TW201924494A - Printed circuit board - Google Patents

Abstract

A printed circuit board in accordance with an aspect of the present invention includes: insulating layer; first cavity that is open through one surface of the insulating layer; insulation column formed in the first cavity in such a way that lateral surface thereof is separated from the insulating layer; and plating layer formed in regions excluding the insulation column in the first cavity.

Description

A printed circuit board

This invention relates to a printed circuit board.

As electronic components mounted on printed circuit boards become more compact and thinner, the heat dissipation properties of printed circuit boards containing fine patterns have become an important issue. Printed circuit boards, including electronic components, experience failures and defects above a certain temperature, and therefore require a heat dissipation structure to control faults and defects. Conventionally, a through-hole type heat dissipation structure is formed by filling a fill plating process, but the area of the heat dissipation structure which can be formed by the filling plating process is limited.

The related art is described in Korean Patent Publication No. 10-2011-0029422 (March 23, 2011).

The present invention is directed to a printed circuit board having a heat dissipation structure.

An aspect of the present invention provides a printed circuit board including: an insulating layer; a first cavity opening through a surface of the insulating layer; an insulating pillar having a lateral surface of the insulating pillar and the An insulating layer is formed in the first cavity in a spaced apart manner; and a plating layer is formed in a region of the first cavity other than the insulating pillar.

Another aspect of the present invention provides a printed circuit board comprising a plurality of insulating layers laminated one on another. Each of the plurality of insulating layers includes: a cavity penetrating the insulating layer; and an insulating pillar formed in the cavity in such a manner that a side surface of the insulating pillar is spaced apart from the insulating layer; And a plating layer formed in the cavity in a region other than the insulating pillar.

The following detailed description is provided to assist the reader in a comprehensive understanding of the methods, devices and/or systems described herein. Various changes, modifications, and equivalents of the methods, devices, and/or systems described herein will be apparent to those of ordinary skill in the art. The order of the operations described herein is merely an example, and is not limited to the order described herein, but may be performed as would be apparent to one of ordinary skill in the art, except where operations must occur in a certain order. change. Moreover, in order to increase clarity and conciseness, descriptions of functions and configurations well known to those of ordinary skill in the art may be omitted.

The features described herein can be implemented in many different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided to be thorough and complete, and the full scope of the disclosure will be conveyed to those of ordinary skill in the art.

Unless otherwise defined, all terms including technical terms and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. Any term defined in a commonly used dictionary should be understood to have the same meaning in the context of the related art, and should not be interpreted as having an ideal or too formal meaning unless explicitly defined otherwise.

Regardless of the figure number, the same or corresponding elements will be given the same reference numerals, and any redundant description of the same or corresponding elements will not be repeated. Throughout the description of the present disclosure, when it is determined that a related conventional technique is set forth to avoid the gist of the disclosure, the detailed description of the coherent will be omitted. Terms such as "first" and "second" may be used in the description of various elements, but the above elements should not be limited to the above terms. The above terms are only used to distinguish between components. In the figures, some of the elements may be exaggerated, omitted, or briefly described, and the dimensions of the elements do not necessarily reflect the actual dimensions of the elements.

Hereinafter, some embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

Figure 1 shows a printed circuit board in accordance with one embodiment of the present invention. Figure 2 is a cross-sectional view of the printed circuit board taken along line A-A' of Figure 1. Figure 3 is a cross-sectional view of the printed circuit board taken along line B-B' of Figure 1. 4 through 10 illustrate a method of fabricating a printed circuit board in accordance with one embodiment of the present invention.

Referring to FIGS. 1 through 3, a printed circuit board according to an embodiment includes an insulating layer 100, a first cavity 200, an insulating pillar 300, and a plating layer 400.

The insulating layer 100 is made of an insulating material such as resin and has a plate shape. The resin of the insulating layer 100 may be any of various resins such as a thermosetting resin or a thermoplastic resin, and specifically may be an epoxy resin or a polyimide. Here, for example, the epoxy resin may be, but not limited to, a naphthalene type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a novolac epoxy resin, a cresol novolac epoxy resin, a rubber modification Epoxy resin, cyclic aliphatic epoxy resin, bismuth epoxy resin, nitrogen epoxy resin or phosphorus epoxy resin.

