JP7059499B2 - Printed circuit board - Google Patents

Description

The present invention relates to a printed circuit board.

Due to the integration and thinning of electronic components mounted on printed circuit boards, heat dissipation characteristics in printed circuit boards containing fine patterns have become important issues. In the case of a printed circuit board containing electronic components, malfunctions and defects occur when the temperature rises above a certain level, and it is necessary to form a heat dissipation structure that can control these. Currently, the heat dissipation structure in the via form is manufactured by the fill plating method, and the area of the heat dissipation structure that can be manufactured by the fill plating method is limited.

Korean Publication No. 10-2011-0029422

An object of the present invention is to provide a printed circuit board on which a heat dissipation structure is formed.

According to one aspect of the present invention, an insulating layer, a first cavity opened to one surface of the insulating layer, and an insulating column formed in the first cavity so that the side surface is separated from the insulating layer. , A printed circuit board including a plating layer formed in a region of the first cavity excluding the insulating column is provided.

According to another aspect of the present invention, in a printed circuit board composed of a plurality of insulating layers laminated one above the other, each of the above insulating layers has a cavity penetrating the insulating layer and a side surface in the cavity. Provided is a printed circuit board including an insulating column formed so as to be separated from the insulating layer, and a plating layer formed in a region of the cavity excluding the insulating column.

It is a figure which shows the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the cross section along the AA' line of FIG. It is a figure which shows the cross section along the BB'line of FIG. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the cross section along the DD' line of FIG. It is a figure which shows the cross section along the FF'line of FIG. It is a figure which shows the printed circuit board which concerns on embodiment of this invention. It is a figure which shows the printed circuit board which concerns on embodiment of this invention.

In explaining the embodiment of the printed circuit board according to the present invention in detail with reference to the attached drawings and explaining with reference to the attached drawings, the same or corresponding components are designated by the same drawing reference numerals. Duplicate explanation is omitted.

Further, the terms such as "first" and "second" used below are merely identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are the first, second, etc. It is not limited by the term.

Further, "bonding" does not mean only the case where each component is in direct physical contact in the contact relationship between each component, and other components are interposed between the components. It is used as a concept that covers other configurations even when the components are in contact with each other.

1 is a diagram showing a printed circuit board according to an embodiment of the present invention, FIG. 2 is a diagram showing a cross section along the AA'line of FIG. 1, and FIG. 3 is a diagram showing a cross section of FIG. 1B. It is a figure which shows the cross section along the-B'line, and FIG. 4 to FIG. 10 is a figure which shows the manufacturing method of the printed circuit board which concerns on embodiment of this invention.

Referring to FIGS. 1 to 3, the printed circuit board according to the embodiment of the present invention includes an insulating layer 100, a first cavity 200, an insulating column 300, and a plating layer 400.

The insulating layer 100 is a material composed of an insulating substance such as a resin, and has a plate shape. As the resin of the insulating layer 100, various materials such as a thermosetting resin and a thermoplastic resin can be used, and specifically, an epoxy resin, a polyimide or the like can be used. Here, the epoxy resin includes, for example, naphthalene-based epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, novolak-based epoxy resin, cresol novolak-based epoxy resin, rubber-modified epoxy resin, and ring-type aliphatic epoxy. There are, but are not limited to, resins, silicon-based epoxy resins, nitrogen-based epoxy resins, phosphorus-based epoxy resins, and the like.

The insulating layer 100 can include a reinforcing material, and as the reinforcing material, glass fiber, an inorganic filler such as silica, or the like can be used.

The insulating layer 100 can be a prepreg (PPG) containing glass fibers or a build-up film (build up film) containing an inorganic filler. As this build-up film, ABF (Ajinomoto Build-up Film) or the like can be used.

In addition, the insulating layer 100 is made of a material having a low dielectric constant (Dk) and dielectric loss tangent (Df), for example, LCP (Liquid Crystal Polymer), PTFE (Polytetrafluoroalkoxylene), PPE (Polyphenylene Ether), COP (CycloOleform). , PFA (Perfluoroalkoxy) and the like.

The first cavity 200 is open to one surface of the insulating layer 100, and the first cavity 200 does not have to completely penetrate the insulating layer 100 in the thickness direction. Hereinafter, the case where the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction will be described, but the present invention is not limited to this structure.

