TWI763551B - 連接結構體、電路連接構件及接著劑組成物 - Google Patents

連接結構體、電路連接構件及接著劑組成物 Download PDF

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Publication number
TWI763551B
TWI763551B TW110124418A TW110124418A TWI763551B TW I763551 B TWI763551 B TW I763551B TW 110124418 A TW110124418 A TW 110124418A TW 110124418 A TW110124418 A TW 110124418A TW I763551 B TWI763551 B TW I763551B
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TW
Taiwan
Prior art keywords
circuit
adhesive composition
meth
connection member
thermal expansion
Prior art date
Application number
TW110124418A
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English (en)
Chinese (zh)
Other versions
TW202139310A (zh
Inventor
森尻智樹
久米雅英
田中勝
竹田津潤
Original Assignee
日商昭和電工材料股份有限公司
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Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202139310A publication Critical patent/TW202139310A/zh
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Publication of TWI763551B publication Critical patent/TWI763551B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110124418A 2016-10-11 2017-10-03 連接結構體、電路連接構件及接著劑組成物 TWI763551B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016200072 2016-10-11
JP2016-200072 2016-10-11

Publications (2)

Publication Number Publication Date
TW202139310A TW202139310A (zh) 2021-10-16
TWI763551B true TWI763551B (zh) 2022-05-01

Family

ID=61905421

Family Applications (2)

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TW106134143A TWI734841B (zh) 2016-10-11 2017-10-03 連接結構體、電路連接構件及接著劑組成物
TW110124418A TWI763551B (zh) 2016-10-11 2017-10-03 連接結構體、電路連接構件及接著劑組成物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW106134143A TWI734841B (zh) 2016-10-11 2017-10-03 連接結構體、電路連接構件及接著劑組成物

Country Status (5)

Country Link
JP (1) JP7006610B2 (ko)
KR (3) KR20240014613A (ko)
CN (3) CN113571926A (ko)
TW (2) TWI734841B (ko)
WO (1) WO2018070208A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7419697B2 (ja) * 2019-08-01 2024-01-23 株式会社オートネットワーク技術研究所 ワイヤーハーネス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323959A (ja) * 1989-06-22 1991-01-31 Mitsubishi Electric Corp Ｌｅｄアレイプリントヘッド
US5552092A (en) * 1994-05-31 1996-09-03 Corning Incorporated Waveguide coupler

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08315885A (ja) * 1995-05-16 1996-11-29 Hitachi Chem Co Ltd 回路接続材料
US5783867A (en) * 1995-11-06 1998-07-21 Ford Motor Company Repairable flip-chip undercoating assembly and method and material for same
JP4151081B2 (ja) * 1997-03-07 2008-09-17 日立化成工業株式会社 回路部材接続用接着剤
JP2003017149A (ja) * 2001-06-29 2003-01-17 Matsushita Electric Ind Co Ltd 電気接続部材とそれを用いた電気部品
JP3858740B2 (ja) 2002-03-27 2006-12-20 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
JP4649815B2 (ja) 2002-03-27 2011-03-16 日立化成工業株式会社 回路接続用接着剤組成物及びそれを用いた回路接続構造体
CN102796486B (zh) * 2005-03-16 2014-04-16 日立化成株式会社 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置
US7790276B2 (en) * 2006-03-31 2010-09-07 E. I. Du Pont De Nemours And Company Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
WO2009116618A1 (ja) * 2008-03-21 2009-09-24 積水化学工業株式会社 硬化性組成物、異方性導電材料及び接続構造体
JP5387592B2 (ja) * 2011-02-07 2014-01-15 日立化成株式会社 回路接続材料、及び回路部材の接続構造の製造方法
JP5934528B2 (ja) 2012-03-12 2016-06-15 デクセリアルズ株式会社 回路接続材料、及びそれを用いた実装体の製造方法
JP6065407B2 (ja) * 2012-04-27 2017-01-25 日立化成株式会社 回路接続材料、フィルム状回路接続材料、回路接続シート、回路接続体及び回路部材の接続方法
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0323959A (ja) * 1989-06-22 1991-01-31 Mitsubishi Electric Corp Ｌｅｄアレイプリントヘッド
US5552092A (en) * 1994-05-31 1996-09-03 Corning Incorporated Waveguide coupler

Also Published As

Publication number Publication date
CN113571926A (zh) 2021-10-29
KR20190058614A (ko) 2019-05-29
KR20240014613A (ko) 2024-02-01
TWI734841B (zh) 2021-08-01
KR20220107095A (ko) 2022-08-01
CN109804508B (zh) 2021-08-03
JPWO2018070208A1 (ja) 2019-08-08
TW202139310A (zh) 2021-10-16
CN109804508A (zh) 2019-05-24
WO2018070208A1 (ja) 2018-04-19
TW201816904A (zh) 2018-05-01
CN113555703A (zh) 2021-10-26
JP7006610B2 (ja) 2022-01-24
KR102467385B1 (ko) 2022-11-14

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