The insulating layer 100 may contain a stiffener, which may be a glass cloth or an inorganic filler such as ruthenium dioxide. The insulating layer 100 may be a prepreg (PPG) containing a glass cloth or a build-up film containing an inorganic filler therein. An example of the buildup film may be Ajinomoto Build-up Film (ABF).

The insulating layer 100 may be made of a material having a low dielectric constant (Dk) and a dielectric dissipation factor (Df), for example, liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), poly Polyphenylene Ether (PPE), Cyclo Olefin Polymer (COP) or Perfluoroalkoxy (PFA).

The first cavity 200 is opened through one surface of the insulating layer 100, and may not completely penetrate the insulating layer 100 in the thickness direction of the insulating layer 100. Hereinafter, the case where the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 will be explained, but the present invention should not be limited to the structure described herein. The first cavity 200 can be formed by, but not limited to, a Computer Numerical Control (CNC) process, a laser process, or a lithography process. The cavity 200 becomes a part in which the plating layer 400 will be received, which will be described later.

The insulating pillar 300 is formed in the first cavity 200, and a side surface of the insulating pillar 300 is spaced apart from the insulating layer 100. That is, as shown in FIG. 2, the insulating post 300 is formed in an island shape inside the first cavity 200. The insulating pillar 300 may be formed in plurality, and the plurality of insulating pillars 300 are spaced apart from each other.

Such an insulating pillar 300 can be fabricated by removing a region other than the insulating pillar 300 from the insulating layer 100 when the first cavity 200 is formed. In this case, the insulating pillar 300 may be formed of the same material as the insulating layer 100. Further, the height of the insulating pillar 300 may be substantially the same as the thickness of the insulating layer 100. Here, "substantially the same" is a concept including tolerance.

However, the insulating pillars 300 are not necessarily made of the same material as the insulating layer 100, and the insulating pillars 300 may be separately fabricated and then attached in the first cavity 200, in which case the insulating layer 100 and the insulating pillars 300 may be formed of materials different from each other.

The insulating post 300 is in the shape of a post having an upper surface and a lower surface, and the lower surface contacts the bottom portion of the first cavity 200. Further, the shapes of the upper surface and the lower surface of the insulating post 300 are not limited to any particular shape, but may be any of various shapes including a rectangle, a circle, and a polygon. As shown in FIG. 1, the shape of the transverse cross section of the insulating post 300 may include a vertex or a sharp corner, and each side of the transverse cross section of the insulating post 300 may be curved. In the case where each side of the lateral section of the insulating pillar 300 is a curved line, the side surface of the insulating pillar 300 may be a curved surface recessed toward the inside of the insulating pillar 300.

The insulating pillar 300 adsorbs the plating inhibitor A (shown in FIG. 7) contained in the plating solution, and thus the plating can be suppressed. Therefore, the plating can be suppressed in the lateral direction in the first chamber 200, but plating can be performed from the bottom surface of the first chamber 200 in the upward direction.

Preferably, the area (volume) occupied by the insulating pillars 300 in the first chamber 200 is extremely small, and this is to maximize the area (volume) of the plating layer 400. In the case where each side of the lateral section of the insulating pillar 300 is a curved line and the side surface of the insulating pillar 300 is a curved surface recessed inward as described above, the insulating pillar 300 may have a sharp corner and have a very small area (volume). In addition, the adsorption ratio of the plating inhibitor A can be increased at these sharp corners.

The plating layer 400 is formed in the first cavity 200 and filled in the first cavity 200 except at the insulating post 300. The plating layer 400 may be made of a metal (especially a metal having a high thermal conductivity) to improve heat dissipation properties. Alternatively, the plating layer 400 can be made of the same metal as the circuit of the printed circuit board.

The plating layer 400 may include a seed layer which is an electroless plating layer 410 formed by electroless plating and having a thickness of 2 μm or less. Further, the plating layer 400 may include a plating layer 420 formed on the electroless plating layer 410. A seed layer (electroless plating layer 410) is formed on the entire side surface and bottom portion of the first cavity 200 and the entire side surface of the insulating pillar 300, and the plating layer 420 is formed using an electroless plating layer 410 as a lead (lead) -in wire) formed by electroplating.