The first cavity 200 can be formed by CNC machining, laser machining, photolithography, or the like, but is not limited thereto. The first cavity 200 is a portion in which the plating layer 400 described later is housed.

The insulating column 300 is formed in the first cavity 200, and the side surface of the insulating column 300 is separated from the insulating layer 100. That is, as shown in FIG. 2, the insulating column 300 is formed in an island shape inside the first cavity 200. A plurality of insulating columns 300 can be formed, and the plurality of insulating columns 300 are arranged apart from each other.

The insulating column 300 can be formed by removing the region of the insulating layer 100 excluding the insulating column 300 when the first cavity 200 is formed. In this case, the insulating column 300 can be formed of the same material as the insulating layer 100. Further, the height of the insulating column 300 may be substantially the same as the thickness of the insulating layer 100. Here, substantially the same is a concept including a margin of error.

However, the insulating column 300 does not necessarily have to be formed of the same material as the insulating layer 100, and can be attached to the inside of the first cavity 200 after the insulating column 300 is manufactured separately. In this case, the insulating column 300 is insulated. The layer 100 and the insulating column 300 can be made of different materials.

The insulating column 300 is a column having an upper surface and a lower surface, and the lower surface thereof contacts the bottom portion of the first cavity 200. Further, the shapes of the upper surface and the lower surface of the insulating pillar 300 are not limited, and can have various shapes such as a quadrangle, a circle, and a polygon. As shown in FIG. 1, the shape of the cross section of the insulating pillar 300 is It can contain vertices or sharp edges, and the sides can be curved. When the side in the cross section of the insulating column 300 is curved, the side surface of the insulating column 300 may be a curved surface recessed inward.

Plating of the insulating column 300 is suppressed by adsorbing the plating inhibitor A contained in the plating solution, whereby plating in the side surface direction in the first cavity 200 is suppressed, and the plating of the first cavity 200 is suppressed. Plating can be applied from the bottom to the top.

The area (volume) occupied by the insulating column 300 in the first cavity 200 is preferably the minimum, in order to maximize the area (volume) of the plating layer 400. As described above, when the side of the cross section of the insulating column 300 is a curved surface and the side surface of the insulating column 300 is a curved surface recessed inward, the insulating column 300 has an area of the insulating column 300 while having a sharp portion. (Volume) can be minimized. In addition, the adsorption rate of the plating inhibitor A in this sharp portion can be increased.

The plating layer 400 is formed in the first cavity 200 and fills the first cavity 200, but fills the region excluding the insulating column 300. The plating layer 400 can be made of a metal, and can be made of a metal having a high thermal conductivity in order to improve heat dissipation characteristics. Further, the plating layer 400 can be formed of the same metal as the circuit of the printed circuit board.

The plating layer 400 can include a seed layer, and the seed layer is an electroless plating layer 410 formed by electroless plating and can have a thickness of 2 μm or less. Further, the plating layer 400 can include an electrolytic plating layer 420, and the electrolytic plating layer 420 is formed on the electroless plating layer 410.

The seed layer (electroless plating layer 410) is entirely formed on the side surface and bottom of the first cavity 200 and the side surface of the insulating column 300, and the electroless plating layer 420 is an electroplating method using the electroless plating layer 410 as a lead wire. Is formed by.

The volume occupied by the plating layer 400 in the first cavity 200 is much larger than the volume occupied by the insulating column 300. Even when the cross-sectional area is taken into consideration, the area occupied by the plating layer 400 is much larger than the area occupied by the insulating column 300. This is because the plating layer 400 is responsible for the heat dissipation function, and the insulating column 300 is a structure that assists the formation of the plating layer 400, and only a minimum area is required.

On the other hand, the printed circuit board according to the embodiment of the present invention may further include a second cavity 500, an electronic element 600, and the like.

The second cavity 500 is open to the other surface of the insulating layer 100 and is located on the opposite side of the first cavity 200. The first cavity 200 occupies a part of the thickness of the insulating layer 100, the second cavity 500 occupies the rest of the thickness of the insulating layer 100, and the first cavity 200 and the second cavity 500 overlap each other. Formed (to communicate). The cross-sectional area of the first cavity 200 and the cross-sectional area of the second cavity 500 may be the same as each other, or the cross-sectional area of the first cavity 200 may be larger than the cross-sectional area of the second cavity 500. When the first cavity 200 and the second cavity 500 are in contact with each other, the second cavity 500 is in contact with the plating layer 400. As a result, the plating layer 400 formed in the first cavity 200 and the electronic element 600 mounted in the second cavity 500 come into contact with each other, and the heat generated from the electronic element 600 is released through the plating layer 400. obtain.

