及其等效範圍的範圍內的所有變型應被視為包括在本揭露中。Although this disclosure includes specific examples, it will be apparent to those skilled in the art that these examples can be made in various forms without departing from the spirit and scope of the claims and their equivalents and changes in details. The examples described herein should be considered in an illustrative sense only and not in a limiting sense. Descriptions of features or aspects in each example should be considered applicable to similar features or aspects in other examples. If the techniques described are performed in a different order and/or if components of the described systems, architectures, devices, or circuits are combined in different ways and/or are substituted for other components or their equivalents or by way of other components or its equivalent form, suitable results can be achieved. Therefore, the scope of the present disclosure is defined not by the detailed description but by the scope of the patent application and its equivalents, and all modifications within the scope of the patent application and its equivalents should be construed as being included in the present disclosure revealing.
100‧‧‧絕緣層110‧‧‧絕緣材料200‧‧‧第一腔300‧‧‧絕緣柱400‧‧‧鍍覆層410‧‧‧無電鍍覆層420‧‧‧電鍍層500‧‧‧第二腔600、610、620‧‧‧電子裝置700‧‧‧金屬結構800‧‧‧散熱通孔A‧‧‧鍍覆抑制劑A-A’、B-B’、C-C’、D-D’、F-F’‧‧‧線100‧‧‧Insulating
圖1示出根據本發明一個實施例的印刷電路板。FIG. 1 shows a printed circuit board according to one embodiment of the present invention.
圖2是印刷電路板的沿圖1所示A-A’線的剖視圖。Fig. 2 is a cross-sectional view of the printed circuit board along the line A-A' shown in Fig. 1 .
圖3是印刷電路板的沿圖1所示B-B’線的剖視圖。Fig. 3 is a cross-sectional view of the printed circuit board taken along the line B-B' shown in Fig. 1 .
圖4至圖10示出根據本發明一個實施例的製造印刷電路板的方法。4 to 10 illustrate a method of manufacturing a printed circuit board according to one embodiment of the present invention.
圖11示出根據本發明另一實施例的印刷電路板。FIG. 11 shows a printed circuit board according to another embodiment of the present invention.
圖12是印刷電路板的沿圖11所示D-D’線的剖視圖。Fig. 12 is a cross-sectional view of the printed circuit board taken along the line D-D' shown in Fig. 11 .
圖13是印刷電路板的沿圖11所示F-F’線的剖視圖。Fig. 13 is a cross-sectional view of the printed circuit board taken along the line F-F' shown in Fig. 11 .
圖14示出根據本發明又一實施例的印刷電路板。Figure 14 shows a printed circuit board according to yet another embodiment of the present invention.
圖15示出根據本發明再一實施例的印刷電路板。FIG. 15 shows a printed circuit board according to yet another embodiment of the present invention.
100‧‧‧絕緣層 100‧‧‧Insulating layer
200‧‧‧第一腔 200‧‧‧First cavity
300‧‧‧絕緣柱 300‧‧‧Insulation Column
400‧‧‧鍍覆層 400‧‧‧Coating
A-A’、B-B’‧‧‧線 A-A’, B-B’‧‧‧lines
Claims (15)
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KR10-2017-0153242 | 2017-11-16 | ||
??10-2017-0153242 | 2017-11-16 | ||
KR1020170153242A KR102505443B1 (en) | 2017-11-16 | 2017-11-16 | Printed circuit board |
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TW201924494A TW201924494A (en) | 2019-06-16 |
TWI771408B true TWI771408B (en) | 2022-07-21 |
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KR (1) | KR102505443B1 (en) |
TW (1) | TWI771408B (en) |
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US6009620A (en) | 1998-07-15 | 2000-01-04 | International Business Machines Corporation | Method of making a printed circuit board having filled holes |
JP2002164663A (en) | 2000-11-28 | 2002-06-07 | Hitachi Metals Ltd | Build-up core board, build-up wiring board, and manufacturing method thereof |
JP2008140954A (en) | 2006-12-01 | 2008-06-19 | Matsushita Electric Ind Co Ltd | Heat dissipating wiring board, manufacturing method thereof, and light emitting module using it |
JP4962228B2 (en) | 2006-12-26 | 2012-06-27 | 株式会社ジェイテクト | Multi-layer circuit board and motor drive circuit board |
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KR100945953B1 (en) * | 2007-11-23 | 2010-03-05 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
KR101084342B1 (en) | 2009-09-15 | 2011-11-17 | 안복만 | Heat dissipating circuit board |
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KR20140003227A (en) * | 2012-06-29 | 2014-01-09 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
KR20150143578A (en) | 2013-04-19 | 2015-12-23 | 메이코 일렉트로닉스 컴파니 리미티드 | Printed wiring board, manufacturing method for same, and thermally conductive body |
JP6365106B2 (en) * | 2014-08-18 | 2018-08-01 | 富士通株式会社 | Semiconductor device and manufacturing method of semiconductor device |
KR20160073766A (en) * | 2014-12-17 | 2016-06-27 | 삼성전기주식회사 | Flexible printed circuit board and manufacturing method thereof |
KR20170028710A (en) * | 2015-09-04 | 2017-03-14 | 삼성전기주식회사 | Printed circuit board and method of manufacturing the same |
-
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- 2017-11-16 KR KR1020170153242A patent/KR102505443B1/en active IP Right Grant
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- 2018-04-25 TW TW107113928A patent/TWI771408B/en active
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US20130010429A1 (en) * | 2009-09-09 | 2013-01-10 | Mitsubishi Materials Corporation | Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module |
TW201630496A (en) * | 2015-01-16 | 2016-08-16 | 臻鼎科技股份有限公司 | Printed circuit board with heat radiation structure and method manufacturing same |
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JP2019091875A (en) | 2019-06-13 |
KR20190056126A (en) | 2019-05-24 |
JP7059499B2 (en) | 2022-04-26 |
TW201924494A (en) | 2019-06-16 |
KR102505443B1 (en) | 2023-03-03 |
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