The volume occupied by the plating layer 400 in the first cavity 200 is significantly larger than the volume occupied by the insulating pillars 300. Even considering the lateral cross-sectional area, the area occupied by the plated layer 400 is much larger than the area occupied by the insulating stud 300. This is because the plating layer 400 acts as a heat sink, and the insulating pillar 300 is a structure for helping to form the plating layer 400 and thus requires a very small area.

Meanwhile, the printed circuit board according to an embodiment of the present invention may further include the second cavity 500 and the electronic device 600.

The second cavity 500 is open toward the other surface of the insulating layer 100 and is placed on the opposite side of the first cavity 200. The first cavity 200 occupies a portion of the thickness of the insulating layer 100, and the second cavity 500 occupies the remaining portion of the thickness of the insulating layer 100, and the first cavity 200 and the second cavity 500 are formed to overlap each other (ie, connect) . The lateral cross-sectional area of the first cavity 200 may be the same as the lateral cross-sectional area of the second cavity 500, or the lateral cross-sectional area of the first cavity 200 may be greater than the transverse cross-sectional area of the second cavity 500. When the first cavity 200 and the second cavity 500 are adjacent to each other, the second cavity 500 is in contact with the plating layer 400. Therefore, the plating layer 400 formed in the first cavity 200 and the electronic device 600 mounted in the second cavity 500 are in contact with each other, and thus the heat generated by the electronic device 600 can be dissipated by the plating layer 400.

The electronic device 600 is a device that is mounted in the second cavity 500 and may include, for example, a passive device, an active device, and an integrated circuit. In the case where the electronic device 600 is mounted in the second cavity 500 using an adhesive, the electronic device 600 may be in contact with the plating layer 400 by using an adhesive between the electronic device 600 and the plating layer 400. In this case, the binder may be a conductive adhesive having a high thermal conductivity.

Hereinafter, a method of manufacturing a printed circuit board according to an embodiment of the present invention will be explained with reference to FIGS. 4 through 10.

Referring to FIG. 4, a first cavity 200 and an insulating pillar 300 are formed on the insulating layer 100. The first cavity 200 and the insulating pillar 300 may be formed, for example, by a computer numerical control process or a laser process, and the first cavity 200 may be formed by processing a portion other than the insulating pillar 300. Further, in the case where the insulating layer 100 is photosensitive, the first cavity 200 can be formed by a lithography process including exposure and development.

Figure 5 is a cross-sectional view taken along line C-C' of Figure 4 . 6 to 10 show a C-C' cross section. Referring to FIG. 5, the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction instead of completely penetrating the insulating layer 100, and the side surface of the insulating pillar 300 is spaced apart from the insulating layer 100, and the plurality of insulating pillars 300 are disposed. Separated from each other.

Referring to Fig. 6, an electroless plating layer 410 is formed as a seed layer. The electroless plating layer 410 is formed on the side surface and the bottom portion of the first cavity 200 and the side surface of the insulating pillar 300 and one surface of the insulating layer 100. That is, an electroless plating layer 410 is formed on each surface of the insulating layer 100 on which the first cavity 200 and the insulating pillar 300 are formed. The electroless plating layer 410 may be made of a metal such as copper or titanium.

Referring to FIG. 7, a plating layer 420 is formed on the electroless plating layer 410 in the first chamber 200. The plating layer 420 can be formed by electroplating and can be made of a metal such as copper. The plating solution for forming the electroless plating layer 410 contains the plating inhibitor A therein to suppress the formation of the electroless plating layer 410 at a specific region. Most of the plating inhibitor A is adsorbed to the surface of the insulating layer 100 and the surface of the insulating pillar 300 on one surface of the insulating layer 100 (the upper surface of the insulating layer 100 and the upper surface of the insulating pillar 300 in FIG. 7), And it is hardly adsorbed to the inside of the first chamber 200. This is because the adsorption ratio of the plating inhibitor A is higher on the surface of the insulating layer 100 which is first contacted with the plating solution, and becomes lower as the plating solution enters the first chamber 200 deeper.