The electronic element 600 is an element mounted in the second cavity 500, and may include a passive element, an active element, an integrated circuit, and the like. When the electronic element 600 is mounted in the second cavity 500 by an adhesive, it can be brought into contact with the adhesive between the electronic element 600 and the plating layer 400. In this case, the adhesive may be a conductive adhesive having a high thermal conductivity.

Hereinafter, a method for manufacturing a printed circuit board according to an embodiment of the present invention will be described with reference to FIGS. 4 to 10.

Referring to FIG. 4, a first cavity 200 and an insulating column 300 are formed in the insulating layer 100. The first cavity 200 and the insulating column 300 can be formed by CNC processing, laser processing, or the like, and the first cavity 200 can be formed by processing a portion excluding the region of the insulating column 300. When the insulating layer 100 is photosensitive, the first cavity 200 can be formed by a photolithography process including exposure and development.

FIG. 5 is a diagram showing a cross section along the CC'line of FIG. 6 to 10 also show the state of the cross section of CC'.

Referring to FIG. 5, the first cavity 200 does not penetrate the entire thickness direction of the insulating layer 100, but only a part thereof, and the side surface of the insulating column 300 is separated from the insulating layer 100. A plurality of insulating columns 300 are arranged apart from each other.

Referring to FIG. 6, an electroless plating layer 410 is formed as a seed layer. The electroless plating layer 410 is formed on the side surface, the bottom portion, and the side surface of the insulating column 300 of the first cavity 200, and is also formed on one surface of the insulating layer 100. That is, the electroless plating layer 410 is formed on the entire surface of the insulating layer 100 in which the first cavity 200 and the insulating column 300 are formed. The electroless plating layer 410 can be formed of a metal such as copper or titanium.

Referring to FIG. 7, the electroplating layer 420 is formed on the electroless plating layer 410 in the first cavity 200. The electrolytic plating layer 420 can be formed by an electrolytic plating method, and can be formed of a metal such as copper. The plating solution for forming the electroless plating layer 410 contains a plating inhibitor A, and the plating inhibitor A suppresses the formation of the electroless plating layer 410 in a specific region. Most of the plating inhibitor A is adsorbed on the surface of the insulating layer 100 located on one surface of the insulating layer 100 and the surface of the insulating column 300 (in FIG. 7, the upper surface of the insulating layer 100 and the upper surface of the insulating column 300). It is hardly adsorbed inside the first cavity 200. This is because the adsorption rate of the plating inhibitor A on the surface of the insulating layer 100 that comes into contact with the plating solution first is high, and the deeper the inflow of the plating solution, the lower the adsorption rate of the plating inhibitor A. .. As a result, as shown in FIG. 7, the plating inhibitor A is adsorbed on one surface of the insulating layer 100 and the surface excluding the (most) side surfaces of the insulating column 300, and in this process, one of the plating inhibitors A. The portions may be adsorbed on the upper surface of the insulating layer 100 and the side surfaces of the first cavity 200 and the insulating column 300 near the upper surface of the insulating column 300. Due to the influence of the plating inhibitor A, the lateral growth of the electroless plating layer 410 is suppressed, but the upward growth with almost no influence of the plating inhibitor A is maintained. Therefore, the electroless plating layer 410 grows upward from the bottom surface of the first cavity 200, and the growth of the plating layer 400 in the lateral direction is suppressed, so that dimples do not occur in the plating layer 400. The thickness of the growing plating layer 400 becomes relatively uniform. When the plating layer 400 is formed by this method, the plating layer 400 can be uniformly grown on a very large area, and a large-scale (volume) plating layer 400 can be formed.

Referring to FIG. 8, the growth of the electroless plating layer 410 is completed. The electroless plating layer 410 can grow up to one surface of the insulating layer 100 by growing upward.

Referring to FIG. 9, the electroless plating layer 410 is removed. The electroless plating layer 410 is removed by flash etching or the like, but in this process, the plating inhibitor A is also removed, and a part of the uppermost portion of the electrolytic plating layer 420 is removed, so that the thickness of the plating layer 400 is thickened. The deviation of the plating is reduced.