Therefore, as shown in FIG. 7, the plating inhibitor A is adsorbed to one surface of the insulating layer 100 and the surface of the insulating pillar 300 except for its (most) side surface, during which the plating inhibitor Some of A may be adsorbed to the upper surface of the insulating layer 100 and the side surface of the first cavity 200 and the side surface of the insulating post 300 that is very close to the upper surface of the insulating post 300. Due to such a plating inhibitor A, the lateral growth of the electroless plating layer 410 is suppressed, and the growth of the electroless plating layer 410 which is less affected by the plating inhibitor A is maintained. Therefore, the electroless plating layer 410 is grown upward from the bottom surface of the first cavity 200, and since the lateral direction growth of the plating layer 400 is suppressed, no pits are formed in the plating layer 400, and the plating layer 400 is not present. It is grown in a relatively uniform thickness. By forming the plating layer 400 as described herein, the plating layer 400 can be uniformly grown in a very large area, and a large-scale (volume) plating layer 400 can also be formed.

Referring to Figure 8, the growth of the electroless plating layer 410 is completed. The electroless plating layer 410 may be grown to the one surface of the insulating layer 100 by growth in the upward direction.

Referring to Figure 9, the electroless plating layer 410 is removed. The electroless plating layer 410 is removed, for example, by flash etching, during which the plating inhibitor A is also removed, and since the uppermost portion of the plating layer 420 is partially removed, plating is performed. The thickness deviation of layer 400 is reduced.

Referring to FIG. 10, a second cavity 500 is formed, and the electronic device 600 is mounted. The second cavity 500 is formed in such a manner that the plating layer 400 is exposed by the second cavity 500, and the electronic device 600 is mounted in contact with the plating layer 400. Therefore, the heat generated by the electronic device 600 is transferred to the plating layer 400. Nevertheless, the electronic device 600 can be mounted in the second cavity 500 by an adhesive. In this case, the electronic device 600 can utilize the adhesive and the plating layer sandwiched between the electronic device 600 and the plating layer 400. 400 contacts, rather than direct contact with the plating layer 400. In this case, a conductive adhesive can be used so that the adhesive can contribute to heat transfer. In any event, the heat generated by the electronic device 600 is transferred to the plating layer 400.

Meanwhile, the second cavity 500 is not necessarily formed after the plating layer 400 is formed. The plating layer 400 may be formed after the first cavity 200 and the second cavity 500 are first formed, and the insulating layer 100 may be partially left between the first cavity 200 and the second cavity 500 as necessary. In this case, preferably, the partially retained insulating layer 100 has an extremely small thickness so as not to affect heat transfer.

Figure 11 shows a printed circuit board in accordance with another embodiment of the present invention. Figure 12 is a cross-sectional view of the printed circuit board taken along the line D-D' shown in Figure 11, and Figure 13 is a cross-sectional view of the printed circuit board taken along the line F-F' shown in Figure 11 . The same description as provided with reference to FIGS. 1 through 10 can be applied to the printed circuit board shown in FIGS. 11 to 13. Therefore, any redundant description made with reference to FIGS. 1 through 10 will be simplified or omitted, but this does not mean that such omitted or simplified description is excluded from the present embodiment.

Referring to FIG. 11, the printed circuit board according to the present embodiment includes an insulating layer 100, a first cavity 200, an insulating pillar 300, and a plating layer 400, and may further include a metal structure 700.

The insulating layer 100 is made of an insulating material such as resin and has a plate shape. The resin of the insulating layer 100 is explained above with reference to FIGS. 1 to 10.

The first cavity 200 is opened through one surface of the insulating layer 100, and may not completely penetrate the insulating layer 100 in the thickness direction of the insulating layer 100. The first cavity 200 may completely penetrate the insulating layer 100 as necessary. Hereinafter, the case where the first cavity 200 partially penetrates the insulating layer 100 in the thickness direction of the insulating layer 100 will be explained, but the present invention should not be limited to the structure described herein. The first cavity 200 can be formed by, but not limited to, a computer numerical control process, a laser process, or a lithography process.