Referring to FIG. 10, a second cavity 500 is formed and an electronic element 600 is mounted. The second cavity 500 is formed so that the plating layer 400 is exposed through the second cavity 500, and the electronic element 600 is mounted in contact with the plating layer 400. As a result, the heat generated from the electronic element 600 is transferred to the plating layer 400. However, the electronic element 600 can also be mounted in the second cavity 500 by an adhesive, and in this case, the electronic element 600 can be in contact with the plating layer 400 via an adhesive instead of being in direct contact with the plating layer 400. However, even in this case, a conductive adhesive can be used so that the adhesive can contribute to heat conduction. That is, in either case, the heat generated from the electronic element 600 is transferred to the plating layer 400.

On the other hand, the second cavity 500 does not necessarily have to be formed after the formation of the plating layer 400. The plating layer 400 may be formed after the first cavity 200 and the second cavity 500 are formed first, and if necessary, a part of the insulating layer 100 may be formed between the first cavity 200 and the second cavity 500. It may remain. However, even in this case as well, it is necessary to have a minimum thickness so that the remaining part of the insulating layer 100 does not interfere with heat transfer.

11 is a diagram showing a printed circuit board according to an embodiment of the present invention, FIG. 12 is a diagram showing a cross section along the DD'line of FIG. 11, and FIG. 13 is a diagram showing a cross section of FIG. 11F. It is a figure which shows the cross section along the-F'line.

The contents described with reference to FIGS. 1 to 10 can be applied as they are to the printed circuit boards shown in FIGS. 11 to 13. Therefore, in the following, the contents overlapping with the contents described with reference to FIGS. 1 to 10 will be briefly described, but the parts not explained will not be excluded from the present embodiment.

Referring to FIG. 11, the printed circuit board according to the embodiment of the present invention includes an insulating layer 100, a first cavity 200, an insulating column 300, a plating layer 400, and further includes a metal structure 700. Can be done.

The insulating layer 100 is a material composed of an insulating substance such as a resin, and has a plate shape. The resin of the insulating layer 100 is the same as that described with reference to FIGS. 1 to 10.

The first cavity 200 is open to one surface of the insulating layer 100, and the first cavity 200 does not have to completely penetrate the insulating layer 100 in the thickness direction. If necessary, the first cavity 200 can completely penetrate the insulating layer 100. Hereinafter, the case where the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction will be described, but the present invention is not limited to this structure. The first cavity 200 can be formed by CNC machining, laser machining, photolithography, or the like, but is not limited thereto.

The insulating column 300 is formed in the first cavity 200, and the side surface of the insulating column 300 is separated from the insulating layer 100. That is, as shown in FIG. 12, the insulating column 300 is formed in an island shape inside the first cavity 200. A plurality of insulating columns 300 can be formed, and the plurality of insulating columns 300 are arranged apart from each other.

The insulating column 300 can be formed of the same material as the insulating layer 100. Further, the height of the insulating column 300 may be substantially the same as the thickness of the insulating layer 100. The insulating column 300 does not necessarily have to be formed of the same material as the insulating layer 100, and the insulating layer 100 and the insulating column 300 may be formed of different materials from each other.

The insulating column 300 is a column having an upper surface and a lower surface, and the lower surface thereof contacts the bottom portion of the first cavity 200. Further, the shapes of the upper surface and the lower surface of the insulating pillar 300 are not limited, and can have various shapes such as a quadrangle, a circle, and a polygon, and the shape of the cross section of the insulating pillar 300 has a vertex or a sharp portion. It can have and the sides can be curved. When the side of the cross section of the insulating column 300 is curved, the side surface of the insulating column 300 can have a curved surface recessed inward.

The plating layer 400 is formed in the first cavity 200 and fills the first cavity 200, but fills the region excluding the insulating column 300. The plating layer 400 can be formed of a metal, and can be formed of a metal having a high thermal conductivity in order to improve heat dissipation characteristics. Alternatively, the plating layer 400 can be formed of the same metal as the circuit of the printed circuit board.

The plating layer 400 can include a seed layer, and the seed layer is an electroless plating layer 410 formed by electroless plating and can have a thickness of 2 μm or less. Further, the plating layer 400 can include an electrolytic plating layer 420, and the electrolytic plating layer 420 is formed on the electroless plating layer 410. The seed layer (electroless plating layer 410) is entirely formed on the side surface and bottom of the first cavity 200 and the side surface of the insulating column 300, and the electroless plating layer 420 is an electroplating method using the electroless plating layer 410 as a lead wire. Is formed by.

The metal structure 700 is formed on the plating layer 400 and increases the surface area of the individual involved in heat dissipation of the printed circuit board. The metal structure 700 is in contact with the plating layer 400 and does not cover the insulating column 300. When a plurality of insulating columns 300 are formed, the metal structure 700 can be formed between the plurality of insulating columns 300.

In FIGS. 11 and 12, the metal structure 700 is shown in a long rectangular parallelepiped shape, but is not limited to this shape. Like the plating layer 400, the metal structure 700 can also be formed by a plating method, and can include an electroless plating layer 410 and an electrolytic plating layer 420. Further, the metal structure 700 can be formed of the same metal as the plating layer 400. For example, both the plating layer 400 and the metal structure 700 can be formed of copper.

The printed circuit board according to the embodiment of the present invention may further include a second cavity 500, an electronic element 600, and the like.

The second cavity 500 is open to the other surface of the insulating layer 100 and is located on the opposite side of the first cavity 200. The first cavity 200 occupies a part of the thickness of the insulating layer 100, the second cavity 500 occupies the rest of the thickness of the insulating layer 100, and the first cavity 200 and the second cavity 500 overlap each other. Formed (to communicate). The cross-sectional area of the first cavity 200 and the cross-sectional area of the second cavity 500 may be the same as each other, or the cross-sectional area of the first cavity 200 may be larger than the cross-sectional area of the second cavity 500.

When the first cavity 200 and the second cavity 500 are in contact with each other, the second cavity 500 is in contact with the plating layer 400. As a result, the plating layer 400 formed in the first cavity 200 and the electronic element 600 mounted in the second cavity 500 come into contact with each other, and the heat generated from the electronic element 600 is generated in the plating layer 400 and the metal structure. It can be released via 700.

The electronic element 600 is an element mounted in the second cavity 500, and may include a passive element, an active element, an integrated circuit, and the like. When the electronic element 600 is mounted in the second cavity 500 by an adhesive, the electronic element 600 and the plating layer 400 can be in contact with each other via an adhesive. In this case, as the adhesive, a conductive adhesive having a high thermal conductivity can be used.

14 and 15 are views showing a printed circuit board according to another embodiment of the present invention. In the printed circuit board shown in FIGS. 14 and 15, the first cavity completely penetrates the insulating layer 100 in the thickness direction, and the second cavity does not exist. Hereinafter, the first cavity will be referred to as a “cavity”, the description overlapping with the above description will be omitted, and the description will be focused on the differences from the above-described embodiment.

Referring to FIG. 14, the cavity 200 completely penetrates the insulating layer 100 in the thickness direction, and the thickness of the plating layer 400 is substantially the same as the thickness of the insulating layer 100.

The insulating column 300 is embedded inside the plating layer 400. The upper and lower surfaces of the insulating column 300 can be exposed through the cavity 200.

An electronic element 600 can also be mounted on the insulating layer 100, and the electronic element 610 is either (i) incorporated inside the insulating material 110 on the insulating layer 100, or (ii) the insulating material. It can be mounted on 110.

FIG. 14 shows an example of (ii) in which the electronic element 610 is mounted on the insulating material 110. In either case, the electronic element 610 and the plating layer 400 can be connected via the heat dissipation via 800.

The heat radiation via 800 is a via that penetrates the insulating material 110 in order to connect the electronic element 610 and the plating layer 400, and is in contact with all of the electronic element 610 and the plating layer 400. The heat radiating via 800 has a greater role of transmitting the heat generated from the electronic element 610 to the plating layer 400 than the role of transmitting an electric signal. Therefore, the heat dissipation via 800 can have a larger volume than the general via formed in the circuit region.

A plurality of heat radiation vias 800 are formed, and a plurality of vias can be connected by one pad. When there are a plurality of insulating materials 110, heat radiation vias 800 are formed for each insulating material 110, and different insulating materials 110 are formed. The heat dissipation vias 800 formed in can have a stack structure arranged so as to overlap each other.

Referring to FIG. 15, the cavity 200 completely penetrates the insulating layer 100 in the thickness direction, and the thickness of the plating layer 400 is substantially the same as the thickness of the insulating layer 100.