The insulating pillar 300 is formed in the first cavity 200, and a side surface of the insulating pillar 300 is spaced apart from the insulating layer 100. That is, as shown in FIG. 12, the insulating post 300 is formed in an island shape inside the first cavity 200. The insulating pillar 300 may be formed in plurality, and the plurality of insulating pillars 300 are spaced apart from each other.

The insulating pillar 300 may be formed of the same material as the insulating layer 100. Further, the height of the insulating pillar 300 may be substantially the same as the thickness of the insulating layer 100. The insulating pillar 300 does not necessarily have to be made of the same material as the insulating layer 100, and the insulating layer 100 and the insulating pillar 300 may be formed of materials different from each other.

The insulating post 300 is in the shape of a post having an upper surface and a lower surface, and the lower surface contacts the bottom portion of the first cavity 200. Further, the shapes of the upper surface and the lower surface of the insulating post 300 are not limited to any particular shape, but may be any of various shapes including a rectangle, a circle, and a polygon. The shape of the transverse cross section of the insulating stud 300 may include a vertex or a sharp corner, and each side of the transverse cross section of the insulating post 300 may be a curved line. In the case where each side of the lateral section of the insulating pillar 300 is a curved line, the side surface of the insulating pillar 300 may be a curved surface recessed toward the inside of the insulating pillar 300.

The plating layer 400 is formed in the first cavity 200 and filled in the first cavity 200 except at the insulating post 300. The plating layer 400 may be made of a metal (especially a metal having a high thermal conductivity) to improve heat dissipation properties. Alternatively, the plating layer 400 can be made of the same metal as the circuit of the printed circuit board.

The plating layer 400 may include a seed layer which is an electroless plating layer 410 formed by electroless plating and having a thickness of 2 μm or less. Further, the plating layer 400 may include a plating layer 420 formed on the electroless plating layer 410. A seed layer (electroless plating layer 410) is formed on the entire side surface and bottom portion of the first cavity 200 and the entire side surface of the insulating pillar 300, and the plating layer 420 is borrowed using the electroless plating layer 410 as a lead-in wire. Formed by electroplating.

The metal structure 700 is a portion formed on the plating layer 400 to increase the surface area of the article involved in heat dissipation of the printed circuit board. The metal structure 700 is in contact with the plating layer 400 and does not cover the insulating pillars 300. In the case where the insulating pillars 300 are formed in plurality, the metal structure 700 may be formed between the plurality of insulating pillars 300.

While the metal structure 700 is illustrated in FIGS. 11 and 12 as an elongated cube shape, the metal structure 700 is not necessarily limited to the shapes shown herein. The metal structure 700 can also be formed by a plating process like the plating layer 400, and can include an electroless plating layer 410 and a plating layer 400. Further, the metal structure 700 may be made of the same material as the plating layer 400. For example, both the plating layer 400 and the metal structure 700 can be made of copper.

The printed circuit board according to the embodiment may further include the second cavity 500 and the electronic device 600.

The second cavity 500 is open toward the other surface of the insulating layer 100 and is placed on the opposite side of the first cavity 200. The first cavity 200 occupies a portion of the thickness of the insulating layer 100, and the second cavity 500 occupies the remaining portion of the thickness of the insulating layer 100, and the first cavity 200 and the second cavity 500 are formed to overlap each other (ie, connect) . The lateral cross-sectional area of the first cavity 200 may be the same as the lateral cross-sectional area of the second cavity 500, or the lateral cross-sectional area of the first cavity 200 may be greater than the transverse cross-sectional area of the second cavity 500. When the first cavity 200 and the second cavity 500 are adjacent to each other, the second cavity 500 is in contact with the plating layer 400. Therefore, the plating layer 400 formed in the first cavity 200 and the electronic device 600 mounted in the second cavity 500 are in contact with each other, and thus the heat generated by the electronic device 600 can be dissipated by the plating layer 400.