The insulating column 300 is embedded inside the plating layer 400. The upper and lower surfaces of the insulating column 300 can be exposed through the cavity 200.

Further, the electronic element 620 is not mounted in the insulating layer 100, but is mounted on the insulating layer 100, but is arranged so as to be in contact with the plating layer 400.

Specifically, the printed circuit board is composed of a plurality of insulating layers 100 laminated one above the other, and each insulating layer 100 has a cavity 200 penetrating the insulating layer 100 and an insulating layer whose side surface is inside the cavity 200. It includes an insulating column 300 formed apart from 100 and a plating layer 400 formed in a region of the cavity 200 excluding the insulating column 300.

In this case, the electronic element 620 is mounted so as to be in contact with the plating layer 400 of the insulating layer 100'located in the outermost layer (top layer or bottom layer) of the plurality of insulating layers 100, and the insulating layers 100 are different from each other. The plating layers 400 formed in the above can be designed so as to be stacked with each other to facilitate heat transfer. In FIG. 15, insulating columns 300 formed on different insulating layers 100 are shown in a stack structure, but are not limited thereto.

Although one embodiment of the present invention has been described above, if the person has ordinary knowledge in the technical field, the addition of components can be performed within the range not deviating from the idea of the present invention described in the claims. The present invention can be variously modified and changed by modification, deletion, addition, etc., and it can be said that this is also included in the scope of the present invention.

100, 100'Insulation layer 110 Insulation material 200 First cavity 300 Insulation pillar 400 Plating layer 410 Electroless plating layer 420 Electroplating layer 500 Second cavity 600, 610, 620 Electronic element 700 Metal structure 800 Heat dissipation via A Plating inhibitor

Claims (16)

Insulation layer and
The first cavity opened on one surface of the insulating layer and
In the first cavity, an insulating column whose side surface is formed so as to be separated from the insulating layer,
A plating layer formed in a region of the first cavity excluding the insulating column,
Printed circuit board including. The printed circuit board according to claim 1, wherein the insulating column is made of the same insulating material as the insulating layer. The printed circuit board according to claim 1 or 2, wherein a plurality of the insulating columns are formed, and the plurality of insulating columns are arranged apart from each other. The plating layer is
Electroless plating layer and
Includes an electrolytic plating layer formed on the electroless plating layer.
The printed circuit board according to any one of claims 1 to 3, wherein the electroless plating layer is formed on the side surface, the bottom surface, and the side surface of the insulating column of the first cavity. A second cavity opened to the other surface of the insulating layer,
The printed circuit board according to any one of claims 1 to 4, further comprising an electronic element mounted in the second cavity. The printed circuit board according to claim 5, wherein the second cavity is in contact with the plating layer. The printed circuit board according to any one of claims 1 to 6, wherein the volume of the insulating column is smaller than the volume of the plating layer. The cross-sectional area of the insulating column is a figure having a plurality of vertices.
The printed circuit board according to any one of claims 1 to 7, wherein the side surface of the insulating column is a curved surface recessed inward. The printed circuit board according to any one of claims 1 to 8, further comprising a metal structure formed on the plating layer. A plurality of the insulating columns are formed.
The printed circuit board according to claim 9, wherein the metal structure is formed between the plurality of insulating columns. The printed circuit board according to claim 9 or 10, wherein the metal structure is made of the same metal as the metal forming the plating layer. The insulating material laminated on one surface of the insulating layer and
An electronic element mounted inside or on the insulating material, and
The printed circuit board according to any one of claims 1 to 11, further comprising a heat-dissipating via that penetrates the insulating material and connects the electronic element and the plating layer. The first cavity is opened to one surface and the other surface of the insulating layer.
The printed circuit board according to claim 12, wherein the thickness of the plating layer is the same as the thickness of the insulating layer. In a printed circuit board composed of a plurality of insulating layers laminated one above the other.
Each of the insulating layers is
A cavity that penetrates the insulating layer and
An insulating column whose side surface is formed in the cavity so as to be separated from the insulating layer,
A plating layer formed in the region of the cavity excluding the insulating column,
Printed circuit board including. The printed circuit board according to claim 14, further comprising an electronic element mounted so as to be in contact with the plating layer of the insulating layer located at the outermost layer among the plurality of insulating layers. The printed circuit board according to claim 14 or 15, wherein the plating layers formed on different insulating layers are in contact with each other.

Images