The electronic device 600 is a device that is mounted in the second cavity 500 and may include, for example, a passive device, an active device, and an integrated circuit. In the case where the electronic device 600 is mounted in the second cavity 500 using an adhesive, the electronic device 600 may be in contact with the plating layer 400 by using an adhesive between the electronic device 600 and the plating layer 400. In this case, the binder may be a conductive adhesive having a high thermal conductivity.

14 and 15 illustrate a printed circuit board in accordance with other embodiments of the present invention. In the printed circuit board described with reference to FIGS. 14 and 15, the first cavity completely penetrates the insulating layer 100 in the thickness direction of the insulating layer 100, and thus there is no second cavity. Hereinafter, the first cavity will be simply referred to as "cavity", and any explanation that is redundant with respect to the above description will be omitted, and the difference with respect to the above description will be mainly explained.

Referring to FIG. 14, the cavity 200 completely penetrates the insulating layer 100 in the thickness direction of the insulating layer 100, and the thickness of the plating layer 400 is substantially the same as the thickness of the insulating layer 100. The insulating post 300 is embedded within the plating layer 400. The upper and lower surfaces of the insulating post 300 may be exposed by the cavity 200.

The electronic device 610 may be mounted on the insulating layer 100, and the electronic device 610 may be: (i) mounted in the insulating material 110 on the insulating layer 100, or (ii) mounted on the insulating material 110. FIG. 14 shows the case of (ii) in which the electronic device 610 is mounted on the insulating material 110. In both cases, the electronic device 610 and the plating layer 400 may be connected to each other by the heat dissipation via 800.

The heat dissipation through hole 800 is a through hole penetrating the insulating material 110 to connect the electronic device 610 and the plating layer 400 and is in contact with the electronic device 610 and the plating layer 400. The heat dissipation via 800 has a greater effect in transferring heat generated by the electronic device 610 to the plating layer 400 than in transmitting electrical signals. Therefore, the heat dissipation via 800 can have a larger volume than a general via formed in the circuit region. The heat dissipation via 800 may be formed in plurality, and the plurality of heat dissipation vias 800 are connected to a single pad, and in the case where the insulating material 100 is formed in plural, heat dissipation may be formed for each insulating material 110 The through holes 800, and the heat dissipation through holes 800 respectively formed at the different insulating materials 110 may overlap each other to form a stacked structure.

Referring to FIG. 15, the cavity 200 completely penetrates the insulating layer 100 in the thickness direction of the insulating layer 100, and the thickness of the plating layer 400 is substantially the same as the thickness of the insulating layer 100. The insulating post 300 is embedded within the plating layer 400. The upper and lower surfaces of the insulating post 300 may be exposed by the cavity 200. Further, the electronic device 620 is not mounted in the insulating layer 100 but is mounted on the insulating layer 100 and is disposed in contact with the plating layer 400.

Specifically, the printed circuit board is composed of a plurality of insulating layers 100 stacked one on another. Each of the plurality of insulating layers 100 includes a cavity 200 penetrating the insulating layer 100, and an insulating pillar 300 formed in the cavity 200 in such a manner that a side surface of the insulating pillar 300 is spaced apart from the insulating layer 100; The plating layer 400 is formed in a region of the cavity 200 other than the insulating pillar 300.

In this case, the electronic device 620 may be mounted on the plating layer 400 of the insulating layer 100 disposed at the outermost layer (the uppermost layer or the lowermost layer) of the plurality of insulating layers 100 and in contact with the plating layer 400, and the plating layers 400 respectively formed on the different insulating layers 100 may be stacked on each other to facilitate heat transfer. Although the insulating pillars 300 respectively formed on the different insulating layers 100 are also stacked as shown in FIG. 15, the present invention is not limited to the structure shown in FIG.

Although the present disclosure includes specific examples, it will be apparent to those skilled in the art that these examples can be made in various forms without departing from the spirit and scope of the scope of the claims. And changes in the details. The examples described herein are considered to be illustrative only and not limiting. Descriptions of features or aspects in each instance are considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in a different order and/or if the components in the system, architecture, device, or circuit are combined in a different manner and/or replaced with other components or equivalents thereof or by other components If it is supplemented by its equivalent form, a suitable result can be achieved. Therefore, the scope of the disclosure is not to be limited by the description, but is defined by the scope of the claims and its equivalents, and all modifications within the scope of the claims and their equivalents are Revealed.

100‧‧‧Insulation

110‧‧‧Insulation materials

200‧‧‧ first cavity

300‧‧‧Insulation column

400‧‧‧ plating layer

410‧‧‧Electroless plating

420‧‧‧Electroplating

500‧‧‧ second cavity

600, 610, 620‧‧‧ electronic devices

700‧‧‧Metal structure

800‧‧‧Heat through hole

A‧‧‧ plating inhibitor

A-A’, B-B’, C-C’, D-D’, F-F’‧‧‧ lines

Figure 1 shows a printed circuit board in accordance with one embodiment of the present invention.

Figure 2 is a cross-sectional view of the printed circuit board taken along line A-A' of Figure 1.

Figure 3 is a cross-sectional view of the printed circuit board taken along line B-B' of Figure 1.

4 through 10 illustrate a method of fabricating a printed circuit board in accordance with one embodiment of the present invention.

Figure 11 shows a printed circuit board in accordance with another embodiment of the present invention.

Figure 12 is a cross-sectional view of the printed circuit board taken along the line D-D' shown in Figure 11 .

Figure 13 is a cross-sectional view of the printed circuit board taken along the line F-F' shown in Figure 11 .

Figure 14 shows a printed circuit board in accordance with yet another embodiment of the present invention.

Figure 15 shows a printed circuit board in accordance with yet another embodiment of the present invention.

Claims (16)

A printed circuit board comprising: an insulating layer; a first cavity opened through a surface of the insulating layer; and an insulating pillar formed on the side surface of the insulating pillar separated from the insulating layer And a plating layer formed in a region of the first cavity other than the insulating pillar. The printed circuit board of claim 1, wherein the insulating post is made of the same material as the insulating layer. The printed circuit board of claim 1, wherein the insulating pillars are formed in plurality, and wherein the plurality of insulating pillars are disposed to be spaced apart from each other. The printed circuit board of claim 1, wherein the plating layer comprises: an electroless plating layer; and a plating layer formed on the electroless plating layer, wherein the electroless plating layer is formed on The side surface and the bottom surface of the first cavity and the side surface of the insulating pillar. The printed circuit board of claim 1, further comprising: a second cavity opened through the other surface of the insulating layer; and an electronic device mounted in the second cavity. The printed circuit board of claim 5, wherein the second cavity is in contact with the plating layer. The printed circuit board of claim 1, wherein the insulating column has a volume smaller than a volume of the plating layer. The printed circuit board according to claim 1, wherein the transverse section of the insulating pillar is a polygon having a plurality of vertices, and wherein a side surface of the insulating pillar is a curved concave toward an inner portion of the insulating pillar surface. The printed circuit board of claim 1, further comprising a metal structure formed on the plating layer. The printed circuit board according to claim 9, wherein the insulating pillar is formed in plurality, and wherein the metal structure is formed between the plurality of insulating pillars. The printed circuit board of claim 9, wherein the metal structure is made of the same metal as the metal constituting the plating layer. The printed circuit board of claim 1, further comprising: an insulating material laminated on one surface of the insulating layer; an electronic device mounted in the insulating material or on the insulating material; The heat dissipation through hole connects the electronic device and the plating layer to each other by penetrating the insulating material. The printed circuit board of claim 12, wherein the first cavity is opened through one surface or the other surface of the insulating layer, and wherein a thickness of the plating layer and the insulating layer are The thickness is the same. A printed circuit board comprising a plurality of insulating layers stacked one on another, wherein each of the insulating layers comprises: a cavity penetrating the insulating layer; an insulating pillar with a side surface of the insulating pillar A manner in which the insulating layers are separated is formed in the cavity; and a plating layer is formed in a region of the first cavity other than the insulating pillar. The printed circuit board of claim 14, further comprising an electronic device mounted on the plating layer of the insulating layer disposed at an outermost layer of the plurality of insulating layers And contacting the plating layer. The printed circuit board of claim 14, wherein the plating layers respectively formed on the different insulating layers are in contact with each other.